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Hexion Bakelite™ PF 51 Phenolic Formaldehyde Resin, Special Preparation Cylindrical Pellets  (discontinued **)

Category Polymer , Thermoset , Filled/Reinforced Thermoset , Phenolic
Manufacturer
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Hexion Bakelite™ PF 51 Phenolic Formaldehyde Resin, Special Preparation Cylindrical Pellets  (discontinued **).pdf
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Material Notes:
Phenolic molding compound, organically filled, reinforced with cotton fibers, increased notched impact strength, standardized molding compound.Application areas: Contact support power switch, switch covers, magnetic switches, pulleys, tension/deflection pulleys, covers, hand wheels.Information provided by Bakelite AGBakelite AG became a part of Hexion in 2005.
Physical Properties Metric English Comments
Density 1.41 g/cc
0.0509 lb/in³
ISO 1183
Apparent Bulk Density 0.600 g/cc
0.0217 lb/in³
ISO 60
Linear Mold Shrinkage, Flow 0.0035 cm/cm
0.0035 in/in
Compression molding; ISO 2577
Mechanical Properties Metric English Comments
Ball Indentation Hardness 300 MPa
43500 psi
H 961/30; ISO 2039/P1
Flexural Strength 85.0 MPa
12300 psi
2 mm/min; ISO 178
Flexural Modulus 7.50 GPa
1090 ksi
ISO 178
Charpy Impact Unnotched 0.650 J/cm²

@Temperature 23.0 °C
3.09 ft-lb/in²

@Temperature 73.4 °F
ISO 179-1/2 eU
Charpy Impact, Notched 0.270 J/cm²

@Temperature 23.0 °C
1.28 ft-lb/in²

@Temperature 73.4 °F
ISO 179-1/2 eA
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 130 °C
266 °F
<20000 hours; IEC 60216-P1
160 °C
320 °F
< 50 hours; IEC 60216-P1
Deflection Temperature at 8.0 MPa 115 °C
239 °F
ISO 75-2
Shrinkage 0.500 %

@Temperature 110 °C
0.500 %

@Temperature 230 °F
Compression molding; ISO 2577
Electrical Properties Metric English Comments
Volume Resistivity 1.00e+11 ohm-cm
1.00e+11 ohm-cm
IEC 60093
Surface Resistance 1.00e+10 ohm
1.00e+10 ohm
IEC 60093
Dielectric Constant 15

@Frequency 100 Hz
15

@Frequency 100 Hz
IEC 60250
Dielectric Strength 10.0 kV/mm

@Thickness 1.00 mm
254 kV/in

@Thickness 0.0394 in
IEC 60243-P1
Dissipation Factor 0.30

@Frequency 100 Hz
0.30

@Frequency 100 Hz
IEC 60250
Comparative Tracking Index 125 V
125 V
Test liquid A; IEC 60112
Processing Properties Metric English Comments
Feed Temperature 60.0 - 75.0 °C
140 - 167 °F
Injection molding
Nozzle Temperature 80.0 - 100 °C
176 - 212 °F
Injection molding
Melt Temperature 80.0 - 100 °C
176 - 212 °F
Injection molding
Mold Temperature 160 - 190 °C
320 - 374 °F
Injection molding
160 - 190 °C
320 - 374 °F
Compression molding
Injection Pressure >= 15.0 MPa
>= 2180 psi
Compression and injection cavity mold pressure
Back Pressure 0.500 - 2.00 MPa
72.5 - 290 psi
Injection molding
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Per 1 mm of wall thickness, injection molding
0.333 - 0.667 min
0.00556 - 0.0111 hour
Per 1 mm of wall thickness, compression molding
Descriptive Properties Value Comments
Chromatic Spectrum Subdued Colors
Creep Rupture Strength Good
Holding Pressure Approximately 40-60% of injection pressure
Media Resistance Good
Moisture Absorption 100 mg
ISO 62, 24 hours at 23°C
Reserves by Peak Temperature High
Thermal Expansion Slight
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