Processing Properties | Metric | English | Comments |
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Cure Time | 0.250 - 0.667 min | 0.00417 - 0.0111 hour | On Steel (Fixture) |
ND Industries 331 Surface Insensitive Instant Superglue Medium-high viscosity for difficult to bond surfaces |
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Cure Time | 0.250 - 0.667 min | 0.00417 - 0.0111 hour | On Steel (Fixture) |
ND Industries 360 Surface Insensitive Instant Superglue General DescriptionA medium viscosity, general purpose cyanoacrylate which is also surface sensitive. Can handle a wide array of materials which include wood, cork, leather, stone and plastics, in .. |
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Cure Time | 0.250 - 0.667 min | 0.00417 - 0.0111 hour | On Steel (Fixture) |
ND Industries SuperGlue Ethyl 395 General DescriptionA low viscosity ethyl-based cyanoacrylate that exhibits fast cure speeds on a wide range of common materials such as metals, rubbers, and plastics.Typical Usesloudspeaker componen.. |
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Cure Time | 0.333 - 0.667 min | 0.00556 - 0.0111 hour | On Steel (Fixture) |
ND Industries SuperGlue Methyl 330 Low-Medium Viscosity - General purpose metal surfaceMeets military spec Mil-A-46050C Type I Class II |
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Cure Time | 0.500 - 0.667 min | 0.00833 - 0.0111 hour | Zinc, handling time |
Permabond 940 Cyanoacrylate, low odor PERMABOND 940 is a low odor, non-fogging non-frosting alkoxyethyl cyanoacrylate. The reduced odor improves worker comfort. Unsightly fogging adjacent to bondlines, common with other cyanoacrylate ad.. |
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Cure Time | 0.333 - 0.667 min | 0.00556 - 0.0111 hour | Per 1 mm of wall thickness, compression molding |
Hexion Bakelite™ PF 13 Phenolic Formaldehyde Resin, UL Listed
(discontinued **) Phenolic molding compound, inorganically mica filled, heat resistance, good electrical properties, UL listed molding compound 0.75 mm/V-1 (NC), 3 mm/V-0, standardized molding compound.Application ar.. |
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Cure Time | 0.333 - 0.667 min | 0.00556 - 0.0111 hour | Per 1 mm of wall thickness, compression molding |
Hexion Bakelite™ PF 31 Phenolic Formaldehyde Resin, UL Listed
(discontinued **) Phenolic molding compound, mainly organically filled, standard molding compound for normal stress, UL listed molding compound 1.5 mm/V-1 (All), 3 mm/V-0 (All), standardized molding compound.Applicat.. |
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Cure Time | 0.333 - 0.667 min | 0.00556 - 0.0111 hour | Per 1 mm of wall thickness, compression molding |
Hexion Bakelite™ PF 84 Phenolic Formaldehyde Resin, Special Preparation Cylindrical Pellets, High Mechanical Strength
& Phenolic molding compound, organically filled, reinforced with cotton fibers, increased notched impact strength, standardized molding compound.Application areas: Contact support power switch, moldin.. |
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Cure Time | 0.333 - 0.667 min | 0.00556 - 0.0111 hour | Per 1 mm of wall thickness, compression molding |
Hexion Bakelite™ PF 1141 Phenolic Formaldehyde Resin, High Surface Quality, Resistant to High Temperatures, Dishwasher Proof Phenolic molding compound, inorganically/organically filled, glass fiber reinforced, increased heat resistance, hot steam and hot water resistant (not suitable for use of higher voltage).Application.. |
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Cure Time | 0.333 - 0.667 min | 0.00556 - 0.0111 hour | Per 1 mm of wall thickness, compression molding |
Hexion Bakelite™ PF 2137 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof
(discontinued ** Phenolic molding compound, inorganically/organically filled, glass fiber reinforced, increased heat resistance, minimal distortion, dish washer proof.Application areas: Iron heat shields, fittings f.. |
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Cure Time | 0.333 - 0.667 min | 0.00556 - 0.0111 hour | Per 1 mm of wall thickness, compression molding |
Hexion Bakelite™ PF 6506 Phenolic Formaldehyde Resin, Low Shrinkage, Resistant to High Temperatures, UL Listed
&nbs Phenolic molding compound, inorganically filled, glass fiber reinforced, high dimensional stability at raised temperature, good media resistance, heat-resistant, UL listed molding compound 1.5 mm/V-.. |
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Cure Time | 0.333 - 0.667 min | 0.00556 - 0.0111 hour | Per 1 mm of wall thickness, compression molding |
Hexion Bakelite™ PF 7400 Phenolic Formaldehyde Resin, High Mechanical Strength
(discontinued **) Phenolic molding compound, organically filled, reinforced with cotton fiber flakes, high notched impact strength.Application areas: Moldings for higher mechanical strain, e.g. power plugs high volta.. |
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Cure Time | 0.333 - 0.667 min | 0.00556 - 0.0111 hour | Per 1 mm of wall thickness, compression molding |
Hexion Bakelite™ PF 12404 Phenolic Formaldehyde Resin, High Surface Quality, Low Shrinkage
(discontinued **)& Phenolic molding compound, inorganically/organically filled, good dimensional stability, low shrinkage.Application areas: Housing parts for gas meter.Information provided by Bak AGBak AG became a pa.. |
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Cure Time | 0.333 - 0.667 min | 0.00556 - 0.0111 hour | Per 1 mm of wall thickness, compression molding |
Hexion Bakelite™ PF 14600 Phenolic Formaldehyde Resin, High Surface Quality
(discontinued **) Phenolic molding compound, mainly organically filled, low specific gravity.Application areas: Cookware fittings, electric devices.Information provided by Bak AGBak AG became a part of Hexion in 2005.. |
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Cure Time | 0.333 - 0.667 min | 0.00556 - 0.0111 hour | Per 1 mm of wall thickness, compression molding |
Hexion Bakelite™ PF 14694 Phenolic Formaldehyde Resin, High Surface Quality
(discontinued **) Phenolic molding compound, mainly organically filled, very soft flow for large molds.Application areas: Housing parts, heat shields, cookware fittings.Information provided by Bak AGBak AG became a p.. |
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Cure Time | 0.333 - 0.667 min | 0.00556 - 0.0111 hour | Per 1 mm of wall thickness, compression molding |
Hexion Bakelite™ PF 38110 Phenolic Formaldehyde Resin, High Surface Quality
(discontinued **) Phenolic molding compound, mainly organically filled.Application areas: Devices for the electrical installation, pan handles, knobs, mainly for compression molding.Information provided by Bak AGBak .. |
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Cure Time | 0.333 - 0.667 min | 0.00556 - 0.0111 hour | Per 1 mm of wall thickness, compression molding |
Hexion Bakelite™ 151733 Phenolic Formaldehyde Resin
(discontinued **) Phenolic molding compound, mainly organically filled, standard molding compound for normal stress.Application areas: Contact strips.Information provided by Bak AGBak AG became a part of Hexion in 20.. |
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Cure Time | 0.333 - 0.667 min | 0.00556 - 0.0111 hour | Per 1 mm of wall thickness, compression molding |
Hexion Bakelite™ 460124 Phenolic Formaldehyde Resin
(discontinued **) Phenolic molding compound, mainly organically filled, standard molding compound for normal stress.Application areas: Cookware fittings, electric devices.Information provided by Bak AGBak AG became a.. |
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Cure Time | 0.333 - 0.667 min | 0.00556 - 0.0111 hour | Per 1 mm of wall thickness, compression molding |
Hexion Bakelite™ X24 Phenolic Formaldehyde Resin
(discontinued **) Phenolic molding compound, mainly organically filled.Application areas: Operating controls, housing parts, lamp holders.Information provided by Bak AGBak AG became a part of Hexion in 2005. |
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Cure Time | 0.333 - 0.667 min | 0.00556 - 0.0111 hour | Per 1 mm of wall thickness, compression molding |
Hexion Bakelite™ X30 Phenolic Formaldehyde Resin
(discontinued **) Phenolic molding compound, reinforced with cotton and sisal fibers, increased notched impact strength.Application areas: Covers for electrical and electromagnetic devices.Information provided by Bak.. |
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Cure Time | 0.417 - 0.667 min | 0.00694 - 0.0111 hour | Metal set time |
Lord Adhesives 9010 Medium Viscosity, Odorless, Non-Frosting Methoxyethyl Cyanoacrylate Adhesive Lord Cyanoacrylate AdhesivesLord® Cyanoacrylate Adhesives were developed for production situations requiring instant bonds and immediate handling strength, particularly when bonding rubber, metal.. |
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Cure Time | 0.333 - 0.667 min | 0.00556 - 0.0111 hour | Per 1 mm of wall thickness, compression molding |
Hexion UP 802 Unsaturated Polyester Resin, High Surface Quality, Low Shrinkage, High Arc Resistance Polyester molding compound, inorganically filled, glass fiber reinforced, styrene free, high dimensional stability, very slight post shrinkage, good mechanical properties, increased electrical value.. |
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Cure Time | 0.500 - 0.667 min | 0.00833 - 0.0111 hour | Fixture Rate |
Dymax Magnet Bonder™ 2020 Adhesive DYMAX® Magnet Bonder™ Adhesives for Higher Performance and Lower CostDymax 2020 Magnet Bonder™ AdhesiveAcrylic and methacrylic acid-free; bond ferrite to metal, plated metals, E-coat, sealed cans.. |
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Cure Time | 0.417 - 0.667 min | 0.00694 - 0.0111 hour | per mm |
Amity Thermosets ATS 131 Phenolic Molding Organic and graphite Filler, Compression Molded Characteristics:Self lubricating ( graphite modified )Good glide propertiesGood sealing propertiesMedium or low mechanical strengthUnsuitable for electrical applicationGlossy surfaceThermal conducti.. |
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Cure Time | 0.500 - 0.667 min | 0.00833 - 0.0111 hour | Zinc, handling time |
Permabond 941 Cyanoacrylate, low odor PERMABOND 941 is a low odor, non-fogging non-frosting alkoxyethyl cyanoacrylate. The reduced odor improves worker comfort. Unsightly fogging adjacent to bondlines, common with other cyanoacrylate ad.. |
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Cure Time | 0.333 - 0.667 min | 0.00556 - 0.0111 hour | Per 1 mm of wall thickness, compression molding |
Hexion Bakelite™ PF 6501 Phenolic Formaldehyde Resin, Low Shrinkage Phenolic molding compound, inorganically filled, glass fiber reinforced, high dimensional stability at raised temperature, good media resistance, heat-resistant.Application areas: Thermally and dyna.. |
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Cure Time | 0.333 - 0.667 min | 0.00556 - 0.0111 hour | Per 1 mm of wall thickness, compression molding |
Hexion Bakelite™ PF 7595 Phenolic Formaldehyde Resin, Low Coefficient of Friction, Galvanized, Conductive
(di Phenolic molding compound, inorganically/organically filled, modified with graphite, good heat conductivity, good sliding properties, conductive in electrical properties.Application areas: Bearers f.. |
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Cure Time | 0.333 - 0.667 min | 0.00556 - 0.0111 hour | Per 1 mm of wall thickness, compression molding |
Hexion Bakelite™ PF 8052 Phenolic Formaldehyde Resin, Resistant to High Temperatures
(discontinued **) Phenolic molding compound, glass fiber reinforced and inorganically filled. Excellent heat resistance with respect to surface finish and mechanical properties.Application areas: Pan handles, heat r.. |
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Cure Time | 0.333 - 0.667 min | 0.00556 - 0.0111 hour | Per 1 mm of wall thickness, compression molding |
Hexion Bakelite™ PF 2855 Phenolic Formaldehyde Resin, High Surface Quality, Low Shrinkage, For Electrostatic Coating, Dishwasher Proof, UL Listed Phenolic molding compound, inorganically/organically filled, heat resistant up to 250°C, hot steam and hot water resistant, high surface quality, for electrostatic coating, UL listed molding compou.. |
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Cure Time | 0.333 - 0.667 min | 0.00556 - 0.0111 hour | Per 1 mm of wall thickness, compression molding |
Hexion Bakelite™ PF 4155 Phenolic Formaldehyde Resin, Resistant to High Temperatures, Improved Electrical Properties, Low Shrinkage, High Mechanical Strength Phenolic molding compound, inorganically filled, glass fiber reinforced, good media and temperature resistance. Conditioned Cu-adhesion.Application areas: Commutators (fuel pumps, actuators, starte.. |