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Polymer Property : Nozzle Temperature = 176 °F Product List

Processing Properties

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Processing Properties Metric English Comments
Nozzle Temperature 80.0 - 100 °C
176 - 212 °F
Injection molding
Hexion Bakelite™ MP 4165 Melamine Phenolic Resin, Copper Adhesive, Low Shrinkage, High Mechanical Strength  (d
Melamine/phenolic molding compound, inorganically filled, glass fiber reinforced, good temperature stability, high level of mechanical properties, copper adhesive, flammability UL 94/V-0/1.6 mm (not..
Nozzle Temperature 80.0 - 100 °C
176 - 212 °F
Injection molding
Hexion Bakelite™ PF 13 Phenolic Formaldehyde Resin, UL Listed  (discontinued **)
Phenolic molding compound, inorganically mica filled, heat resistance, good electrical properties, UL listed molding compound 0.75 mm/V-1 (NC), 3 mm/V-0, standardized molding compound.Application ar..
Nozzle Temperature 80.0 - 100 °C
176 - 212 °F
Injection molding
Hexion Bakelite™ PF 31.5 Phenolic Formaldehyde Resin, Improved Electrical Properties  (discontinued **)
Phenolic molding compound, mainly organically filled, electrically high grade, standardized molding compound.Application areas: Parts for electrical and telecommunications technology, car electronic..
Nozzle Temperature 80.0 - 100 °C
176 - 212 °F
Injection molding
Hexion Bakelite™ PF 31.9 Phenolic Formaldehyde Resin, Ammonia Free  (discontinued **)
Phenolic molding compound, mainly organically filled, ammonia free, standardized molding compound.Application areas: Parts for electrical and telecommunications technology, motor vehicle ignition sy..
Nozzle Temperature 80.0 - 100 °C
176 - 212 °F
Injection molding
Hexion Bakelite™ PF 84 Phenolic Formaldehyde Resin, Special Preparation Cylindrical Pellets, High Mechanical Strength &
Phenolic molding compound, organically filled, reinforced with cotton fibers, increased notched impact strength, standardized molding compound.Application areas: Contact support power switch, moldin..
Nozzle Temperature 80.0 - 100 °C
176 - 212 °F
Injection molding
Hexion Bakelite™ PF 1141 Phenolic Formaldehyde Resin, High Surface Quality, Resistant to High Temperatures, Dishwasher Proof
Phenolic molding compound, inorganically/organically filled, glass fiber reinforced, increased heat resistance, hot steam and hot water resistant (not suitable for use of higher voltage).Application..
Nozzle Temperature 80.0 - 100 °C
176 - 212 °F
Injection molding
Hexion Bakelite™ PF 2137 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof  (discontinued **
Phenolic molding compound, inorganically/organically filled, glass fiber reinforced, increased heat resistance, minimal distortion, dish washer proof.Application areas: Iron heat shields, fittings f..
Nozzle Temperature 80.0 - 100 °C
176 - 212 °F
Injection molding
Hexion Bakelite™ PF 2400 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof, UL Listed  (disc
Phenolic molding compound, inorganically/organically filled, average heat resistance, increased dimensional stability, dish washer proof, UL listed molding compound 1.5 mm/V-0 (ALL).Application area..
Nozzle Temperature 80.0 - 100 °C
176 - 212 °F
Injection molding
Hexion Bakelite™ PF 2535 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof  (discontinued **
Phenolic molding compound, inorganically/organically filled, average heat resistant, steam resistant, dish washer proof, high surface quality.Application areas: Fittings for ovens and dishwashers, t..
Nozzle Temperature 80.0 - 100 °C
176 - 212 °F
Injection molding
Hexion Bakelite™ PF 2736 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage, UL Listed &nbs
Phenolic molding compound, inorganically/organically filled, increased tracking resistance, UL listed molding compound 0.46 mm/V-0 (BK, Suffix "H"), 0.81 mm/V-0 (NC, GN, BK), 1.5 mm/V-0 (ALL).Applic..
Nozzle Temperature 80.0 - 100 °C
176 - 212 °F
Injection molding
Hexion Bakelite™ PF 2774 Phenolic Formaldehyde Resin, Dishwasher Proof, Improved Electrical Properties, Low Shrinkage, UL Listed
Phenolic molding compound, inorganically filled, glass fiber reinforced, increased dimensional stability, averaged notched impact strength, average heat resistance, improved electrical properties, U..
Nozzle Temperature 80.0 - 100 °C
176 - 212 °F
Injection molding
Hexion Bakelite™ PF 4109 Phenolic Formaldehyde Resin, Improved Electrical Properties, Ammonia Free, Resistant to High Temperatures, Low Shrinkage, High Arc Resistance, UL Listed, Acetic Acid Free
Phenolic molding compound, inorganically filled, glass fiber reinforced, ammonia and acetic acid free, electrically high grade, high temperature stability, low shrinkage, high mechanical strength, U..
Nozzle Temperature 80.0 - 100 °C
176 - 212 °F
Injection molding
Hexion Bakelite™ PF 6506 Phenolic Formaldehyde Resin, Low Shrinkage, Resistant to High Temperatures, UL Listed &nbs
Phenolic molding compound, inorganically filled, glass fiber reinforced, high dimensional stability at raised temperature, good media resistance, heat-resistant, UL listed molding compound 1.5 mm/V-..
Nozzle Temperature 80.0 - 100 °C
176 - 212 °F
Injection molding
Hexion Bakelite™ PF 6507 Phenolic Formaldehyde Resin, Elasticized, Low Shrinkage, Resistant to High Temperatures, High Mechanical Strength
Phenolic molding compound, inorganically filled, glass fiber reinforced, elastomer modified, galvanizable, heat resistant, good media resistance, high dimensional stability at raised temperature, hi..
Nozzle Temperature 80.0 - 100 °C
176 - 212 °F
Injection molding
Hexion Bakelite™ PF 7400 Phenolic Formaldehyde Resin, High Mechanical Strength  (discontinued **)
Phenolic molding compound, organically filled, reinforced with cotton fiber flakes, high notched impact strength.Application areas: Moldings for higher mechanical strain, e.g. power plugs high volta..
Nozzle Temperature 80.0 - 100 °C
176 - 212 °F
Injection molding
Hexion Bakelite™ PF 7592 Phenolic Formaldehyde Resin, Galvanized, Conductive  (discontinued **)
Phenolic molding compound, inorganically/organically filled. Shrinkage fies compatible to values of UP 3310 and PF 2560. Electroplateable.Application areas: Chromium plated oven strips.Information..
Nozzle Temperature 80.0 - 100 °C
176 - 212 °F
Injection molding
Hexion Bakelite™ PF 12404 Phenolic Formaldehyde Resin, High Surface Quality, Low Shrinkage  (discontinued **)&
Phenolic molding compound, inorganically/organically filled, good dimensional stability, low shrinkage.Application areas: Housing parts for gas meter.Information provided by Bak AGBak AG became a pa..
Nozzle Temperature 80.0 - 100 °C
176 - 212 °F
Injection molding
Hexion Bakelite™ PF 38110 Phenolic Formaldehyde Resin, High Surface Quality  (discontinued **)
Phenolic molding compound, mainly organically filled.Application areas: Devices for the electrical installation, pan handles, knobs, mainly for compression molding.Information provided by Bak AGBak ..
Nozzle Temperature 80.0 - 100 °C
176 - 212 °F
Injection molding
Hexion Bakelite™ X22 Phenolic Formaldehyde Resin, UL Listed  (discontinued **)
Phenolic molding compound, mainly organically filled, UL listed molding compound 3.0 mm/V-0 (BN, BK).Application areas: Pot handles, operating controls, electrical isolators, housing parts.Informati..
Nozzle Temperature 80.0 - 100 °C
176 - 212 °F
Injection molding
Hexion Bakelite™ X24 Phenolic Formaldehyde Resin  (discontinued **)
Phenolic molding compound, mainly organically filled.Application areas: Operating controls, housing parts, lamp holders.Information provided by Bak AGBak AG became a part of Hexion in 2005.
Nozzle Temperature 80.0 - 100 °C
176 - 212 °F
Injection molding
Hexion Bakelite™ X30 Phenolic Formaldehyde Resin  (discontinued **)
Phenolic molding compound, reinforced with cotton and sisal fibers, increased notched impact strength.Application areas: Covers for electrical and electromagnetic devices.Information provided by Bak..
Nozzle Temperature 80.0 - 100 °C
176 - 212 °F
Injection molding
Hexion Bakelite™ X65 Phenolic Formaldehyde Resin, UL Listed  (discontinued **)
Phenolic molding compound, inorganically/organically filled, good heat-resistance and dimensional stability, UL listed molding compound 3.0 mm/V-0 (BN, BK).Application areas: Oven strips.Information..
Nozzle Temperature 80.0 - 100 °C
176 - 212 °F
Injection molding
Hexion Bakelite™ PF 2874 Phenolic Formaldehyde Resin, Low Shrinkage, Improved Electrical Properties, UL Listed, High Mechanical Strength
Phenolic molding compound, inorganically filled, glass fiber reinforced, increased mechanical strength, increased temperature stability, low water absorption, good dimensional stability, UL listed m..
Nozzle Temperature 80.0 - 100 °C
176 - 212 °F
Injection molding
Hexion Bakelite™ PF 6501 Phenolic Formaldehyde Resin, Low Shrinkage
Phenolic molding compound, inorganically filled, glass fiber reinforced, high dimensional stability at raised temperature, good media resistance, heat-resistant.Application areas: Thermally and dyna..
Nozzle Temperature 80.0 - 100 °C
176 - 212 °F
Injection molding
Hexion Bakelite™ PF 4010 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage  (disconti
Glass fiber reinforced and inorganically filled molding compound. High heat resistance, reduced molding shrinkage, good chemical resistance and mechanical properties.Application areas: Switch housi..
Nozzle Temperature 80.0 - 100 °C
176 - 212 °F
Injection molding
Hexion Bakelite™ PF 7595 Phenolic Formaldehyde Resin, Low Coefficient of Friction, Galvanized, Conductive  (di
Phenolic molding compound, inorganically/organically filled, modified with graphite, good heat conductivity, good sliding properties, conductive in electrical properties.Application areas: Bearers f..
Nozzle Temperature 80.0 - 100 °C
176 - 212 °F
Injection molding
Hexion Bakelite™ PF 2560 Phenolic Formaldehyde Resin, High Surface Quality, For Electrostatic Coating, UL Listed &n
Phenolic molding compound, inorganically/organically filled, average heat resistant, high surface quality, lower water absorption than PF 31, minimal distortion, UL listed molding compound 1.5 mm/V-..
Nozzle Temperature 80.0 - 100 °C
176 - 212 °F
Injection molding
Hexion Bakelite™ PF 2855 Phenolic Formaldehyde Resin, High Surface Quality, Low Shrinkage, For Electrostatic Coating, Dishwasher Proof, UL Listed
Phenolic molding compound, inorganically/organically filled, heat resistant up to 250°C, hot steam and hot water resistant, high surface quality, for electrostatic coating, UL listed molding compou..
Nozzle Temperature 80.0 - 100 °C
176 - 212 °F
Injection molding
Hexion Bakelite™ PF 4155 Phenolic Formaldehyde Resin, Resistant to High Temperatures, Improved Electrical Properties, Low Shrinkage, High Mechanical Strength
Phenolic molding compound, inorganically filled, glass fiber reinforced, good media and temperature resistance. Conditioned Cu-adhesion.Application areas: Commutators (fuel pumps, actuators, starte..
Nozzle Temperature 80.0 - 100 °C
176 - 212 °F
Injection molding
Hexion Bakelite™ PF 4260 Phenolic Formaldehyde Resin, Resistant to High Temperatures, Improved Electrical Properties, Low Shrinkage, High Mechanical Strength
Phenolic molding compound, inorganically filled, glass fiber reinforced, high dimensional stability at raised temperature, good media resistance, heat-resistantApplication areas: Commutators (starte..
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