Polymer Property : Melt Temperature = 100 °C Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Melt Temperature	90.0 - 100 °C	194 - 212 °F	Injection molding
Hexion Bakelite™ EP 8414 Epoxy Resin, High Arc Resistance, Improved Electrical Properties, Low Shrinkage (dis Epoxy molding compound, inorganically filled, glass fiber reinforced, highly heat resistant, good electrical even at higher temperatures, very slight post shrinkage, increased media resistance, UL l..
Melt Temperature	80.0 - 100 °C	176 - 212 °F	Injection molding
Hexion Bakelite™ PF 51 Phenolic Formaldehyde Resin, Special Preparation Cylindrical Pellets (discontinued **) Phenolic molding compound, organically filled, reinforced with cotton fibers, increased notched impact strength, standardized molding compound.Application areas: Contact support power switch, switch..
Melt Temperature	80.0 - 100 °C	176 - 212 °F	Injection molding
Hexion Bakelite™ PF 84 Phenolic Formaldehyde Resin, Special Preparation Cylindrical Pellets, High Mechanical Strength & Phenolic molding compound, organically filled, reinforced with cotton fibers, increased notched impact strength, standardized molding compound.Application areas: Contact support power switch, moldin..
Melt Temperature	80.0 - 100 °C	176 - 212 °F	Injection molding
Hexion Bakelite™ PF 85 Phenolic Formaldehyde Resin, UL Listed (discontinued **) Phenolic molding compound, organically filled, reinforced with cotton fibers, average notched impact strength, UL listed molding compound 1.5 mm/HB (BK, BN).Application areas: Switch covers, rolls, ..
Melt Temperature	80.0 - 100 °C	176 - 212 °F	Injection molding
Hexion Bakelite™ PF 1107 Phenolic Formaldehyde Resin, Low Shrinkage, Resistant to High Temperatures (disconti Phenolic molding compound, inorganically filled, glass fiber reinforced, high heat resistance, low heat expansion coefficient, highest resistance to pressure, high dimensional stability.Application ..
Melt Temperature	80.0 - 100 °C	176 - 212 °F	Injection molding
Hexion Bakelite™ PF 1141 Phenolic Formaldehyde Resin, High Surface Quality, Resistant to High Temperatures, Dishwasher Proof Phenolic molding compound, inorganically/organically filled, glass fiber reinforced, increased heat resistance, hot steam and hot water resistant (not suitable for use of higher voltage).Application..
Melt Temperature	80.0 - 100 °C	176 - 212 °F	Injection molding
Hexion Bakelite™ PF 2137 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof (discontinued ** Phenolic molding compound, inorganically/organically filled, glass fiber reinforced, increased heat resistance, minimal distortion, dish washer proof.Application areas: Iron heat shields, fittings f..
Melt Temperature	80.0 - 100 °C	176 - 212 °F	Injection molding
Hexion Bakelite™ PF 2400 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof, UL Listed (disc Phenolic molding compound, inorganically/organically filled, average heat resistance, increased dimensional stability, dish washer proof, UL listed molding compound 1.5 mm/V-0 (ALL).Application area..
Melt Temperature	80.0 - 100 °C	176 - 212 °F	Injection molding
Hexion Bakelite™ PF 2535 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof (discontinued ** Phenolic molding compound, inorganically/organically filled, average heat resistant, steam resistant, dish washer proof, high surface quality.Application areas: Fittings for ovens and dishwashers, t..
Melt Temperature	80.0 - 100 °C	176 - 212 °F	Injection molding
Hexion Bakelite™ PF 2774 Phenolic Formaldehyde Resin, Dishwasher Proof, Improved Electrical Properties, Low Shrinkage, UL Listed Phenolic molding compound, inorganically filled, glass fiber reinforced, increased dimensional stability, averaged notched impact strength, average heat resistance, improved electrical properties, U..
Melt Temperature	80.0 - 100 °C	176 - 212 °F	Injection molding
Hexion Bakelite™ PF 4109 Phenolic Formaldehyde Resin, Improved Electrical Properties, Ammonia Free, Resistant to High Temperatures, Low Shrinkage, High Arc Resistance, UL Listed, Acetic Acid Free Phenolic molding compound, inorganically filled, glass fiber reinforced, ammonia and acetic acid free, electrically high grade, high temperature stability, low shrinkage, high mechanical strength, U..
Melt Temperature	80.0 - 100 °C	176 - 212 °F	Injection molding
Hexion Bakelite™ PF 6506 Phenolic Formaldehyde Resin, Low Shrinkage, Resistant to High Temperatures, UL Listed &nbs Phenolic molding compound, inorganically filled, glass fiber reinforced, high dimensional stability at raised temperature, good media resistance, heat-resistant, UL listed molding compound 1.5 mm/V-..
Melt Temperature	80.0 - 100 °C	176 - 212 °F	Injection molding
Hexion Bakelite™ PF 7400 Phenolic Formaldehyde Resin, High Mechanical Strength (discontinued **) Phenolic molding compound, organically filled, reinforced with cotton fiber flakes, high notched impact strength.Application areas: Moldings for higher mechanical strain, e.g. power plugs high volta..
Melt Temperature	80.0 - 100 °C	176 - 212 °F	Injection molding
Hexion Bakelite™ PF 13591 Phenolic Formaldehyde Resin, High Surface Quality, UL Listed (discontinued **) Phenolic molding compound, mainly organically filled, very soft flow for large molds, UL listed molding compound 1.5 mm/V-1 (BK), 3.0 mm/V-0 (BK).Application areas: Pan handles, various applications..
Melt Temperature	80.0 - 100 °C	176 - 212 °F	Injection molding
Hexion Bakelite™ PF 14600 Phenolic Formaldehyde Resin, High Surface Quality (discontinued **) Phenolic molding compound, mainly organically filled, low specific gravity.Application areas: Cookware fittings, electric devices.Information provided by Bak AGBak AG became a part of Hexion in 2005..
Melt Temperature	80.0 - 100 °C	176 - 212 °F	Injection molding
Hexion Bakelite™ PF 14694 Phenolic Formaldehyde Resin, High Surface Quality (discontinued **) Phenolic molding compound, mainly organically filled, very soft flow for large molds.Application areas: Housing parts, heat shields, cookware fittings.Information provided by Bak AGBak AG became a p..
Melt Temperature	80.0 - 100 °C	176 - 212 °F	Injection molding
Hexion Bakelite™ PF 38110 Phenolic Formaldehyde Resin, High Surface Quality (discontinued **) Phenolic molding compound, mainly organically filled.Application areas: Devices for the electrical installation, pan handles, knobs, mainly for compression molding.Information provided by Bak AGBak ..
Melt Temperature	80.0 - 100 °C	176 - 212 °F	Injection molding
Hexion Bakelite™ 460124 Phenolic Formaldehyde Resin (discontinued **) Phenolic molding compound, mainly organically filled, standard molding compound for normal stress.Application areas: Cookware fittings, electric devices.Information provided by Bak AGBak AG became a..
Melt Temperature	80.0 - 100 °C	176 - 212 °F	Injection molding
Hexion Bakelite™ X22 Phenolic Formaldehyde Resin, UL Listed (discontinued **) Phenolic molding compound, mainly organically filled, UL listed molding compound 3.0 mm/V-0 (BN, BK).Application areas: Pot handles, operating controls, electrical isolators, housing parts.Informati..
Melt Temperature	80.0 - 100 °C	176 - 212 °F	Injection molding
Hexion Bakelite™ X24 Phenolic Formaldehyde Resin (discontinued **) Phenolic molding compound, mainly organically filled.Application areas: Operating controls, housing parts, lamp holders.Information provided by Bak AGBak AG became a part of Hexion in 2005.
Melt Temperature	80.0 - 100 °C	176 - 212 °F	Injection molding
Hexion Bakelite™ X30 Phenolic Formaldehyde Resin (discontinued **) Phenolic molding compound, reinforced with cotton and sisal fibers, increased notched impact strength.Application areas: Covers for electrical and electromagnetic devices.Information provided by Bak..
Melt Temperature	80.0 - 100 °C	176 - 212 °F	Injection molding
Hexion Bakelite™ X65 Phenolic Formaldehyde Resin, UL Listed (discontinued **) Phenolic molding compound, inorganically/organically filled, good heat-resistance and dimensional stability, UL listed molding compound 3.0 mm/V-0 (BN, BK).Application areas: Oven strips.Information..
Melt Temperature	80.0 - 100 °C	176 - 212 °F	Injection molding
Hexion Bakelite™ PF 2874 Phenolic Formaldehyde Resin, Low Shrinkage, Improved Electrical Properties, UL Listed, High Mechanical Strength Phenolic molding compound, inorganically filled, glass fiber reinforced, increased mechanical strength, increased temperature stability, low water absorption, good dimensional stability, UL listed m..
Melt Temperature	80.0 - 100 °C	176 - 212 °F	Injection molding
Hexion Bakelite™ PF 6501 Phenolic Formaldehyde Resin, Low Shrinkage Phenolic molding compound, inorganically filled, glass fiber reinforced, high dimensional stability at raised temperature, good media resistance, heat-resistant.Application areas: Thermally and dyna..
Melt Temperature	80.0 - 100 °C	176 - 212 °F	Injection molding
Hexion Bakelite™ PF 4041 Phenolic Formaldehyde Resin, Resistant to High Temperatures (discontinued **) Phenolic molding compound, glass fiber reinforced and inorganically filled, elasticized. Very good heat resistance, very good mechanical properties, reduced mold shrinkage and post-shrinkage, good ..
Melt Temperature	80.0 - 100 °C	176 - 212 °F	Injection molding
Hexion Bakelite™ PF 7595 Phenolic Formaldehyde Resin, Low Coefficient of Friction, Galvanized, Conductive (di Phenolic molding compound, inorganically/organically filled, modified with graphite, good heat conductivity, good sliding properties, conductive in electrical properties.Application areas: Bearers f..
Melt Temperature	80.0 - 100 °C	176 - 212 °F	Injection molding
Hexion Bakelite™ PF 83 Phenolic Formaldehyde Resin, Special Preparation Cylindrical Pellets (discontinued **) Phenolic molding compound, organically filled, reinforced with cotton fibers, increased notched impact strength, standardized molding compound.Application areas: Switch covers, rolls, handle casings..
Melt Temperature	80.0 - 100 °C	176 - 212 °F	Injection molding
Hexion Bakelite™ PF 2836 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage, UL Listed &nbs Phenolic molding compound, inorganically/organically filled, increased heat resistance, increased tracking resistance, low shrinkage and post shrinkage, improved electrical properties, UL listed mol..
Melt Temperature	80.0 - 100 °C	176 - 212 °F	Injection molding
Hexion Bakelite™ PF 2855 Phenolic Formaldehyde Resin, High Surface Quality, Low Shrinkage, For Electrostatic Coating, Dishwasher Proof, UL Listed Phenolic molding compound, inorganically/organically filled, heat resistant up to 250°C, hot steam and hot water resistant, high surface quality, for electrostatic coating, UL listed molding compou..
Melt Temperature	80.0 - 100 °C	176 - 212 °F	Injection molding
Hexion Bakelite™ PF 4260 Phenolic Formaldehyde Resin, Resistant to High Temperatures, Improved Electrical Properties, Low Shrinkage, High Mechanical Strength Phenolic molding compound, inorganically filled, glass fiber reinforced, high dimensional stability at raised temperature, good media resistance, heat-resistantApplication areas: Commutators (starte..