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Polymer Property : Cure Time = 0.333 min Product List

Processing Properties

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Processing Properties Metric English Comments
Cure Time 0.333 - 0.667 min
0.00556 - 0.0111 hour
On Steel (Fixture)
ND Industries SuperGlue Ethyl 300
General DescriptionA medium to low viscosity cyanoacrylate which is used for bonding plastics and rubber in various combinations.Meets military spec Mil-A-46050C Type II Class II
Cure Time >= 0.333 min
>= 0.00556 hour
Fixture
Resinlab® CYNERGY CA6704 Adhesive
Description: The CYNERGY 6700 SERIES are modified to provide greatly reduced odor and a further reduction of bloom or frosting of plastics when compared to the 6600 Series. These products are ideal ..
Cure Time 0.333 - 1.00 min
0.00556 - 0.0167 hour
With Excel 600392 primer (Fixture)
ND Industries 240 Structural Adhesive
Excellent impact and solvent resistance
Cure Time 0.333 - 0.667 min
0.00556 - 0.0111 hour
Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ MP 4165 Melamine Phenolic Resin, Copper Adhesive, Low Shrinkage, High Mechanical Strength  (d
Melamine/phenolic molding compound, inorganically filled, glass fiber reinforced, good temperature stability, high level of mechanical properties, copper adhesive, flammability UL 94/V-0/1.6 mm (not..
Cure Time 0.333 - 0.667 min
0.00556 - 0.0111 hour
Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 84 Phenolic Formaldehyde Resin, Special Preparation Cylindrical Pellets, High Mechanical Strength &
Phenolic molding compound, organically filled, reinforced with cotton fibers, increased notched impact strength, standardized molding compound.Application areas: Contact support power switch, moldin..
Cure Time 0.333 - 0.667 min
0.00556 - 0.0111 hour
Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 1107 Phenolic Formaldehyde Resin, Low Shrinkage, Resistant to High Temperatures  (disconti
Phenolic molding compound, inorganically filled, glass fiber reinforced, high heat resistance, low heat expansion coefficient, highest resistance to pressure, high dimensional stability.Application ..
Cure Time 0.333 - 0.667 min
0.00556 - 0.0111 hour
Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 1141 Phenolic Formaldehyde Resin, High Surface Quality, Resistant to High Temperatures, Dishwasher Proof
Phenolic molding compound, inorganically/organically filled, glass fiber reinforced, increased heat resistance, hot steam and hot water resistant (not suitable for use of higher voltage).Application..
Cure Time 0.333 - 0.667 min
0.00556 - 0.0111 hour
Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 2137 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof  (discontinued **
Phenolic molding compound, inorganically/organically filled, glass fiber reinforced, increased heat resistance, minimal distortion, dish washer proof.Application areas: Iron heat shields, fittings f..
Cure Time 0.333 - 0.667 min
0.00556 - 0.0111 hour
Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 2400 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof, UL Listed  (disc
Phenolic molding compound, inorganically/organically filled, average heat resistance, increased dimensional stability, dish washer proof, UL listed molding compound 1.5 mm/V-0 (ALL).Application area..
Cure Time 0.333 - 0.667 min
0.00556 - 0.0111 hour
Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 6507 Phenolic Formaldehyde Resin, Elasticized, Low Shrinkage, Resistant to High Temperatures, High Mechanical Strength
Phenolic molding compound, inorganically filled, glass fiber reinforced, elastomer modified, galvanizable, heat resistant, good media resistance, high dimensional stability at raised temperature, hi..
Cure Time 0.333 - 0.667 min
0.00556 - 0.0111 hour
Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 7592 Phenolic Formaldehyde Resin, Galvanized, Conductive  (discontinued **)
Phenolic molding compound, inorganically/organically filled. Shrinkage fies compatible to values of UP 3310 and PF 2560. Electroplateable.Application areas: Chromium plated oven strips.Information..
Cure Time 0.333 - 0.667 min
0.00556 - 0.0111 hour
Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 12404 Phenolic Formaldehyde Resin, High Surface Quality, Low Shrinkage  (discontinued **)&
Phenolic molding compound, inorganically/organically filled, good dimensional stability, low shrinkage.Application areas: Housing parts for gas meter.Information provided by Bak AGBak AG became a pa..
Cure Time 0.333 - 0.667 min
0.00556 - 0.0111 hour
Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ X30 Phenolic Formaldehyde Resin  (discontinued **)
Phenolic molding compound, reinforced with cotton and sisal fibers, increased notched impact strength.Application areas: Covers for electrical and electromagnetic devices.Information provided by Bak..
Cure Time 0.333 - 0.667 min
0.00556 - 0.0111 hour
Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ X65 Phenolic Formaldehyde Resin, UL Listed  (discontinued **)
Phenolic molding compound, inorganically/organically filled, good heat-resistance and dimensional stability, UL listed molding compound 3.0 mm/V-0 (BN, BK).Application areas: Oven strips.Information..
Cure Time 0.333 - 0.417 min
0.00556 - 0.00694 hour
Metal set time
Lord Adhesives 7000 Medium Setting, Medium Viscosity, Moisture Resistant Methyl Cyanoacrylate Adhesive
Lord Cyanoacrylate AdhesivesLord® Cyanoacrylate Adhesives were developed for production situations requiring instant bonds and immediate handling strength, particularly when bonding rubber, metal..
Cure Time 0.333 min
0.00556 hour
Hot tack
Valley Adhesives EM-210 Low Temperature Application Glue Stick
Valley Adhesives EM-210 Low Temperature Application Glue StickMedium bonding range; bonds P.O.P. displays, paper, corrugated boxes, fabrics, furniture, upholstery, and other light weight heat sensit..
Cure Time 0.333 min
0.00556 hour
Primary Cure is UV: Full Cure in 20-40 seconds @ 150-300 mW/cm^2. Secondary Cure is Catalytic: Full Cure in more than 8 hours Pot life or 24 hours ambient.
Loctite® Shadowcure™ 394 Acrylic/urethane UV Coating
Conformal CoatingsConformal coatings are thin dielectric coatings that extend the longevity of circuit boards by protecting components and traces from corrosion, shorts, and mechanical damage. Locti..
Cure Time 0.333 - 0.500 min
0.00556 - 0.00833 hour
per mm
Amity Thermosets ATF 197 Phenolic Molding Inorganic and glass Filler, Compression Molded
Characteristics:Flame retardantSpark resistant Good electrical insulationHeat stability ( 200°C )Good mouldability Low water absorptionLow shrinkageColor-blackSoft/medium flow Applications:Switchg..
Cure Time 0.333 - 0.417 min
0.00556 - 0.00694 hour
per mm
Amity Thermosets ATM 123 Phenolic Molding Organic Filler, Compression Molded
Characteristics:Glossy surface free of filler marks Surface good & free of flaws Good mouldabilitySurface free of filler marks even after turningGood mechanical strengthColor-black, brownMedium flow..
Cure Time 0.333 - 0.500 min
0.00556 - 0.00833 hour
per mm
Amity Thermosets ATS 166 Phenolic Molding Chopped cotton fabric Filler, Compression Molded
Characteristics:High impact strengthGlossy surfaceLow shrinkageGood sliding propertiesColor-BlackMedium flowApplications:Cog wheelsCastor wheelsBush bearingsPulleysWelding rod handlesTextile bobbins..
Cure Time 0.333 - 1.17 min
0.00555 - 0.0195 hour
Time to Handling Strength
3M Scotch-Weld™ LO1000 Low Odor Instant Adhesive
3M™ Scotch-Weld™ Low-Odor Instant Adhesives are formulated to have low volatility while maintaining bonding of a wide rage of materials. Low volatility means that these products are not only low o..
Cure Time 0.333 - 0.417 min
0.00556 - 0.00694 hour
per mm
Amity Thermosets ATG 116 Phenolic Molding Organic and inorganic Filler, Compression Molded
Characteristics:Medium mechanical strength Medium electrical insulationGeneral purposeColor- BlackMedium flow Applications: Electrical accessories & fittings ( medium quality ) Domestic appliance ha..
Cure Time 0.333 - 0.417 min
0.00556 - 0.00694 hour
per mm
Amity Thermosets ATO 145 Phenolic Molding Organic Filler, Compression Molded
Characteristics:Electrical low loss Good mechanical strengthHigh electrical insulationGood mechanical strengthGlossy surfaceLow water absorptionColor-black, brownMedium flow Applications: Electric ..
Cure Time 0.333 - 0.667 min
0.00556 - 0.0111 hour
Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 4010 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage  (disconti
Glass fiber reinforced and inorganically filled molding compound. High heat resistance, reduced molding shrinkage, good chemical resistance and mechanical properties.Application areas: Switch housi..
Cure Time 0.333 - 0.667 min
0.00556 - 0.0111 hour
Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 4111 Phenolic Formaldehyde Resin, Improved Electrical Properties, Ammonia Free, Resistant to High Temperatures, Low Shrinkage, High Arc Resistance, UL Listed, Acetic Acid Free, Copper Adhesive
Phenolic molding compound, inorganically filled, glass fiber reinforced, ammonia and acetic acid free, electrically high grade, high temperature stability, high mechanical strength, copper-adhesive,..
Cure Time >= 0.333 min
>= 0.00556 hour
Fixture
Resinlab® CYNERGY CA6908 Adhesive
Description: The CYNERGY 6900 SERIES are for use in demanding applications where very fast cure speeds and high temperature resistance are required. These are single component solvent free materials..
Cure Time 0.333 - 0.667 min
0.00556 - 0.0111 hour
Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 1142 Phenolic Formaldehyde Resin, High Mechanical Strength  (discontinued **)
Phenolic molding compound, inorganically filled, glass fiber reinforced, high dimensional stability, good mechanical properties.Application areas: Insulating flanges, sealings, pulleys.Information p..
Cure Time 0.333 - 0.667 min
0.00556 - 0.0111 hour
Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 2836 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage, UL Listed &nbs
Phenolic molding compound, inorganically/organically filled, increased heat resistance, increased tracking resistance, low shrinkage and post shrinkage, improved electrical properties, UL listed mol..
Cure Time 0.333 - 0.667 min
0.00556 - 0.0111 hour
Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 2855 Phenolic Formaldehyde Resin, High Surface Quality, Low Shrinkage, For Electrostatic Coating, Dishwasher Proof, UL Listed
Phenolic molding compound, inorganically/organically filled, heat resistant up to 250°C, hot steam and hot water resistant, high surface quality, for electrostatic coating, UL listed molding compou..
Cure Time 0.333 - 0.667 min
0.00556 - 0.0111 hour
Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ PF 4260 Phenolic Formaldehyde Resin, Resistant to High Temperatures, Improved Electrical Properties, Low Shrinkage, High Mechanical Strength
Phenolic molding compound, inorganically filled, glass fiber reinforced, high dimensional stability at raised temperature, good media resistance, heat-resistantApplication areas: Commutators (starte..
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