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Polymer Property : Cure Time = 0.167 min Product List

Processing Properties

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Processing Properties Metric English Comments
Cure Time 0.167 - 0.500 min
0.00278 - 0.00833 hour
On Steel (Fixture)
ND Industries SuperGlue Ethyl 320
Very low viscosity for pre-assembled componentsMeets military spec Mil-A-46050C Type II Class I
Cure Time 0.167 - 0.250 min
0.00278 - 0.00417 hour
Phenolic, handling time
Permabond 2010 Cyanoacrylate, gap filling
PERMABOND 200 is a high viscosity product with good flow control useful in wire tacking applications or bonding components. It is fast setting and suitable for use on plastics, rubber and metals. Cy..
Cure Time 0.167 - 0.250 min
0.00278 - 0.00417 hour
Buna N Rubber, handling time
Permabond 735 Cyanoacrylate, toughened
PERMABOND® 735 is a toughened cyanoacrylate with very good impact and peel strength when compared to a conventional cyanoacrylate. It bonds rapidly at room temperature and its viscosity is stable o..
Cure Time 0.167 min
0.00278 hour
Steel, set time
Permabond 738 Cyanoacrylate, toughened
PERMABOND 738 is a toughened cyanoacrylate with improved impact and peel strength when compared to a conventional cyanoacrylate. It bonds rapidly at room temperature and its viscosity is stable over..
Cure Time 0.167 min
0.00278 hour
Phenolic, set time
Permabond 738 Cyanoacrylate, toughened
PERMABOND 738 is a toughened cyanoacrylate with improved impact and peel strength when compared to a conventional cyanoacrylate. It bonds rapidly at room temperature and its viscosity is stable over..
Cure Time >= 0.167 min
>= 0.00278 hour
Fixture
Resinlab® CYNERGY CA6104 Adhesive
Description: The CYNERGY 6100 SERIES products are used to bond metal to itself or other substrates. It is available in five standard viscosities.Application: The CYNERGY SERIES of the cyanoacrylates..
Cure Time 0.167 - 0.500 min
0.00278 - 0.00833 hour
zinc, Fixture time
Permabond TA4592 Toughened Acrylic Adhesive
PERMABOND® TA4592 is a two component structural acrylic adhesive ideal for bonding magnets and ferrites for electric motors on fast-moving production lines. Permabond® TA4592 provides high strengt..
Cure Time 0.167 min
0.00278 hour
Steel, set time
Permabond 265 Cyanoacrylate
PERMABOND 265 is a medium viscosity cyanoacrylate ideal for intermediate gap fill application. PERMABOND 265 provides faster set times and improved gap-filling capability compared to conventional cy..
Cure Time 0.167 - 0.250 min
0.00278 - 0.00417 hour
Phenolic, handling time
Permabond 801 Cyanoacrylate, High Temperature
PERMABOND® 801 is a low viscosity modified ethyl cyanoacrylate suitable for applications where high temperature resistance is required. This material is fast setting and has good adhesion to rubber..
Cure Time 0.167 - 0.250 min
0.00278 - 0.00417 hour
Phenolic, set time
Permabond 930 Cyanoacrylate
PERMABOND 930 is a low odor, non­fogging, non­frosting cyanoacrylate. Unsightly fogging adjacent to bondlines, common with other cyanoacrylate adhesives on hot and humid days, is eliminated. The ..
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Phenolic, set time
Permabond 931 Cyanoacrylate
PERMABOND 931 is a low odor, non­fogging, non­frosting cyanoacrylate. The reduced odor improves worker comfort. Unsightly fogging adjacent to bondlines, common with other cyanoacrylate adhesiv..
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ MP 4165 Melamine Phenolic Resin, Copper Adhesive, Low Shrinkage, High Mechanical Strength  (d
Melamine/phenolic molding compound, inorganically filled, glass fiber reinforced, good temperature stability, high level of mechanical properties, copper adhesive, flammability UL 94/V-0/1.6 mm (not..
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 13 Phenolic Formaldehyde Resin, UL Listed  (discontinued **)
Phenolic molding compound, inorganically mica filled, heat resistance, good electrical properties, UL listed molding compound 0.75 mm/V-1 (NC), 3 mm/V-0, standardized molding compound.Application ar..
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 31.5 Phenolic Formaldehyde Resin, Improved Electrical Properties  (discontinued **)
Phenolic molding compound, mainly organically filled, electrically high grade, standardized molding compound.Application areas: Parts for electrical and telecommunications technology, car electronic..
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 85 Phenolic Formaldehyde Resin, UL Listed  (discontinued **)
Phenolic molding compound, organically filled, reinforced with cotton fibers, average notched impact strength, UL listed molding compound 1.5 mm/HB (BK, BN).Application areas: Switch covers, rolls, ..
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 2137 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof  (discontinued **
Phenolic molding compound, inorganically/organically filled, glass fiber reinforced, increased heat resistance, minimal distortion, dish washer proof.Application areas: Iron heat shields, fittings f..
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 2535 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof  (discontinued **
Phenolic molding compound, inorganically/organically filled, average heat resistant, steam resistant, dish washer proof, high surface quality.Application areas: Fittings for ovens and dishwashers, t..
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ 460124 Phenolic Formaldehyde Resin  (discontinued **)
Phenolic molding compound, mainly organically filled, standard molding compound for normal stress.Application areas: Cookware fittings, electric devices.Information provided by Bakelite AGBakelite A..
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ X30 Phenolic Formaldehyde Resin  (discontinued **)
Phenolic molding compound, reinforced with cotton and sisal fibers, increased notched impact strength.Application areas: Covers for electrical and electromagnetic devices.Information provided by Bak..
Cure Time 0.167 - 0.500 min
0.00278 - 0.00833 hour
350-380nm
Tra-Con Tra-Bond 546S01 Low Viscosity UV Curable Adhesive
TRA-BOND 546S01 is a low viscosity UV curable adhesive with a secondary heat curing system to achieve a high Tg. It exhibits excellent adhesion to glass and many other substrates, making it ideal fo..
Cure Time <= 0.167 min
<= 0.00278 hour
Dymax 9-911 Strain Relief, Wire and Parts Tacking Adhesive
High Performance Light-Curing Adhesives and Coatings for Electronic AssemblyDymax 9-911 Strain Relief, Wire and Parts Tacking AdhesiveRapid, high strength, designed for difficult substrates, resists..
Cure Time 0.167 - 0.250 min
0.00278 - 0.00417 hour
Steel, handling time
Permabond 941 Cyanoacrylate, low odor
PERMABOND 941 is a low odor, non-fogging non-frosting alkoxyethyl cyanoacrylate. The reduced odor improves worker comfort. Unsightly fogging adjacent to bondlines, common with other cyanoacrylate ad..
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 4041 Phenolic Formaldehyde Resin, Resistant to High Temperatures  (discontinued **)
Phenolic molding compound, glass fiber reinforced and inorganically filled, elasticized. Very good heat resistance, very good mechanical properties, reduced mold shrinkage and post-shrinkage, good ..
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 4111 Phenolic Formaldehyde Resin, Improved Electrical Properties, Ammonia Free, Resistant to High Temperatures, Low Shrinkage, High Arc Resistance, UL Listed, Acetic Acid Free, Copper Adhesive
Phenolic molding compound, inorganically filled, glass fiber reinforced, ammonia and acetic acid free, electrically high grade, high temperature stability, high mechanical strength, copper-adhesive,..
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 8052 Phenolic Formaldehyde Resin, Resistant to High Temperatures  (discontinued **)
Phenolic molding compound, glass fiber reinforced and inorganically filled. Excellent heat resistance with respect to surface finish and mechanical properties.Application areas: Pan handles, heat r..
Cure Time 0.167 min
0.00278 hour
Buna N Rubber, set time
Permabond 262 Cyanoacrylate
PERMABOND 262 is a low viscosity cyanoacrylate ideal for wicking type application. PERMABOND 262 provides faster set times and improved gap-filling capability compared to conventional cyanoacrylates..
Cure Time 0.167 - 0.250 min
0.00278 - 0.00417 hour
Aluminum, handling time
Permabond 947 Cyanoacrylate, low odor
PERMABOND 947 is a low odor, non-fogging non-frosting alkoxyethyl cyanoacrylate. The reduced odor improves worker comfort. Unsightly fogging adjacent to bondlines, common with other cyanoacrylate ad..
Cure Time 0.167 - 0.250 min
0.00278 - 0.00417 hour
PVC, handling time
Permabond 947 Cyanoacrylate, low odor
PERMABOND 947 is a low odor, non-fogging non-frosting alkoxyethyl cyanoacrylate. The reduced odor improves worker comfort. Unsightly fogging adjacent to bondlines, common with other cyanoacrylate ad..
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 2560 Phenolic Formaldehyde Resin, High Surface Quality, For Electrostatic Coating, UL Listed &n
Phenolic molding compound, inorganically/organically filled, average heat resistant, high surface quality, lower water absorption than PF 31, minimal distortion, UL listed molding compound 1.5 mm/V-..
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 2836 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage, UL Listed &nbs
Phenolic molding compound, inorganically/organically filled, increased heat resistance, increased tracking resistance, low shrinkage and post shrinkage, improved electrical properties, UL listed mol..
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