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Polymer Property : Cure Time = 0.167 min Product List

Processing Properties

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Processing Properties Metric English Comments
Cure Time 0.167 - 0.250 min
0.00278 - 0.00417 hour
Steel, handling time
Permabond 105 Cyanoacrylate, for difficult rubbers
PERMABOND® 105 is a low viscosity high purity cyanoacrylate adhesive. It is ideal for use on hard-to-bond plastics and rubbers such as natural rubber, EPDM and butyl rubber. Cyanoacrylate adhesives..
Cure Time 0.167 min
0.00278 hour
Buna N Rubber, set time
Permabond 738 Cyanoacrylate, toughened
PERMABOND 738 is a toughened cyanoacrylate with improved impact and peel strength when compared to a conventional cyanoacrylate. It bonds rapidly at room temperature and its viscosity is stable over..
Cure Time >= 0.167 min
>= 0.00278 hour
Buna N Rubber, set time
Permabond QFS16 Cyanoacrylate Activator
The PERMABOND QFS 16 accelerates the cure of cyanoacrylate adhesives to provide a shorter set time. It can be used in a variety of applications but is especially useful when bonding porous or poorly..
Cure Time >= 0.167 min
>= 0.00278 hour
Fixture
Resinlab® CYNERGY CA6003 Adhesive
Description: The CYNERGY 6000 SERIES are for use in demanding applications where very fast cure speeds are required. These are single component solvent free materials manufactured in a wide variety..
Cure Time >= 0.167 min
>= 0.00278 hour
Fixture
Resinlab® CYNERGY CA6104 Adhesive
Description: The CYNERGY 6100 SERIES products are used to bond metal to itself or other substrates. It is available in five standard viscosities.Application: The CYNERGY SERIES of the cyanoacrylates..
Cure Time >= 0.167 min
>= 0.00278 hour
Fixture
Resinlab® CYNERGY CA6209 Adhesive
Description: The CYNERGY 6200 SERIES products are for use in demanding applications where very fast cure speeds are required. Also used when difficult to bond and acidic surfaces are used such as EP..
Cure Time >= 0.167 min
>= 0.00278 hour
Fixture
Resinlab® CYNERGY CA6401 Adhesive
Description: The CYNERGY 6400 SERIES are clear, highly toughened, high peel strength products ideal for bonding dissimilar materials with excellent performance on a wide range of surfaces. They impa..
Cure Time <= 0.167 min
<= 0.00278 hour
PET, fixture time, (low power 4mW lamp)
Permabond UV648 UV-curable Adhesive
PERMABOND UV648 is a UV-curing adhesive developed for use on plastics. It has good adhesion to acrylic and contains a long-wavelength photo initiator to allow it to cure through UV-stabilized plasti..
Cure Time 0.167 - 0.250 min
0.00278 - 0.00417 hour
Phenolic, handling time
Permabond 102 Cyanoacrylate, General purpose
PERMABOND® 102 is a low viscosity general purpose cyanoacrylate adhesive suitable for bonding close-fitting components. It is fast setting and suitable for use on plastics, rubber and metals. Cyano..
Cure Time 0.167 min
0.00278 hour
Phenolic, handling time
Permabond 108 Cyanoacrylate, gap filling
PERMABOND® 108 is an intermediate viscosity cyanoacrylate that is used to bond through intermediate gaps. It is fast setting and suitable for use on plastics, rubber and metals. Cyanoacrylate adhes..
Cure Time 0.167 - 0.250 min
0.00278 - 0.00417 hour
Phenolic, handling time
Permabond 802 Cyanoacrylate, High Temperature
PERMABOND® 802 is a low viscosity modified ethyl cyanoacrylate suitable for applications where high temperature resistance is required. This material is fast setting and has good adhesion to rubber..
Cure Time >= 0.167 min
>= 0.00278 hour
Fixture
Resinlab® CYNERGY CA6002 Adhesive
Description: The CYNERGY 6000 SERIES are for use in demanding applications where very fast cure speeds are required. These are single component solvent free materials manufactured in a wide variety..
Cure Time >= 0.167 min
>= 0.00278 hour
Fixture
Resinlab® CYNERGY CA6805 Adhesive
Description: The CYNERGY 6800 SERIES are clear, high strength products ideal for bonding dissimilar materials with excellent performance on a wide range of surfaces. This series of products has USP ..
Cure Time >= 0.167 min
>= 0.00278 hour
Fixture
Resinlab® CYNERGY CA6807 Adhesive
Description: The CYNERGY 6800 SERIES are clear, high strength products ideal for bonding dissimilar materials with excellent performance on a wide range of surfaces. This series of products has USP ..
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 13 Phenolic Formaldehyde Resin, UL Listed  (discontinued **)
Phenolic molding compound, inorganically mica filled, heat resistance, good electrical properties, UL listed molding compound 0.75 mm/V-1 (NC), 3 mm/V-0, standardized molding compound.Application ar..
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 84 Phenolic Formaldehyde Resin, Special Preparation Cylindrical Pellets, High Mechanical Strength &
Phenolic molding compound, organically filled, reinforced with cotton fibers, increased notched impact strength, standardized molding compound.Application areas: Contact support power switch, moldin..
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 2137 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof  (discontinued **
Phenolic molding compound, inorganically/organically filled, glass fiber reinforced, increased heat resistance, minimal distortion, dish washer proof.Application areas: Iron heat shields, fittings f..
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 2535 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof  (discontinued **
Phenolic molding compound, inorganically/organically filled, average heat resistant, steam resistant, dish washer proof, high surface quality.Application areas: Fittings for ovens and dishwashers, t..
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 14600 Phenolic Formaldehyde Resin, High Surface Quality  (discontinued **)
Phenolic molding compound, mainly organically filled, low specific gravity.Application areas: Cookware fittings, electric devices.Information provided by Bakelite AGBakelite AG became a part of Hexi..
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ X65 Phenolic Formaldehyde Resin, UL Listed  (discontinued **)
Phenolic molding compound, inorganically/organically filled, good heat-resistance and dimensional stability, UL listed molding compound 3.0 mm/V-0 (BN, BK).Application areas: Oven strips.Information..
Cure Time 0.167 - 0.250 min
0.00278 - 0.00417 hour
Steel, handling time
Permabond 941 Cyanoacrylate, low odor
PERMABOND 941 is a low odor, non-fogging non-frosting alkoxyethyl cyanoacrylate. The reduced odor improves worker comfort. Unsightly fogging adjacent to bondlines, common with other cyanoacrylate ad..
Cure Time 0.167 - 0.250 min
0.00278 - 0.00417 hour
PVC, handling time
Permabond 941 Cyanoacrylate, low odor
PERMABOND 941 is a low odor, non-fogging non-frosting alkoxyethyl cyanoacrylate. The reduced odor improves worker comfort. Unsightly fogging adjacent to bondlines, common with other cyanoacrylate ad..
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 6501 Phenolic Formaldehyde Resin, Low Shrinkage
Phenolic molding compound, inorganically filled, glass fiber reinforced, high dimensional stability at raised temperature, good media resistance, heat-resistant.Application areas: Thermally and dyna..
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 4111 Phenolic Formaldehyde Resin, Improved Electrical Properties, Ammonia Free, Resistant to High Temperatures, Low Shrinkage, High Arc Resistance, UL Listed, Acetic Acid Free, Copper Adhesive
Phenolic molding compound, inorganically filled, glass fiber reinforced, ammonia and acetic acid free, electrically high grade, high temperature stability, high mechanical strength, copper-adhesive,..
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 7595 Phenolic Formaldehyde Resin, Low Coefficient of Friction, Galvanized, Conductive  (di
Phenolic molding compound, inorganically/organically filled, modified with graphite, good heat conductivity, good sliding properties, conductive in electrical properties.Application areas: Bearers f..
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 8052 Phenolic Formaldehyde Resin, Resistant to High Temperatures  (discontinued **)
Phenolic molding compound, glass fiber reinforced and inorganically filled. Excellent heat resistance with respect to surface finish and mechanical properties.Application areas: Pan handles, heat r..
Cure Time 0.167 min
0.00278 hour
Buna N Rubber, set time
Permabond 262 Cyanoacrylate
PERMABOND 262 is a low viscosity cyanoacrylate ideal for wicking type application. PERMABOND 262 provides faster set times and improved gap-filling capability compared to conventional cyanoacrylates..
Cure Time 0.167 - 0.250 min
0.00278 - 0.00417 hour
PVC, handling time
Permabond 947 Cyanoacrylate, low odor
PERMABOND 947 is a low odor, non-fogging non-frosting alkoxyethyl cyanoacrylate. The reduced odor improves worker comfort. Unsightly fogging adjacent to bondlines, common with other cyanoacrylate ad..
Cure Time 0.167 - 0.250 min
0.00278 - 0.00417 hour
Phenolic resin, handling time
Permabond 947 Cyanoacrylate, low odor
PERMABOND 947 is a low odor, non-fogging non-frosting alkoxyethyl cyanoacrylate. The reduced odor improves worker comfort. Unsightly fogging adjacent to bondlines, common with other cyanoacrylate ad..
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 4260 Phenolic Formaldehyde Resin, Resistant to High Temperatures, Improved Electrical Properties, Low Shrinkage, High Mechanical Strength
Phenolic molding compound, inorganically filled, glass fiber reinforced, high dimensional stability at raised temperature, good media resistance, heat-resistantApplication areas: Commutators (starte..
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