Polymer Property : Cure Time = 0.00556 hour Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Cure Time	0.250 - 0.333 min	0.00417 - 0.00556 hour	Buna N Rubber, handling time
Permabond 731 Cyanoacrylate, toughened PERMABOND® 731 is a toughened cyanoacrylate with very good impact and peel strength when compared to a conventional cyanoacrylate. It bonds rapidly at room temperature and its viscosity is stable o..
Cure Time	0.250 - 0.333 min	0.00417 - 0.00556 hour	Phenolic, handling time
Permabond 240 Cyanoacrylate, gap filling PERMABOND® 240 is a high viscosity product useful in large gap applications. It is ideal for porous substrates. It is fast setting and suitable for use on plastics, rubber and metals. Cyanoacrylate..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Phenolic, set time
Permabond 935 Cyanoacrylate The PERMABOND 930 series is a family of low odor, non-fogging, non-frosting cyanoacrylates. The reduced odor improves worker comfort. Unsightly fogging adjacent to bondlines, common with other cyano..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 51 Phenolic Formaldehyde Resin, Special Preparation Cylindrical Pellets (discontinued **) Phenolic molding compound, organically filled, reinforced with cotton fibers, increased notched impact strength, standardized molding compound.Application areas: Contact support power switch, switch..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 1141 Phenolic Formaldehyde Resin, High Surface Quality, Resistant to High Temperatures, Dishwasher Proof Phenolic molding compound, inorganically/organically filled, glass fiber reinforced, increased heat resistance, hot steam and hot water resistant (not suitable for use of higher voltage).Application..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 2137 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof (discontinued ** Phenolic molding compound, inorganically/organically filled, glass fiber reinforced, increased heat resistance, minimal distortion, dish washer proof.Application areas: Iron heat shields, fittings f..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 2400 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof, UL Listed (disc Phenolic molding compound, inorganically/organically filled, average heat resistance, increased dimensional stability, dish washer proof, UL listed molding compound 1.5 mm/V-0 (ALL).Application area..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 2774 Phenolic Formaldehyde Resin, Dishwasher Proof, Improved Electrical Properties, Low Shrinkage, UL Listed Phenolic molding compound, inorganically filled, glass fiber reinforced, increased dimensional stability, averaged notched impact strength, average heat resistance, improved electrical properties, U..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 4109 Phenolic Formaldehyde Resin, Improved Electrical Properties, Ammonia Free, Resistant to High Temperatures, Low Shrinkage, High Arc Resistance, UL Listed, Acetic Acid Free Phenolic molding compound, inorganically filled, glass fiber reinforced, ammonia and acetic acid free, electrically high grade, high temperature stability, low shrinkage, high mechanical strength, U..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 7400 Phenolic Formaldehyde Resin, High Mechanical Strength (discontinued **) Phenolic molding compound, organically filled, reinforced with cotton fiber flakes, high notched impact strength.Application areas: Moldings for higher mechanical strain, e.g. power plugs high volta..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 7592 Phenolic Formaldehyde Resin, Galvanized, Conductive (discontinued **) Phenolic molding compound, inorganically/organically filled. Shrinkage fies compatible to values of UP 3310 and PF 2560. Electroplateable.Application areas: Chromium plated oven strips.Information..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 13591 Phenolic Formaldehyde Resin, High Surface Quality, UL Listed (discontinued **) Phenolic molding compound, mainly organically filled, very soft flow for large molds, UL listed molding compound 1.5 mm/V-1 (BK), 3.0 mm/V-0 (BK).Application areas: Pan handles, various applications..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 14600 Phenolic Formaldehyde Resin, High Surface Quality (discontinued **) Phenolic molding compound, mainly organically filled, low specific gravity.Application areas: Cookware fittings, electric devices.Information provided by Bak AGBak AG became a part of Hexion in 2005..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 14694 Phenolic Formaldehyde Resin, High Surface Quality (discontinued **) Phenolic molding compound, mainly organically filled, very soft flow for large molds.Application areas: Housing parts, heat shields, cookware fittings.Information provided by Bak AGBak AG became a p..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 38110 Phenolic Formaldehyde Resin, High Surface Quality (discontinued **) Phenolic molding compound, mainly organically filled.Application areas: Devices for the electrical installation, pan handles, knobs, mainly for compression molding.Information provided by Bak AGBak ..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ 151733 Phenolic Formaldehyde Resin (discontinued **) Phenolic molding compound, mainly organically filled, standard molding compound for normal stress.Application areas: Contact strips.Information provided by Bak AGBak AG became a part of Hexion in 20..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ 460124 Phenolic Formaldehyde Resin (discontinued **) Phenolic molding compound, mainly organically filled, standard molding compound for normal stress.Application areas: Cookware fittings, electric devices.Information provided by Bak AGBak AG became a..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ X65 Phenolic Formaldehyde Resin, UL Listed (discontinued **) Phenolic molding compound, inorganically/organically filled, good heat-resistance and dimensional stability, UL listed molding compound 3.0 mm/V-0 (BN, BK).Application areas: Oven strips.Information..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Value given for curing at 300 W/in; Optimum properties in 24 hrs.
Humiseal 1C61 UV Cure Conformal Coating Humiseal 1C61 UV Cure Conformal CoatingHigh temperature resistanceGood dielectrical propertiesGood moisture resistanceRepairableUL Approval PendingMIL-I-46058C Approval PendingPasses thermal shock t..
Cure Time	0.0833 - 0.333 min	0.00139 - 0.00556 hour	Rubber set time
Lord Adhesives 9010 Medium Viscosity, Odorless, Non-Frosting Methoxyethyl Cyanoacrylate Adhesive Lord Cyanoacrylate AdhesivesLordÂ® Cyanoacrylate Adhesives were developed for production situations requiring instant bonds and immediate handling strength, particularly when bonding rubber, metal..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion UP 802 Unsaturated Polyester Resin, High Surface Quality, Low Shrinkage, High Arc Resistance Polyester molding compound, inorganically filled, glass fiber reinforced, styrene free, high dimensional stability, very slight post shrinkage, good mechanical properties, increased electrical value..
Cure Time	0.200 - 0.333 min	0.00333 - 0.00556 hour	per mm
Amity Thermosets ATI 101 Phenolic Molding Organic Filler, Injection Molded Characteristics:Electrical low loss Good mechanical strengthHigh electrical insulationGood mechanical strengthGlossy surfaceLow water absorptionColor-blackVery soft flow Applications: Electric swit..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Cooling Time
Advanced Polymer Alloys DuraGrip™ DGR 6030 NC/BK Thermoplastic Elastomer (TPE) DuraGrip® DGR 6030 NC/BK are designed to be general purpose Thermoplastic Elastomers (TPE) that are easy to use in injection molding and extrusion processes. DGR 6030 NC/BK have an excellent soft t..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Cooling Time
Advanced Polymer Alloys DuraGrip™ DGR 6050 NC/BK Thermoplastic Elastomer (TPE) DuraGrip® DGR 6050 NC/BK are designed to be general purpose Thermoplastic Elastomers (TPE) that are easy to use in injection molding and extrusion processes. DGR 6050 NC/BK have an excellent soft t..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Cooling Time
Advanced Polymer Alloys DuraGrip™ DGR 6070 NC Thermoplastic Elastomer (TPE) DuraGrip® DGR 6070NC is designed to be a general purpose Thermoplastic Elastomer (TPE) that is easy to use in injection molding and extrusion processes. DGR 6070NC has an excellent soft touch feel,..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Cooling Time
Advanced Polymer Alloys DuraGrip™ DGR 6080 NC/BK Thermoplastic Elastomer (TPE) DuraGrip® DGR 6080NC/BK are designed to be a general purpose Thermoplastic Elastomers (TPE) that are easy to use in injection molding and extrusion processes. DGR 6080NC/BK have excellent soft touc..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 2874 Phenolic Formaldehyde Resin, Low Shrinkage, Improved Electrical Properties, UL Listed, High Mechanical Strength Phenolic molding compound, inorganically filled, glass fiber reinforced, increased mechanical strength, increased temperature stability, low water absorption, good dimensional stability, UL listed m..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 2560 Phenolic Formaldehyde Resin, High Surface Quality, For Electrostatic Coating, UL Listed &n Phenolic molding compound, inorganically/organically filled, average heat resistant, high surface quality, lower water absorption than PF 31, minimal distortion, UL listed molding compound 1.5 mm/V-..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 4155 Phenolic Formaldehyde Resin, Resistant to High Temperatures, Improved Electrical Properties, Low Shrinkage, High Mechanical Strength Phenolic molding compound, inorganically filled, glass fiber reinforced, good media and temperature resistance. Conditioned Cu-adhesion.Application areas: Commutators (fuel pumps, actuators, starte..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 4260 Phenolic Formaldehyde Resin, Resistant to High Temperatures, Improved Electrical Properties, Low Shrinkage, High Mechanical Strength Phenolic molding compound, inorganically filled, glass fiber reinforced, high dimensional stability at raised temperature, good media resistance, heat-resistantApplication areas: Commutators (starte..