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Polymer Property : Melt Temperature = 176 °F Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
| Hexion Bakelite™ MP 4165 Melamine Phenolic Resin, Copper Adhesive, Low Shrinkage, High Mechanical Strength
(d Melamine/phenolic molding compound, inorganically filled, glass fiber reinforced, good temperature stability, high level of mechanical properties, copper adhesive, flammability UL 94/V-0/1.6 mm (not.. |
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| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
| Hexion Bakelite™ PF 13 Phenolic Formaldehyde Resin, UL Listed
(discontinued **) Phenolic molding compound, inorganically mica filled, heat resistance, good electrical properties, UL listed molding compound 0.75 mm/V-1 (NC), 3 mm/V-0, standardized molding compound.Application ar.. |
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| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
| Hexion Bakelite™ PF 31 Phenolic Formaldehyde Resin, UL Listed
(discontinued **) Phenolic molding compound, mainly organically filled, standard molding compound for normal stress, UL listed molding compound 1.5 mm/V-1 (All), 3 mm/V-0 (All), standardized molding compound.Applicat.. |
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| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
| Hexion Bakelite™ PF 31.5 Phenolic Formaldehyde Resin, Improved Electrical Properties
(discontinued **) Phenolic molding compound, mainly organically filled, electrically high grade, standardized molding compound.Application areas: Parts for electrical and telecommunications technology, car electronic.. |
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| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
| Hexion Bakelite™ PF 31.9 Phenolic Formaldehyde Resin, Ammonia Free
(discontinued **) Phenolic molding compound, mainly organically filled, ammonia free, standardized molding compound.Application areas: Parts for electrical and telecommunications technology, motor vehicle ignition sy.. |
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| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
| Hexion Bakelite™ PF 2137 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof
(discontinued ** Phenolic molding compound, inorganically/organically filled, glass fiber reinforced, increased heat resistance, minimal distortion, dish washer proof.Application areas: Iron heat shields, fittings f.. |
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| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
| Hexion Bakelite™ PF 2400 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof, UL Listed
(disc Phenolic molding compound, inorganically/organically filled, average heat resistance, increased dimensional stability, dish washer proof, UL listed molding compound 1.5 mm/V-0 (ALL).Application area.. |
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| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
| Hexion Bakelite™ PF 2535 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof
(discontinued ** Phenolic molding compound, inorganically/organically filled, average heat resistant, steam resistant, dish washer proof, high surface quality.Application areas: Fittings for ovens and dishwashers, t.. |
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| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
| Hexion Bakelite™ PF 2736 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage, UL Listed
&nbs Phenolic molding compound, inorganically/organically filled, increased tracking resistance, UL listed molding compound 0.46 mm/V-0 (BK, Suffix "H"), 0.81 mm/V-0 (NC, GN, BK), 1.5 mm/V-0 (ALL).Applic.. |
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| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
| Hexion Bakelite™ PF 2774 Phenolic Formaldehyde Resin, Dishwasher Proof, Improved Electrical Properties, Low Shrinkage, UL Listed Phenolic molding compound, inorganically filled, glass fiber reinforced, increased dimensional stability, averaged notched impact strength, average heat resistance, improved electrical properties, U.. |
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| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
| Hexion Bakelite™ PF 4109 Phenolic Formaldehyde Resin, Improved Electrical Properties, Ammonia Free, Resistant to High Temperatures, Low Shrinkage, High Arc Resistance, UL Listed, Acetic Acid Free Phenolic molding compound, inorganically filled, glass fiber reinforced, ammonia and acetic acid free, electrically high grade, high temperature stability, low shrinkage, high mechanical strength, U.. |
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| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
| Hexion Bakelite™ PF 6506 Phenolic Formaldehyde Resin, Low Shrinkage, Resistant to High Temperatures, UL Listed
&nbs Phenolic molding compound, inorganically filled, glass fiber reinforced, high dimensional stability at raised temperature, good media resistance, heat-resistant, UL listed molding compound 1.5 mm/V-.. |
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| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
| Hexion Bakelite™ PF 6507 Phenolic Formaldehyde Resin, Elasticized, Low Shrinkage, Resistant to High Temperatures, High Mechanical Strength Phenolic molding compound, inorganically filled, glass fiber reinforced, elastomer modified, galvanizable, heat resistant, good media resistance, high dimensional stability at raised temperature, hi.. |
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| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
| Hexion Bakelite™ PF 7400 Phenolic Formaldehyde Resin, High Mechanical Strength
(discontinued **) Phenolic molding compound, organically filled, reinforced with cotton fiber flakes, high notched impact strength.Application areas: Moldings for higher mechanical strain, e.g. power plugs high volta.. |
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| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
| Hexion Bakelite™ PF 13591 Phenolic Formaldehyde Resin, High Surface Quality, UL Listed
(discontinued **) Phenolic molding compound, mainly organically filled, very soft flow for large molds, UL listed molding compound 1.5 mm/V-1 (BK), 3.0 mm/V-0 (BK).Application areas: Pan handles, various applications.. |
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| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
| Hexion Bakelite™ PF 14600 Phenolic Formaldehyde Resin, High Surface Quality
(discontinued **) Phenolic molding compound, mainly organically filled, low specific gravity.Application areas: Cookware fittings, electric devices.Information provided by Bak AGBak AG became a part of Hexion in 2005.. |
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| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
| Hexion Bakelite™ PF 14694 Phenolic Formaldehyde Resin, High Surface Quality
(discontinued **) Phenolic molding compound, mainly organically filled, very soft flow for large molds.Application areas: Housing parts, heat shields, cookware fittings.Information provided by Bak AGBak AG became a p.. |
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| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
| Hexion Bakelite™ PF 38110 Phenolic Formaldehyde Resin, High Surface Quality
(discontinued **) Phenolic molding compound, mainly organically filled.Application areas: Devices for the electrical installation, pan handles, knobs, mainly for compression molding.Information provided by Bak AGBak .. |
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| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
| Hexion Bakelite™ 460124 Phenolic Formaldehyde Resin
(discontinued **) Phenolic molding compound, mainly organically filled, standard molding compound for normal stress.Application areas: Cookware fittings, electric devices.Information provided by Bak AGBak AG became a.. |
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| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
| Hexion Bakelite™ X22 Phenolic Formaldehyde Resin, UL Listed
(discontinued **) Phenolic molding compound, mainly organically filled, UL listed molding compound 3.0 mm/V-0 (BN, BK).Application areas: Pot handles, operating controls, electrical isolators, housing parts.Informati.. |
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| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
| Hexion Bakelite™ X65 Phenolic Formaldehyde Resin, UL Listed
(discontinued **) Phenolic molding compound, inorganically/organically filled, good heat-resistance and dimensional stability, UL listed molding compound 3.0 mm/V-0 (BN, BK).Application areas: Oven strips.Information.. |
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| Melt Temperature | 80.0 - 140 °C | 176 - 284 °F | |
| Huntsman KRYSTALFLEX® PE 399 Polyurethane Optical Aliphatic Film Key Properties:Moisture ResistanceChemical CompatibilityCooler ProcessingHigher AdhesionMultiple Design OptionNo special storage requiredInformation provided by Alliance Polymers |
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| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
| Hexion Bakelite™ PF 2874 Phenolic Formaldehyde Resin, Low Shrinkage, Improved Electrical Properties, UL Listed, High Mechanical Strength Phenolic molding compound, inorganically filled, glass fiber reinforced, increased mechanical strength, increased temperature stability, low water absorption, good dimensional stability, UL listed m.. |
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| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
| Hexion Bakelite™ PF 6501 Phenolic Formaldehyde Resin, Low Shrinkage Phenolic molding compound, inorganically filled, glass fiber reinforced, high dimensional stability at raised temperature, good media resistance, heat-resistant.Application areas: Thermally and dyna.. |
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| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
| Hexion Bakelite™ PF 4010 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage
(disconti Glass fiber reinforced and inorganically filled molding compound. High heat resistance, reduced molding shrinkage, good chemical resistance and mechanical properties.Application areas: Switch housi.. |
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| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
| Hexion Bakelite™ PF 4111 Phenolic Formaldehyde Resin, Improved Electrical Properties, Ammonia Free, Resistant to High Temperatures, Low Shrinkage, High Arc Resistance, UL Listed, Acetic Acid Free, Copper Adhesive Phenolic molding compound, inorganically filled, glass fiber reinforced, ammonia and acetic acid free, electrically high grade, high temperature stability, high mechanical strength, copper-adhesive,.. |
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| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
| Hexion Bakelite™ PF 8052 Phenolic Formaldehyde Resin, Resistant to High Temperatures
(discontinued **) Phenolic molding compound, glass fiber reinforced and inorganically filled. Excellent heat resistance with respect to surface finish and mechanical properties.Application areas: Pan handles, heat r.. |
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| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
| Hexion Bakelite™ PF 2836 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage, UL Listed
&nbs Phenolic molding compound, inorganically/organically filled, increased heat resistance, increased tracking resistance, low shrinkage and post shrinkage, improved electrical properties, UL listed mol.. |
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| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
| Hexion Bakelite™ PF 2855 Phenolic Formaldehyde Resin, High Surface Quality, Low Shrinkage, For Electrostatic Coating, Dishwasher Proof, UL Listed Phenolic molding compound, inorganically/organically filled, heat resistant up to 250°C, hot steam and hot water resistant, high surface quality, for electrostatic coating, UL listed molding compou.. |
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| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
| Hexion Bakelite™ PF 4155 Phenolic Formaldehyde Resin, Resistant to High Temperatures, Improved Electrical Properties, Low Shrinkage, High Mechanical Strength Phenolic molding compound, inorganically filled, glass fiber reinforced, good media and temperature resistance. Conditioned Cu-adhesion.Application areas: Commutators (fuel pumps, actuators, starte.. |
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