Processing Properties | Metric | English | Comments |
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Cure Time | 0.167 - 0.250 min | 0.00278 - 0.00417 hour | Steel, handling time |
Permabond 2010 Cyanoacrylate, gap filling PERMABOND 200 is a high viscosity product with good flow control useful in wire tacking applications or bonding components. It is fast setting and suitable for use on plastics, rubber and metals. Cy.. |
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Cure Time | 0.167 min | 0.00278 hour | Buna N Rubber, set time |
Permabond 738 Cyanoacrylate, toughened PERMABOND 738 is a toughened cyanoacrylate with improved impact and peel strength when compared to a conventional cyanoacrylate. It bonds rapidly at room temperature and its viscosity is stable over.. |
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Cure Time | 0.167 min | 0.00278 hour | Phenolic, set time |
Permabond 738 Cyanoacrylate, toughened PERMABOND 738 is a toughened cyanoacrylate with improved impact and peel strength when compared to a conventional cyanoacrylate. It bonds rapidly at room temperature and its viscosity is stable over.. |
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Cure Time | 0.167 - 0.250 min | 0.00278 - 0.00417 hour | ABS, handling time |
Permabond 940 Cyanoacrylate, low odor PERMABOND 940 is a low odor, non-fogging non-frosting alkoxyethyl cyanoacrylate. The reduced odor improves worker comfort. Unsightly fogging adjacent to bondlines, common with other cyanoacrylate ad.. |
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Cure Time | >= 0.167 min | >= 0.00278 hour | Buna N Rubber, set time |
Permabond QFS10 Cyanoacrylate Activator The PERMABOND QFS 10 accelerates the cure of cyanoacrylate adhesives to provide a shorter set time. It can be used in a variety of applications but is especially useful when bonding porous or poorly.. |
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Cure Time | >= 0.167 min | >= 0.00278 hour | Buna N Rubber, set time |
Permabond QFS16 Cyanoacrylate Activator The PERMABOND QFS 16 accelerates the cure of cyanoacrylate adhesives to provide a shorter set time. It can be used in a variety of applications but is especially useful when bonding porous or poorly.. |
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Cure Time | >= 0.167 min | >= 0.00278 hour | Fixture |
Resinlab® CYNERGY CA6007 Adhesive Description: The CYNERGY 6000 SERIES are for use in demanding applications where very fast cure speeds are required. These are single component solvent free materials manufactured in a wide variety.. |
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Cure Time | >= 0.167 min | >= 0.00278 hour | Fixture |
Resinlab® CYNERGY CA6211 Adhesive Description: The CYNERGY 6200 SERIES products are for use in demanding applications where very fast cure speeds are required. Also used when difficult to bond and acidic surfaces are used such as EP.. |
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Cure Time | 0.167 - 0.250 min | 0.00278 - 0.00417 hour | Phenolic, handling time |
Permabond 920 Cyanoacrylate, High temperature PERMABOND® 920 is the original allyl cyanoacrylate adhesive. It is a single part, low viscosity liquid that will cure rapidly at room temperature when pressed into a thin film between parts. PERMAB.. |
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Cure Time | 0.167 - 0.333 min | 0.00278 - 0.00556 hour | Phenolic, set time |
Permabond 931 Cyanoacrylate PERMABOND 931 is a low odor, nonfogging, nonfrosting cyanoacrylate. The reduced odor improves worker comfort. Unsightly fogging adjacent to bondlines, common with other cyanoacrylate adhesiv.. |
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Cure Time | 0.167 - 0.333 min | 0.00278 - 0.00556 hour | Phenolic, set time |
Permabond 935 Cyanoacrylate The PERMABOND 930 series is a family of low odor, non-fogging, non-frosting cyanoacrylates. The reduced odor improves worker comfort. Unsightly fogging adjacent to bondlines, common with other cyano.. |
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Cure Time | >= 0.167 min | >= 0.00278 hour | Fixture |
Resinlab® CYNERGY CA6501 Adhesive Description: The CYNERGY 6500 SERIES are black, highly toughened, high peel strength products ideal for bonding dissimilar materials with excellent performance on a wide range of surfaces. They impa.. |
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Cure Time | 0.167 - 0.333 min | 0.00278 - 0.00556 hour | Per 1 mm of wall thickness, injection molding |
Hexion Bakelite™ PF 13 Phenolic Formaldehyde Resin, UL Listed
(discontinued **) Phenolic molding compound, inorganically mica filled, heat resistance, good electrical properties, UL listed molding compound 0.75 mm/V-1 (NC), 3 mm/V-0, standardized molding compound.Application ar.. |
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Cure Time | 0.167 - 0.333 min | 0.00278 - 0.00556 hour | Per 1 mm of wall thickness, injection molding |
Hexion Bakelite™ PF 31 Phenolic Formaldehyde Resin, UL Listed
(discontinued **) Phenolic molding compound, mainly organically filled, standard molding compound for normal stress, UL listed molding compound 1.5 mm/V-1 (All), 3 mm/V-0 (All), standardized molding compound.Applicat.. |
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Cure Time | 0.167 - 0.333 min | 0.00278 - 0.00556 hour | Per 1 mm of wall thickness, injection molding |
Hexion Bakelite™ PF 85 Phenolic Formaldehyde Resin, UL Listed
(discontinued **) Phenolic molding compound, organically filled, reinforced with cotton fibers, average notched impact strength, UL listed molding compound 1.5 mm/HB (BK, BN).Application areas: Switch covers, rolls, .. |
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Cure Time | 0.167 - 0.333 min | 0.00278 - 0.00556 hour | Per 1 mm of wall thickness, injection molding |
Hexion Bakelite™ PF 12404 Phenolic Formaldehyde Resin, High Surface Quality, Low Shrinkage
(discontinued **)& Phenolic molding compound, inorganically/organically filled, good dimensional stability, low shrinkage.Application areas: Housing parts for gas meter.Information provided by Bak AGBak AG became a pa.. |
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Cure Time | 0.167 - 0.333 min | 0.00278 - 0.00556 hour | Per 1 mm of wall thickness, injection molding |
Hexion Bakelite™ PF 14694 Phenolic Formaldehyde Resin, High Surface Quality
(discontinued **) Phenolic molding compound, mainly organically filled, very soft flow for large molds.Application areas: Housing parts, heat shields, cookware fittings.Information provided by Bak AGBak AG became a p.. |
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Cure Time | 0.167 - 0.333 min | 0.00278 - 0.00556 hour | Per 1 mm of wall thickness, injection molding |
Hexion Bakelite™ X24 Phenolic Formaldehyde Resin
(discontinued **) Phenolic molding compound, mainly organically filled.Application areas: Operating controls, housing parts, lamp holders.Information provided by Bak AGBak AG became a part of Hexion in 2005. |
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Cure Time | 0.167 - 0.333 min | 0.00278 - 0.00556 hour | Per 1 mm of wall thickness, injection molding |
Hexion Bakelite™ X30 Phenolic Formaldehyde Resin
(discontinued **) Phenolic molding compound, reinforced with cotton and sisal fibers, increased notched impact strength.Application areas: Covers for electrical and electromagnetic devices.Information provided by Bak.. |
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Cure Time | 0.167 - 0.500 min | 0.00278 - 0.00833 hour | 350-380nm |
Tra-Con Tra-Bond 546S01 Low Viscosity UV Curable Adhesive TRA-BOND 546S01 is a low viscosity UV curable adhesive with a secondary heat curing system to achieve a high Tg. It exhibits excellent adhesion to glass and many other substrates, making it ideal fo.. |
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Cure Time | 0.167 - 0.333 min | 0.00278 - 0.00556 hour | Cooling Time |
Advanced Polymer Alloys DuraGrip™ 6170 BK Melt Processable Elastomer DuraGrip™ 6170BK is designed to be a special purpose Melt Processable Elastomer (MPE) that is easy to use in injection molding and extrusion processes. DGR 6170BK has an excellent
soft touch feel a.. |
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Cure Time | 0.167 - 0.500 min | 0.00278 - 0.00833 hour | Time to Handling Strength |
3M Scotch-Weld™ EC40 General Purpose Instant Adhesive 3M™ Scotch-Weld™ General Purpose Instant Adhesives are single component, high strength ethyl cyanoacrylate adhesive designed to bond to a variety of substances including most plastics, rubbers, me.. |
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Cure Time | <= 0.167 min | <= 0.00278 hour | Buna N Rubber, handling time |
Permabond 910FS Cyanoacrylate, Methyl grade PERMABOND® 910FS is the original 100%-methyl cyanoacrylate adhesive. It is a single part, low viscosity liquid that will cure rapidly at room temperature when pressed into a thin film between parts.. |
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Cure Time | 0.167 - 0.250 min | 0.00278 - 0.00417 hour | Aluminum, handling time |
Permabond 941 Cyanoacrylate, low odor PERMABOND 941 is a low odor, non-fogging non-frosting alkoxyethyl cyanoacrylate. The reduced odor improves worker comfort. Unsightly fogging adjacent to bondlines, common with other cyanoacrylate ad.. |
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Cure Time | 0.167 - 0.250 min | 0.00278 - 0.00417 hour | ABS, handling time |
Permabond 941 Cyanoacrylate, low odor PERMABOND 941 is a low odor, non-fogging non-frosting alkoxyethyl cyanoacrylate. The reduced odor improves worker comfort. Unsightly fogging adjacent to bondlines, common with other cyanoacrylate ad.. |
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Cure Time | 0.167 min | 0.00278 hour | Steel, set time |
Permabond 262 Cyanoacrylate PERMABOND 262 is a low viscosity cyanoacrylate ideal for wicking type application. PERMABOND 262 provides faster set times and improved gap-filling capability compared to conventional cyanoacrylates.. |
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Cure Time | 0.167 - 0.250 min | 0.00278 - 0.00417 hour | Phenolic resin, handling time |
Permabond 947 Cyanoacrylate, low odor PERMABOND 947 is a low odor, non-fogging non-frosting alkoxyethyl cyanoacrylate. The reduced odor improves worker comfort. Unsightly fogging adjacent to bondlines, common with other cyanoacrylate ad.. |
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Cure Time | 0.167 - 0.333 min | 0.00278 - 0.00556 hour | Per 1 mm of wall thickness, injection molding |
Hexion Bakelite™ PF 2836 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage, UL Listed
&nbs Phenolic molding compound, inorganically/organically filled, increased heat resistance, increased tracking resistance, low shrinkage and post shrinkage, improved electrical properties, UL listed mol.. |
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Cure Time | 0.167 - 0.333 min | 0.00278 - 0.00556 hour | Per 1 mm of wall thickness, injection molding |
Hexion Bakelite™ PF 2855 Phenolic Formaldehyde Resin, High Surface Quality, Low Shrinkage, For Electrostatic Coating, Dishwasher Proof, UL Listed Phenolic molding compound, inorganically/organically filled, heat resistant up to 250°C, hot steam and hot water resistant, high surface quality, for electrostatic coating, UL listed molding compou.. |
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Cure Time | 0.167 - 0.333 min | 0.00278 - 0.00556 hour | Per 1 mm of wall thickness, injection molding |
Hexion Bakelite™ PF 4260 Phenolic Formaldehyde Resin, Resistant to High Temperatures, Improved Electrical Properties, Low Shrinkage, High Mechanical Strength Phenolic molding compound, inorganically filled, glass fiber reinforced, high dimensional stability at raised temperature, good media resistance, heat-resistantApplication areas: Commutators (starte.. |