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Polymer Property : Nozzle Temperature = 100 °C Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Nozzle Temperature | 70.0 - 100 °C | 158 - 212 °F | Injection molding |
| Hexion Bakelite™ EP 8414 Epoxy Resin, High Arc Resistance, Improved Electrical Properties, Low Shrinkage
(dis Epoxy molding compound, inorganically filled, glass fiber reinforced, highly heat resistant, good electrical even at higher temperatures, very slight post shrinkage, increased media resistance, UL l.. |
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| Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
| Hexion Bakelite™ MP 4165 Melamine Phenolic Resin, Copper Adhesive, Low Shrinkage, High Mechanical Strength
(d Melamine/phenolic molding compound, inorganically filled, glass fiber reinforced, good temperature stability, high level of mechanical properties, copper adhesive, flammability UL 94/V-0/1.6 mm (not.. |
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| Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
| Hexion Bakelite™ PF 31 Phenolic Formaldehyde Resin, UL Listed
(discontinued **) Phenolic molding compound, mainly organically filled, standard molding compound for normal stress, UL listed molding compound 1.5 mm/V-1 (All), 3 mm/V-0 (All), standardized molding compound.Applicat.. |
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| Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
| Hexion Bakelite™ PF 31.5 Phenolic Formaldehyde Resin, Improved Electrical Properties
(discontinued **) Phenolic molding compound, mainly organically filled, electrically high grade, standardized molding compound.Application areas: Parts for electrical and telecommunications technology, car electronic.. |
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| Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
| Hexion Bakelite™ PF 31.9 Phenolic Formaldehyde Resin, Ammonia Free
(discontinued **) Phenolic molding compound, mainly organically filled, ammonia free, standardized molding compound.Application areas: Parts for electrical and telecommunications technology, motor vehicle ignition sy.. |
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| Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
| Hexion Bakelite™ PF 85 Phenolic Formaldehyde Resin, UL Listed
(discontinued **) Phenolic molding compound, organically filled, reinforced with cotton fibers, average notched impact strength, UL listed molding compound 1.5 mm/HB (BK, BN).Application areas: Switch covers, rolls, .. |
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| Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
| Hexion Bakelite™ PF 1141 Phenolic Formaldehyde Resin, High Surface Quality, Resistant to High Temperatures, Dishwasher Proof Phenolic molding compound, inorganically/organically filled, glass fiber reinforced, increased heat resistance, hot steam and hot water resistant (not suitable for use of higher voltage).Application.. |
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| Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
| Hexion Bakelite™ PF 2535 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof
(discontinued ** Phenolic molding compound, inorganically/organically filled, average heat resistant, steam resistant, dish washer proof, high surface quality.Application areas: Fittings for ovens and dishwashers, t.. |
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| Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
| Hexion Bakelite™ PF 2736 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage, UL Listed
&nbs Phenolic molding compound, inorganically/organically filled, increased tracking resistance, UL listed molding compound 0.46 mm/V-0 (BK, Suffix "H"), 0.81 mm/V-0 (NC, GN, BK), 1.5 mm/V-0 (ALL).Applic.. |
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| Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
| Hexion Bakelite™ PF 2774 Phenolic Formaldehyde Resin, Dishwasher Proof, Improved Electrical Properties, Low Shrinkage, UL Listed Phenolic molding compound, inorganically filled, glass fiber reinforced, increased dimensional stability, averaged notched impact strength, average heat resistance, improved electrical properties, U.. |
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| Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
| Hexion Bakelite™ PF 4109 Phenolic Formaldehyde Resin, Improved Electrical Properties, Ammonia Free, Resistant to High Temperatures, Low Shrinkage, High Arc Resistance, UL Listed, Acetic Acid Free Phenolic molding compound, inorganically filled, glass fiber reinforced, ammonia and acetic acid free, electrically high grade, high temperature stability, low shrinkage, high mechanical strength, U.. |
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| Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
| Hexion Bakelite™ PF 6506 Phenolic Formaldehyde Resin, Low Shrinkage, Resistant to High Temperatures, UL Listed
&nbs Phenolic molding compound, inorganically filled, glass fiber reinforced, high dimensional stability at raised temperature, good media resistance, heat-resistant, UL listed molding compound 1.5 mm/V-.. |
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| Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
| Hexion Bakelite™ PF 6507 Phenolic Formaldehyde Resin, Elasticized, Low Shrinkage, Resistant to High Temperatures, High Mechanical Strength Phenolic molding compound, inorganically filled, glass fiber reinforced, elastomer modified, galvanizable, heat resistant, good media resistance, high dimensional stability at raised temperature, hi.. |
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| Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
| Hexion Bakelite™ PF 7400 Phenolic Formaldehyde Resin, High Mechanical Strength
(discontinued **) Phenolic molding compound, organically filled, reinforced with cotton fiber flakes, high notched impact strength.Application areas: Moldings for higher mechanical strain, e.g. power plugs high volta.. |
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| Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
| Hexion Bakelite™ PF 12404 Phenolic Formaldehyde Resin, High Surface Quality, Low Shrinkage
(discontinued **)& Phenolic molding compound, inorganically/organically filled, good dimensional stability, low shrinkage.Application areas: Housing parts for gas meter.Information provided by Bak AGBak AG became a pa.. |
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| Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
| Hexion Bakelite™ PF 13591 Phenolic Formaldehyde Resin, High Surface Quality, UL Listed
(discontinued **) Phenolic molding compound, mainly organically filled, very soft flow for large molds, UL listed molding compound 1.5 mm/V-1 (BK), 3.0 mm/V-0 (BK).Application areas: Pan handles, various applications.. |
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| Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
| Hexion Bakelite™ PF 14694 Phenolic Formaldehyde Resin, High Surface Quality
(discontinued **) Phenolic molding compound, mainly organically filled, very soft flow for large molds.Application areas: Housing parts, heat shields, cookware fittings.Information provided by Bak AGBak AG became a p.. |
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| Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
| Hexion Bakelite™ 151733 Phenolic Formaldehyde Resin
(discontinued **) Phenolic molding compound, mainly organically filled, standard molding compound for normal stress.Application areas: Contact strips.Information provided by Bak AGBak AG became a part of Hexion in 20.. |
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| Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
| Hexion Bakelite™ 460124 Phenolic Formaldehyde Resin
(discontinued **) Phenolic molding compound, mainly organically filled, standard molding compound for normal stress.Application areas: Cookware fittings, electric devices.Information provided by Bak AGBak AG became a.. |
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| Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
| Hexion Bakelite™ X22 Phenolic Formaldehyde Resin, UL Listed
(discontinued **) Phenolic molding compound, mainly organically filled, UL listed molding compound 3.0 mm/V-0 (BN, BK).Application areas: Pot handles, operating controls, electrical isolators, housing parts.Informati.. |
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| Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
| Hexion Bakelite™ X30 Phenolic Formaldehyde Resin
(discontinued **) Phenolic molding compound, reinforced with cotton and sisal fibers, increased notched impact strength.Application areas: Covers for electrical and electromagnetic devices.Information provided by Bak.. |
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| Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
| Hexion Bakelite™ X65 Phenolic Formaldehyde Resin, UL Listed
(discontinued **) Phenolic molding compound, inorganically/organically filled, good heat-resistance and dimensional stability, UL listed molding compound 3.0 mm/V-0 (BN, BK).Application areas: Oven strips.Information.. |
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| Nozzle Temperature | 70.0 - 100 °C | 158 - 212 °F | Injection molding |
| Hexion UP 802 Unsaturated Polyester Resin, High Surface Quality, Low Shrinkage, High Arc Resistance Polyester molding compound, inorganically filled, glass fiber reinforced, styrene free, high dimensional stability, very slight post shrinkage, good mechanical properties, increased electrical value.. |
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| Nozzle Temperature | 70.0 - 100 °C | 158 - 212 °F | Injection molding |
| Hexion Bakelite™ EP 8412 Epoxy Resin, High Arc Resistance, Improved Electrical Properties, Low Shrinkage Epoxy molding compound, inorganically filled, glass fiber reinforced, heat resistant, dimensionally stable, good electrical and mechanical properties, very good chemical resistance, low viscosity, U.. |
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| Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
| Hexion Bakelite™ PF 4041 Phenolic Formaldehyde Resin, Resistant to High Temperatures
(discontinued **) Phenolic molding compound, glass fiber reinforced and inorganically filled, elasticized. Very good heat resistance, very good mechanical properties, reduced mold shrinkage and post-shrinkage, good .. |
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| Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
| Hexion Bakelite™ PF 4111 Phenolic Formaldehyde Resin, Improved Electrical Properties, Ammonia Free, Resistant to High Temperatures, Low Shrinkage, High Arc Resistance, UL Listed, Acetic Acid Free, Copper Adhesive Phenolic molding compound, inorganically filled, glass fiber reinforced, ammonia and acetic acid free, electrically high grade, high temperature stability, high mechanical strength, copper-adhesive,.. |
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| Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
| Hexion Bakelite™ PF 8052 Phenolic Formaldehyde Resin, Resistant to High Temperatures
(discontinued **) Phenolic molding compound, glass fiber reinforced and inorganically filled. Excellent heat resistance with respect to surface finish and mechanical properties.Application areas: Pan handles, heat r.. |
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| Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
| Hexion Bakelite™ PF 2560 Phenolic Formaldehyde Resin, High Surface Quality, For Electrostatic Coating, UL Listed
&n Phenolic molding compound, inorganically/organically filled, average heat resistant, high surface quality, lower water absorption than PF 31, minimal distortion, UL listed molding compound 1.5 mm/V-.. |
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| Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
| Hexion Bakelite™ PF 2855 Phenolic Formaldehyde Resin, High Surface Quality, Low Shrinkage, For Electrostatic Coating, Dishwasher Proof, UL Listed Phenolic molding compound, inorganically/organically filled, heat resistant up to 250°C, hot steam and hot water resistant, high surface quality, for electrostatic coating, UL listed molding compou.. |
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| Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
| Hexion Bakelite™ PF 4260 Phenolic Formaldehyde Resin, Resistant to High Temperatures, Improved Electrical Properties, Low Shrinkage, High Mechanical Strength Phenolic molding compound, inorganically filled, glass fiber reinforced, high dimensional stability at raised temperature, good media resistance, heat-resistantApplication areas: Commutators (starte.. |
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