Polymer Property : Back Pressure = 0.500 MPa Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Back Pressure	0.500 - 1.50 MPa	72.5 - 218 psi
Polykemi AB POLYblend 65H MA5 PC/ABS-blend, Low Friction Information provided by Polykemi AB
Back Pressure	0.500 - 1.50 MPa	72.5 - 218 psi
Polykemi AB POLYblend 85FS UV PC/ABS-Blend, UV stabilized Information provided by Polykemi AB
Back Pressure	0.500 - 1.50 MPa	72.5 - 218 psi
Polykemi AB POLYelast TPE Z600A Thermoplastic Elastomer, SEBS-based, Co-injection Grade Information provided by Polykemi AB
Back Pressure	0.500 - 1.50 MPa	72.5 - 218 psi
Polykemi AB POLYelast TPE Z805P Thermoplastic Elastomer, SEBS-based Information provided by Polykemi AB
Back Pressure	0.500 - 1.50 MPa	72.5 - 218 psi
Polykemi AB POLYfill PP CIP15015 Polypropylene, Mineral Reinforced Information provided by Polykemi AB
Back Pressure	0.500 - 1.50 MPa	72.5 - 218 psi
Polykemi AB POLYfill PP CIP16020FCS Polypropylene, Fast Cycle Information provided by Polykemi AB
Back Pressure	0.500 MPa	72.5 psi
Celanese Celcon® GC25T POM, 25% Glass Reinforced (Unverified Data**) Celcon® GC25T is a 25% glass fiber coupled acetal copolymer grade. It offers higher strength than the standard Celcon GC25-A. Celcon GC25T is FDA approved. Celcon GC25T is also exceptionally resis..
Back Pressure	0.500 MPa	72.5 psi
Celanese Celcon® M90™ POM (Unverified Data**) Celcon acetal copolymer grade M90™ is a medium viscosity polymer providing optimum performance in general purpose injection molding and extrusion of thin walled tubing and thin gauge film. This gr..
Back Pressure	0.500 MPa	72.5 psi
Celanese Celcon® WR25Z POM, UV Resistant (Unverified Data**) Celcon® WR25Z is a 2.5 nominal melt flow rate based acetal copolymer stabilized to provide maximum ultraviolet radiation resistance in outdoor applications. Celcon® WR25Z is a lower flow product ..
Back Pressure	0.500 MPa	72.5 psi
Celanese Hostaform® C 9021 GV1/30 GT POM, 26% Tribological (Unverified Data**) Chemical abbreviation according to ISO 1043-1: POM26% glass fiber reinforced, specialty low wear grade based on UHMWPEInformation provided by Celanese
Back Pressure	0.500 MPa	72.5 psi
Celanese Hostaform® M15HP POM (Unverified Data**) Hostaform® acetal copolymer grade M15HP is a high viscosity polymerLow flow, high strength and stiffness, improved impactInformation provided by Celanese
Back Pressure	0.500 MPa	72.5 psi
Celanese Hostaform® M25AE POM (Unverified Data**) Hostaform® M25AE is a special grade of acetal copolymer targeted for extrusion shapes (rod, bar, plate, etc) free of center porosity in large diameters and thicknesses.Extrusion grade targeted for ..
Back Pressure	0.500 - 2.00 MPa	72.5 - 290 psi	Injection molding
Hexion Bakelite™ PF 31.5 Phenolic Formaldehyde Resin, Improved Electrical Properties (discontinued **) Phenolic molding compound, mainly organically filled, electrically high grade, standardized molding compound.Application areas: Parts for electrical and telecommunications technology, car electronic..
Back Pressure	0.500 - 2.00 MPa	72.5 - 290 psi	Injection molding
Hexion Bakelite™ PF 2400 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof, UL Listed (disc Phenolic molding compound, inorganically/organically filled, average heat resistance, increased dimensional stability, dish washer proof, UL listed molding compound 1.5 mm/V-0 (ALL).Application area..
Back Pressure	0.500 - 2.00 MPa	72.5 - 290 psi	Injection molding
Hexion Bakelite™ 460124 Phenolic Formaldehyde Resin (discontinued **) Phenolic molding compound, mainly organically filled, standard molding compound for normal stress.Application areas: Cookware fittings, electric devices.Information provided by Bakelite AGBakelite A..
Back Pressure	0.500 - 1.00 MPa	72.5 - 145 psi	Injection Molding
Stellarchem AB760LG TPE Compound This grade of Stellarchem TPE is shear dependent and can be processed on conventional thermoplastics equipment for injection molding or extrusion. It's a soft, elastomeric polyolefin based, complete..
Back Pressure	0.500 - 1.00 MPa	72.5 - 145 psi	Injection Molding
Stellarchem LP-880 TPE Compound This grade of Stellarchem TPE is shear dependent and can be processed on conventional thermoplastics equipment for injection molding or extrusion. It's a soft, elastomeric polyolefin based, complete..
Back Pressure	0.500 - 0.848 MPa	72.5 - 123 psi	Injection
Alliance Polymers Viprene™ P80A-22U-NAT Thermoplastic Vulcanizate Elastomer Viprene™ P80A-22U-NAT is a UV and Heat Stabilized TVP (Thermoplastic Vulcanizate Elastomer). This material can be easily processed by extrusion or injection molding. It exhibits easy flowing charac..
Back Pressure	0.500 - 1.00 MPa	72.5 - 145 psi	Injection
Alliance Polymers Zythane™ 4080A Thermoplastic Polyurethane Elastomer Zythane™ 4080A is a polycaprolactone-based TPU specifically formulated for injection molding applications .It exhibits excellent low compression set, abrasion resistance and toughness and has good ..
Back Pressure	0.500 - 1.00 MPa	72.5 - 145 psi	Injection
Alliance Polymers Zythane™ 6075A Thermoplastic Polyurethane Elastomer Zythane™ 6075A is a polycaprolactone-based TPU specifically formulated for injection molding applications .It exhibits excellent low compression set, abrasion resistance and toughness and has good ..
Back Pressure	<= 0.500 MPa	<= 72.5 psi
Celanese Hostaform® S 9362 XAP2 ™ POM, Impact Modified Preliminary Data SheetDrying is suggested to help achieve low emission performance and to counter if material has contacted moisture through improper storage and handling.Information provided by Cel..
Back Pressure	0.500 MPa	72.5 psi
Celanese Celcon® CF802 POM, Specialty (Unverified Data**) Celcon® acetal copolymer grade CF802 is a conductive, fuel compatible general purpose acetal copolymer. Celcon® CF802 has been developed to dissipate static electricity from fuel handling systems...
Back Pressure	0.500 MPa	72.5 psi
Celanese Celcon® GC10 POM, 10% Glass Reinforced (Unverified Data**) Celcon® GC10 acetal copolymer is a 10% glass reinforced acetal for improved strength and stiffness.10% glass fiber, has been replaced with Hostaform® C 9021 GV1/10Standard reciprocating screw inje..
Back Pressure	0.500 MPa	72.5 psi
Celanese Celcon® GC15 POM, 15% Glass Reinforced (Unverified Data**) Celcon® GC15 is an acetal copolymer grade utilizing a nominal 15 wt. % fiber glass level to increase stiffness and strength.15% glass fibers, coupled for improved stiffnessStandard reciprocating sc..
Back Pressure	0.500 MPa	72.5 psi
Celanese Celcon® MC90 POM, Mineral Reinforced (Unverified Data**) Celcon® acetal copolymer grade MC90 is a mineral reinforced grade offering low warp, improved dimensional stability, improved stiffness, improved practical impact and retention of other base resin ..
Back Pressure	0.500 MPa	72.5 psi
Celanese Hostaform® MT12R01 POM, Medical Technology (Unverified Data**) Hostaform® MT12R01 is a special grade developed for medical industry applications containing low residual monomers and no animal products. Hostaform® MT12R01 is a low melt viscosity and improved ..
Back Pressure	0.500 MPa	72.5 psi
Celanese Hostaform® S 9363 XAP² ™ POM, Impact Modified (Unverified Data**) Hostaform® acetal copolymer grade S 9363 XAP2 ™ is an impact modified grade for demanding applications. Hostaform® S 9363 XAP2 ™ provides good impact strength while improving modulus and weld..
Back Pressure	0.500 MPa	72.5 psi
Celanese Hostaform® XT 20 POM, Impact Modified (Unverified Data**) Preliminary Data SheetHighly Impact ModifiedInformation provided by Celanese
Back Pressure	0.500 - 2.00 MPa	72.5 - 290 psi	Injection molding
Hexion Bakelite™ PF 8052 Phenolic Formaldehyde Resin, Resistant to High Temperatures (discontinued **) Phenolic molding compound, glass fiber reinforced and inorganically filled. Excellent heat resistance with respect to surface finish and mechanical properties.Application areas: Pan handles, heat r..
Back Pressure	0.500 - 2.00 MPa	72.5 - 290 psi	Injection molding
Hexion Bakelite™ PF 4155 Phenolic Formaldehyde Resin, Resistant to High Temperatures, Improved Electrical Properties, Low Shrinkage, High Mechanical Strength Phenolic molding compound, inorganically filled, glass fiber reinforced, good media and temperature resistance. Conditioned Cu-adhesion.Application areas: Commutators (fuel pumps, actuators, starte..