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Hexion Bakelite™ PF 2774 Phenolic Formaldehyde Resin, Dishwasher Proof, Improved Electrical Properties, Low Shrinkage, UL Listed

Category Polymer , Thermoset , Filled/Reinforced Thermoset , Phenolic
Manufacturer
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Hexion Bakelite™ PF 2774 Phenolic Formaldehyde Resin, Dishwasher Proof, Improved Electrical Properties, Low Shrinkage, UL Listed.pdf
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Material Notes:
Phenolic molding compound, inorganically filled, glass fiber reinforced, increased dimensional stability, averaged notched impact strength, average heat resistance, improved electrical properties, UL listed molding compound 1.5 mm/V-0 (ALL).Application areas: Contactors, pump parts, insulating flanges, automotive engine attachments, braking power energizers, bearing brackets and lamp holders.Information provided by Bak AGBak AG became a part of Hexion in 2005.
Physical Properties Metric English Comments
Density 1.72 g/cc
0.0621 lb/in³
ISO 1183
Apparent Bulk Density 0.750 g/cc
0.0271 lb/in³
ISO 60
Linear Mold Shrinkage, Flow 0.0010 cm/cm
0.0010 in/in
Compression molding; ISO 2577
0.0030 cm/cm
0.0030 in/in
Injection molding; ISO 2577
Mechanical Properties Metric English Comments
Ball Indentation Hardness 425 MPa
61600 psi
H 961/30; ISO 2039/P1
Flexural Strength 115 MPa
16700 psi
2 mm/min; ISO 178
Flexural Modulus 11.0 GPa
1600 ksi
ISO 178
Charpy Impact Unnotched 0.900 J/cm²

@Temperature 23.0 °C
4.28 ft-lb/in²

@Temperature 73.4 °F
ISO 179-1/2 eU
Charpy Impact, Notched 0.200 J/cm²

@Temperature 23.0 °C
0.952 ft-lb/in²

@Temperature 73.4 °F
ISO 179-1/2 eA
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 150 °C
302 °F
<20000 hours; IEC 60216-P1
220 °C
428 °F
< 50 hours; IEC 60216-P1
Deflection Temperature at 8.0 MPa 150 °C
302 °F
ISO 75-2
UL RTI, Electrical 150 °C

@Thickness 1.50 mm
302 °F

@Thickness 0.0591 in
ALL
UL RTI, Mechanical with Impact 150 °C

@Thickness 1.50 mm
302 °F

@Thickness 0.0591 in
ALL
UL RTI, Mechanical without Impact 150 °C

@Thickness 1.50 mm
302 °F

@Thickness 0.0591 in
ALL
Flammability, UL94 V-0

@Thickness 1.50 mm
V-0

@Thickness 0.0591 in
ALL
Shrinkage 0.120 %

@Temperature 110 °C
0.120 %

@Temperature 230 °F
Compression molding; ISO 2577
0.180 %

@Temperature 110 °C,
Time 605000 sec
0.180 %

@Temperature 230 °F,
Time 168 hour
Injection molding; ISO 2577
Electrical Properties Metric English Comments
Volume Resistivity 1.00e+12 ohm-cm
1.00e+12 ohm-cm
IEC 60093
Surface Resistance 1.00e+11 ohm
1.00e+11 ohm
IEC 60093
Dielectric Constant 7.0

@Frequency 100 Hz
7.0

@Frequency 100 Hz
IEC 60250
Dielectric Strength 25.0 kV/mm

@Thickness 1.00 mm
635 kV/in

@Thickness 0.0394 in
IEC 60243-P1
Dissipation Factor 0.10

@Frequency 100 Hz
0.10

@Frequency 100 Hz
IEC 60250
Arc Resistance 135 - 140 sec
135 - 140 sec
ASTM D495
Comparative Tracking Index 175 V
175 V
Test liquid A; IEC 60112
Hot Wire Ignition, HWI >= 120 sec

@Thickness 1.50 mm
>= 120 sec

@Thickness 0.0591 in
ALL
High Amp Arc Ignition, HAI 60 - 120 arcs

@Thickness 1.50 mm
60 - 120 arcs

@Thickness 0.0591 in
ALL
Processing Properties Metric English Comments
Feed Temperature 60.0 - 75.0 °C
140 - 167 °F
Injection molding
Nozzle Temperature 80.0 - 100 °C
176 - 212 °F
Injection molding
Melt Temperature 80.0 - 100 °C
176 - 212 °F
Injection molding
Mold Temperature 160 - 190 °C
320 - 374 °F
Injection molding
160 - 190 °C
320 - 374 °F
Compression molding
Injection Pressure >= 15.0 MPa
>= 2180 psi
Compression and injection cavity mold pressure
Back Pressure 0.500 - 2.00 MPa
72.5 - 290 psi
Injection molding
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Per 1 mm of wall thickness, injection molding
0.333 - 0.667 min
0.00556 - 0.0111 hour
Per 1 mm of wall thickness, compression molding
Descriptive Properties Value Comments
Chromatic Spectrum All Colors
Creep Rupture Strength Very Good
Holding Pressure Approximately 40-60% of injection pressure
Media Resistance Very Good
Moisture Absorption 10 mg
ISO 62, 24 hours at 23°C
Reserves by Peak Temperature Very High
Thermal Expansion Very Slight
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