Thermal Properties | Metric | English | Comments |
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UL RTI, Electrical | 150 °C | 302 °F | |
Resinoid 1340 Phenolic Molding, Glass Reinforced Data provided by the manufacturer.The Resinoid 1300 and 7000 glass fiber reinforced series compounds feature mechanical strength, dimensional stability, electrical insulation, and heat resistance |
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UL RTI, Electrical | 150 °C @Thickness 1.50 mm |
302 °F @Thickness 0.0591 in |
UL746B |
Covestro Apec® DP9-9371 High-Heat Polycarbonate, General Purpose
(discontinued **) Information provided by Bayer Corporation, Plastics DivisionAs of 1 September 2015, Bayer MaterialScience was separated from Bayer AG and has officially adopted its new name – Covestro. This produ.. |
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UL RTI, Electrical | 150 °C | 302 °F | Average value: 150 °C Grade Count:6 |
Overview of materials for Phenolic, Novolac, Heat Resistant Grade, Filled This property data is a summary of similar materials in the MatWeb database for the category "Phenolic, Novolac, Heat Resistant Grade, Filled". Each property range of values reported is minimum and .. |
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UL RTI, Electrical | 150 °C | 302 °F | Average value: 150 °C Grade Count:8 |
Overview of materials for Phenolic, Novolac, Impact Grade, Filled This property data is a summary of similar materials in the MatWeb database for the category "Phenolic, Novolac, Impact Grade, Filled". Each property range of values reported is minimum and maximum .. |
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UL RTI, Electrical | 150 °C @Thickness 1.50 mm |
302 °F @Thickness 0.0591 in |
ALL |
Hexion Bakelite™ PF 2774 Phenolic Formaldehyde Resin, Dishwasher Proof, Improved Electrical Properties, Low Shrinkage, UL Listed Phenolic molding compound, inorganically filled, glass fiber reinforced, increased dimensional stability, averaged notched impact strength, average heat resistance, improved electrical properties, U.. |
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UL RTI, Electrical | 150 °C @Thickness 1.50 mm |
302 °F @Thickness 0.0591 in |
BN, BK |
Hexion Bakelite™ X65 Phenolic Formaldehyde Resin, UL Listed
(discontinued **) Phenolic molding compound, inorganically/organically filled, good heat-resistance and dimensional stability, UL listed molding compound 3.0 mm/V-0 (BN, BK).Application areas: Oven strips.Information.. |
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UL RTI, Electrical | 150 °C @Thickness 1.47 mm |
302 °F @Thickness 0.0579 in |
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Plenco 201 Black General Purpose Woodflour/Mineral Filled Phenolic Molding Compound
(discontinued **) Plaslok 201 is a two-stage, woodflour and mineral-filled phenolic molding compound formulated to have an excellent balance of molded properties. The material provides good electrical insulation val.. |
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UL RTI, Electrical | 150 °C @Thickness 1.63 mm |
302 °F @Thickness 0.0642 in |
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Plenco 202 Black General Purpose Woodflour Filled Phenolic Molding Compound
(discontinued **) Plaslok 202 is a two-stage, woodflour-filled phenolic molding compound formulated to provide improved impact and fatigue strength, good dimensional stability and excellent molded finish for automoti.. |
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UL RTI, Electrical | 150 °C @Thickness 1.57 mm |
302 °F @Thickness 0.0618 in |
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Plenco 204 Black General Purpose Woodflour/Mineral Filled Phenolic Molding Compound
(discontinued **) Plaslok 204 is a two-stage, woodflour and mineral-filled phenolic molding compound formulated to accommodate a wide range of molding situations. In addition, it is recommended for use in thin wall .. |
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UL RTI, Electrical | 150 °C @Thickness 1.47 mm |
302 °F @Thickness 0.0579 in |
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Plenco 5440 Black General Purpose Phenolic Molding Compound
(discontinued **) Plaslok 5440 is the replacement material for the former Union Carbide BMRS-5440. It is a two-stage, phenolic molding compound that has been successfully formulated to accommodate a very wide range .. |
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UL RTI, Electrical | 150 °C @Thickness 1.57 mm |
302 °F @Thickness 0.0618 in |
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Plenco 501 Black Electrical Grade Mineral/Flock Filled Phenolic Molding Compound
(discontinued **) Plaslok 501 is a two-stage, mineral and flock-filled phenolic molding compound designed for use in heat resistant and electrical applications. It is designed for elevated temperature exposure for e.. |
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UL RTI, Electrical | 150 °C @Thickness 1.57 mm |
302 °F @Thickness 0.0618 in |
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Plenco 306 Black General Purpose Mineral/Flock Filled Phenolic Molding Compound
(discontinued **) Plaslok 306 is a two-stage, mineral and flock-filled phenolic molding compound designed to have the heat resistant characteristics of Plaslok 504, while at the same time, improved impact strength.Da.. |
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UL RTI, Electrical | 150 °C @Thickness 1.57 mm |
302 °F @Thickness 0.0618 in |
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Plenco 5314 Black (COM) Impact Grade Phenolic Molding Compound
(discontinued **) Plaslok 5314 is the replacement material for the former Union Carbide BMMA-5314. It is a two-stage, impact grade phenolic molding compound suitable for compression, transfer or injection molding of.. |
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UL RTI, Electrical | 150 °C @Thickness 1.60 mm |
302 °F @Thickness 0.0630 in |
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Plenco 309 Black (COM) Mineral/Fiber Filled Phenolic Molding Compound
(discontinued **) Plaslok 309 is a two-stage, mineral and fiber-filled phenolic molding compound having excellent impact strength; and as such, is considered a good candidate for replacing chopped-fiber filled compou.. |
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UL RTI, Electrical | 150 °C @Thickness 1.63 mm |
302 °F @Thickness 0.0642 in |
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Plaslok 202 Black General Purpose Woodflour Filled Phenolic Molding Compound
(discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 202 is a two-stage, woodflour-filled .. |
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UL RTI, Electrical | 150 °C | 302 °F | |
Sumitomo Bakelite Sumikon® PM-9640 Glass Filled Phenolic Two stage glass fiber filled black phenolic. It is especially designed for applications requiring high strength and dimensional stability with excellent heat resistance. PM-9640 is widely used in .. |
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UL RTI, Electrical | 150 °C | 302 °F | E54153 |
Arlon 56866R026 0.028" Cured/Uncured Silicone Rubber with Fiberglass Substrate Design/Construction:Side 1: Cured Silicone RubberSubstrate: Style 1564 FiberglassSide 2: Uncured Silicone RubberInterleave: 3 mil LDPEThis data represents typical values for the production mater.. |
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UL RTI, Electrical | 150 °C | 302 °F | E54153 |
Arlon 32980R015 0.015" (0.381 mm) Uncured Silicon Rubber on Polyester Film Carrier Design/Construction: Interleave: PolyethyleneSide 1: Uncured Silicone RubberCarrier: Polyester FilmProduct Use: Flexible heater substrateAppearance: Red colored, high viscosity gum on polymer liners.. |
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UL RTI, Electrical | 150 °C | 302 °F | |
Arlon 44981R015 0.015" (0.381 mm) Uncured Silicone Rubber with Fiberglass Substrate Design/Construction: Interleave 1: Polyethylene Side 1: Uncured Silicone Rubber Substrate: Style 1165 FiberglassSide 2: Uncured Silicone Rubber Interleave 2: Polyethylene UL Recognition File: E54153.. |
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UL RTI, Electrical | 150 °C | 302 °F | 1.47 mm |
Plaslok 5440 Black General Purpose Phenolic Molding Compound
(discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 5440 is the replacement material for .. |
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UL RTI, Electrical | 150 °C | 302 °F | 1.47 mm |
Plaslok 7000 Black General Purpose Woodflour Filled Phenolic Molding Compound
(discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 7000 is the replacement material for .. |
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UL RTI, Electrical | 150 °C @Thickness 1.47 mm |
302 °F @Thickness 0.0579 in |
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Plaslok 504 Black (COM) Heat Resistant Mineral/Cellulose Filled Phenolic Molding Compound
(discontinued **)&l Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 504 is a two-stage, mineral and cellu.. |
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UL RTI, Electrical | 150 °C @Thickness 1.57 mm |
302 °F @Thickness 0.0618 in |
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Plaslok 5303 Black Electrical Grade Mineral/Flock Filled Phenolic Molding Compound
(discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 5303 is a two-stage, mineral and floc.. |
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UL RTI, Electrical | 150 °C @Thickness 1.57 mm |
302 °F @Thickness 0.0618 in |
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Plaslok 306 Black General Purpose Mineral/Flock Filled Phenolic Molding Compound
(discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use. Plaslok 306 is a two-stage, mineral and flock.. |
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UL RTI, Electrical | 150 °C @Thickness 1.57 mm |
302 °F @Thickness 0.0618 in |
|
Plaslok 5314 Black (COM) Impact Grade Phenolic Molding Compound
(discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 5314 is the replacement material for .. |
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UL RTI, Electrical | 150 °C | 302 °F | 1.47 mm |
Plaslok 5314 Black (INJ) Impact Grade Phenolic Molding Compound
(discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 5314 is the replacement material for .. |
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UL RTI, Electrical | 150 °C | 302 °F | |
Resinoid 7201 Phenolic Molding, Glass Reinforced Data provided by the manufacturer.The Resinoid 1300 and 7000 glass fiber reinforced series compounds feature mechanical strength, dimensional stability, electrical insulation, and heat resistance |
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UL RTI, Electrical | 150 °C @Thickness 1.50 mm |
302 °F @Thickness 0.0591 in |
(BK) |
Hexion Bakelite™ PF 2836 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage, UL Listed
&nbs Phenolic molding compound, inorganically/organically filled, increased heat resistance, increased tracking resistance, low shrinkage and post shrinkage, improved electrical properties, UL listed mol.. |
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UL RTI, Electrical | 150 °C @Thickness 3.00 mm |
302 °F @Thickness 0.118 in |
ALL |
Hexion Bakelite™ PF 2855 Phenolic Formaldehyde Resin, High Surface Quality, Low Shrinkage, For Electrostatic Coating, Dishwasher Proof, UL Listed Phenolic molding compound, inorganically/organically filled, heat resistant up to 250°C, hot steam and hot water resistant, high surface quality, for electrostatic coating, UL listed molding compou.. |
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UL RTI, Electrical | 150 °C | 302 °F | 1.57 mm |
Plaslok 7021 Black Impact Grade Phenolic Molding Compound
(discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 7021 is the replacement material for .. |