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Polymer Property : UL RTI, Electrical = 150 °C Product List

Thermal Properties

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Thermal Properties Metric English Comments
UL RTI, Electrical 150 °C
302 °F
Resinoid 1340 Phenolic Molding, Glass Reinforced
Data provided by the manufacturer.The Resinoid 1300 and 7000 glass fiber reinforced series compounds feature mechanical strength, dimensional stability, electrical insulation, and heat resistance
UL RTI, Electrical 150 °C

@Thickness 1.50 mm
302 °F

@Thickness 0.0591 in
UL746B
Covestro Apec® DP9-9371 High-Heat Polycarbonate, General Purpose  (discontinued **)
Information provided by Bayer Corporation, Plastics DivisionAs of 1 September 2015, Bayer MaterialScience was separated from Bayer AG and has officially adopted its new name – Covestro. This produ..
UL RTI, Electrical 150 °C
302 °F
Average value: 150 °C Grade Count:6
Overview of materials for Phenolic, Novolac, Heat Resistant Grade, Filled
This property data is a summary of similar materials in the MatWeb database for the category "Phenolic, Novolac, Heat Resistant Grade, Filled". Each property range of values reported is minimum and ..
UL RTI, Electrical 150 °C
302 °F
Average value: 150 °C Grade Count:8
Overview of materials for Phenolic, Novolac, Impact Grade, Filled
This property data is a summary of similar materials in the MatWeb database for the category "Phenolic, Novolac, Impact Grade, Filled". Each property range of values reported is minimum and maximum ..
UL RTI, Electrical 150 °C

@Thickness 1.50 mm
302 °F

@Thickness 0.0591 in
ALL
Hexion Bakelite™ PF 2774 Phenolic Formaldehyde Resin, Dishwasher Proof, Improved Electrical Properties, Low Shrinkage, UL Listed
Phenolic molding compound, inorganically filled, glass fiber reinforced, increased dimensional stability, averaged notched impact strength, average heat resistance, improved electrical properties, U..
UL RTI, Electrical 150 °C

@Thickness 1.50 mm
302 °F

@Thickness 0.0591 in
BN, BK
Hexion Bakelite™ X65 Phenolic Formaldehyde Resin, UL Listed  (discontinued **)
Phenolic molding compound, inorganically/organically filled, good heat-resistance and dimensional stability, UL listed molding compound 3.0 mm/V-0 (BN, BK).Application areas: Oven strips.Information..
UL RTI, Electrical 150 °C

@Thickness 1.47 mm
302 °F

@Thickness 0.0579 in
Plenco 201 Black General Purpose Woodflour/Mineral Filled Phenolic Molding Compound  (discontinued **)
Plaslok 201 is a two-stage, woodflour and mineral-filled phenolic molding compound formulated to have an excellent balance of molded properties. The material provides good electrical insulation val..
UL RTI, Electrical 150 °C

@Thickness 1.63 mm
302 °F

@Thickness 0.0642 in
Plenco 202 Black General Purpose Woodflour Filled Phenolic Molding Compound  (discontinued **)
Plaslok 202 is a two-stage, woodflour-filled phenolic molding compound formulated to provide improved impact and fatigue strength, good dimensional stability and excellent molded finish for automoti..
UL RTI, Electrical 150 °C

@Thickness 1.57 mm
302 °F

@Thickness 0.0618 in
Plenco 204 Black General Purpose Woodflour/Mineral Filled Phenolic Molding Compound  (discontinued **)
Plaslok 204 is a two-stage, woodflour and mineral-filled phenolic molding compound formulated to accommodate a wide range of molding situations. In addition, it is recommended for use in thin wall ..
UL RTI, Electrical 150 °C

@Thickness 1.47 mm
302 °F

@Thickness 0.0579 in
Plenco 5440 Black General Purpose Phenolic Molding Compound  (discontinued **)
Plaslok 5440 is the replacement material for the former Union Carbide BMRS-5440. It is a two-stage, phenolic molding compound that has been successfully formulated to accommodate a very wide range ..
UL RTI, Electrical 150 °C

@Thickness 1.57 mm
302 °F

@Thickness 0.0618 in
Plenco 501 Black Electrical Grade Mineral/Flock Filled Phenolic Molding Compound  (discontinued **)
Plaslok 501 is a two-stage, mineral and flock-filled phenolic molding compound designed for use in heat resistant and electrical applications. It is designed for elevated temperature exposure for e..
UL RTI, Electrical 150 °C

@Thickness 1.57 mm
302 °F

@Thickness 0.0618 in
Plenco 306 Black General Purpose Mineral/Flock Filled Phenolic Molding Compound  (discontinued **)
Plaslok 306 is a two-stage, mineral and flock-filled phenolic molding compound designed to have the heat resistant characteristics of Plaslok 504, while at the same time, improved impact strength.Da..
UL RTI, Electrical 150 °C

@Thickness 1.57 mm
302 °F

@Thickness 0.0618 in
Plenco 5314 Black (COM) Impact Grade Phenolic Molding Compound  (discontinued **)
Plaslok 5314 is the replacement material for the former Union Carbide BMMA-5314. It is a two-stage, impact grade phenolic molding compound suitable for compression, transfer or injection molding of..
UL RTI, Electrical 150 °C

@Thickness 1.60 mm
302 °F

@Thickness 0.0630 in
Plenco 309 Black (COM) Mineral/Fiber Filled Phenolic Molding Compound  (discontinued **)
Plaslok 309 is a two-stage, mineral and fiber-filled phenolic molding compound having excellent impact strength; and as such, is considered a good candidate for replacing chopped-fiber filled compou..
UL RTI, Electrical 150 °C

@Thickness 1.63 mm
302 °F

@Thickness 0.0642 in
Plaslok 202 Black General Purpose Woodflour Filled Phenolic Molding Compound  (discontinued **)
Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 202 is a two-stage, woodflour-filled ..
UL RTI, Electrical 150 °C
302 °F
Sumitomo Bakelite Sumikon® PM-9640 Glass Filled Phenolic
Two stage glass fiber filled black phenolic. It is especially designed for applications requiring high strength and dimensional stability with excellent heat resistance. PM-9640 is widely used in ..
UL RTI, Electrical 150 °C
302 °F
E54153
Arlon 56866R026 0.028" Cured/Uncured Silicone Rubber with Fiberglass Substrate
Design/Construction:Side 1: Cured Silicone RubberSubstrate: Style 1564 FiberglassSide 2: Uncured Silicone RubberInterleave: 3 mil LDPEThis data represents typical values for the production mater..
UL RTI, Electrical 150 °C
302 °F
E54153
Arlon 32980R015 0.015" (0.381 mm) Uncured Silicon Rubber on Polyester Film Carrier
Design/Construction: Interleave: PolyethyleneSide 1: Uncured Silicone RubberCarrier: Polyester FilmProduct Use: Flexible heater substrateAppearance: Red colored, high viscosity gum on polymer liners..
UL RTI, Electrical 150 °C
302 °F
Arlon 44981R015 0.015" (0.381 mm) Uncured Silicone Rubber with Fiberglass Substrate
Design/Construction: Interleave 1: Polyethylene Side 1: Uncured Silicone Rubber Substrate: Style 1165 FiberglassSide 2: Uncured Silicone Rubber Interleave 2: Polyethylene UL Recognition File: E54153..
UL RTI, Electrical 150 °C
302 °F
1.47 mm
Plaslok 5440 Black General Purpose Phenolic Molding Compound  (discontinued **)
Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 5440 is the replacement material for ..
UL RTI, Electrical 150 °C
302 °F
1.47 mm
Plaslok 7000 Black General Purpose Woodflour Filled Phenolic Molding Compound  (discontinued **)
Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 7000 is the replacement material for ..
UL RTI, Electrical 150 °C

@Thickness 1.47 mm
302 °F

@Thickness 0.0579 in
Plaslok 504 Black (COM) Heat Resistant Mineral/Cellulose Filled Phenolic Molding Compound  (discontinued **)&l
Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 504 is a two-stage, mineral and cellu..
UL RTI, Electrical 150 °C

@Thickness 1.57 mm
302 °F

@Thickness 0.0618 in
Plaslok 5303 Black Electrical Grade Mineral/Flock Filled Phenolic Molding Compound  (discontinued **)
Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 5303 is a two-stage, mineral and floc..
UL RTI, Electrical 150 °C

@Thickness 1.57 mm
302 °F

@Thickness 0.0618 in
Plaslok 306 Black General Purpose Mineral/Flock Filled Phenolic Molding Compound  (discontinued **)
Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use. Plaslok 306 is a two-stage, mineral and flock..
UL RTI, Electrical 150 °C

@Thickness 1.57 mm
302 °F

@Thickness 0.0618 in
Plaslok 5314 Black (COM) Impact Grade Phenolic Molding Compound  (discontinued **)
Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 5314 is the replacement material for ..
UL RTI, Electrical 150 °C
302 °F
1.47 mm
Plaslok 5314 Black (INJ) Impact Grade Phenolic Molding Compound  (discontinued **)
Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 5314 is the replacement material for ..
UL RTI, Electrical 150 °C
302 °F
Resinoid 7201 Phenolic Molding, Glass Reinforced
Data provided by the manufacturer.The Resinoid 1300 and 7000 glass fiber reinforced series compounds feature mechanical strength, dimensional stability, electrical insulation, and heat resistance
UL RTI, Electrical 150 °C

@Thickness 1.50 mm
302 °F

@Thickness 0.0591 in
(BK)
Hexion Bakelite™ PF 2836 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage, UL Listed &nbs
Phenolic molding compound, inorganically/organically filled, increased heat resistance, increased tracking resistance, low shrinkage and post shrinkage, improved electrical properties, UL listed mol..
UL RTI, Electrical 150 °C

@Thickness 3.00 mm
302 °F

@Thickness 0.118 in
ALL
Hexion Bakelite™ PF 2855 Phenolic Formaldehyde Resin, High Surface Quality, Low Shrinkage, For Electrostatic Coating, Dishwasher Proof, UL Listed
Phenolic molding compound, inorganically/organically filled, heat resistant up to 250°C, hot steam and hot water resistant, high surface quality, for electrostatic coating, UL listed molding compou..
UL RTI, Electrical 150 °C
302 °F
1.57 mm
Plaslok 7021 Black Impact Grade Phenolic Molding Compound  (discontinued **)
Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 7021 is the replacement material for ..
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