Polymer Property : UL RTI, Mechanical with Impact = 150 °C Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
UL RTI, Mechanical with Impact	150 °C	302 °F
Resinoid 7051 Phenolic Molding, Glass Reinforced Data provided by the manufacturer.The Resinoid 1300 and 7000 glass fiber reinforced series compounds feature mechanical strength, dimensional stability, electrical insulation, and heat resistance
UL RTI, Mechanical with Impact	150 °C	302 °F	UL 746
Solvay Specialty Polymers Mindel® B-430 Polysulfone, Modified (PSU, Modified) (discontinued **) Mindel B-430 is a 30% glass reinforced thermoplastic with excellent dimensional stability, exceptional resistance to warp, good chemical resistance, and high stiffness. It was developed specifically..
UL RTI, Mechanical with Impact	150 °C	302 °F	Average value: 150 °C Grade Count:6
Overview of materials for Phenolic, Novolac, Heat Resistant Grade, Filled This property data is a summary of similar materials in the MatWeb database for the category "Phenolic, Novolac, Heat Resistant Grade, Filled". Each property range of values reported is minimum and ..
UL RTI, Mechanical with Impact	150 °C	302 °F	Average value: 150 °C Grade Count:8
Overview of materials for Phenolic, Novolac, Impact Grade, Filled This property data is a summary of similar materials in the MatWeb database for the category "Phenolic, Novolac, Impact Grade, Filled". Each property range of values reported is minimum and maximum ..
UL RTI, Mechanical with Impact	150 °C	302 °F	Average value: 150 °C Grade Count:4
Overview of materials for Phenolic, Novolac, Mineral/Fiber Filled This property data is a summary of similar materials in the MatWeb database for the category "Phenolic, Novolac, Mineral/Fiber Filled". Each property range of values reported is minimum and maximum ..
UL RTI, Mechanical with Impact	150 °C	302 °F	Average value: 150 °C Grade Count:5
Overview of materials for Phenolic, Novolac, Glass Filled This property data is a summary of similar materials in the MatWeb database for the category "Phenolic, Novolac, Glass Filled". Each property range of values reported is minimum and maximum values o..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.50 mm	302 °F @Thickness 0.0591 in	(ALL)
Hexion Bakelite™ PF 31 Phenolic Formaldehyde Resin, UL Listed (discontinued **) Phenolic molding compound, mainly organically filled, standard molding compound for normal stress, UL listed molding compound 1.5 mm/V-1 (All), 3 mm/V-0 (All), standardized molding compound.Applicat..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.50 mm	302 °F @Thickness 0.0591 in	(BK, BN)
Hexion Bakelite™ PF 85 Phenolic Formaldehyde Resin, UL Listed (discontinued **) Phenolic molding compound, organically filled, reinforced with cotton fibers, average notched impact strength, UL listed molding compound 1.5 mm/HB (BK, BN).Application areas: Switch covers, rolls, ..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.50 mm	302 °F @Thickness 0.0591 in	BK
Hexion Bakelite™ PF 13591 Phenolic Formaldehyde Resin, High Surface Quality, UL Listed (discontinued **) Phenolic molding compound, mainly organically filled, very soft flow for large molds, UL listed molding compound 1.5 mm/V-1 (BK), 3.0 mm/V-0 (BK).Application areas: Pan handles, various applications..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.50 mm	302 °F @Thickness 0.0591 in	(BN, BK)
Hexion Bakelite™ X22 Phenolic Formaldehyde Resin, UL Listed (discontinued **) Phenolic molding compound, mainly organically filled, UL listed molding compound 3.0 mm/V-0 (BN, BK).Application areas: Pot handles, operating controls, electrical isolators, housing parts.Informati..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.50 mm	302 °F @Thickness 0.0591 in	BN, BK
Hexion Bakelite™ X65 Phenolic Formaldehyde Resin, UL Listed (discontinued **) Phenolic molding compound, inorganically/organically filled, good heat-resistance and dimensional stability, UL listed molding compound 3.0 mm/V-0 (BN, BK).Application areas: Oven strips.Information..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.47 mm	302 °F @Thickness 0.0579 in
Plenco 201 Black General Purpose Woodflour/Mineral Filled Phenolic Molding Compound (discontinued **) Plaslok 201 is a two-stage, woodflour and mineral-filled phenolic molding compound formulated to have an excellent balance of molded properties. The material provides good electrical insulation val..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.47 mm	302 °F @Thickness 0.0579 in
Plenco 5000 Black General Purpose Woodflour Filled Phenolic Molding Compound (discontinued **) Plaslok 5000 is the replacement material for the former Union Carbide BMM-5000. It is a two-stage, woodflour-filled phenolic molding compound having versatile molding performance and preheating cha..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.47 mm	302 °F @Thickness 0.0579 in
Plenco 5440 Black General Purpose Phenolic Molding Compound (discontinued **) Plaslok 5440 is the replacement material for the former Union Carbide BMRS-5440. It is a two-stage, phenolic molding compound that has been successfully formulated to accommodate a very wide range ..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.57 mm	302 °F @Thickness 0.0618 in
Plenco 7021 Black Impact Grade Phenolic Molding Compound (discontinued **) Plaslok 7021 is the replacement material for the former Union Carbide BMRS-7021. It is a two-stage, impact grade phenolic molding compound suitable for compression, transfer or injection molding of..
UL RTI, Mechanical with Impact	150 °C	302 °F	1.60 mm
Plaslok 309 Black (COM) Mineral/Fiber Filled Phenolic Molding Compound (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 309 is a two-stage, mineral and fiber..
UL RTI, Mechanical with Impact	150 Â°C	302 Â°F
Haysite UltratracÂ® H950 Glass Reinforced Polyester Sheet, Electrical Grade (GPO3) This new generation of high performance material meets or exceeds all requirements for NEMA GPO-2 or GPO-3. ULTRATRAC Â® H950 is recognized by U.L. as a 94V-0 material and offers greater arc and t..
UL RTI, Mechanical with Impact	150 °C	302 °F
Resinoid 1312 Phenolic Molding, Glass Reinforced Data provided by the manufacturer.The Resinoid 1300 and 7000 glass fiber reinforced series compounds feature mechanical strength, dimensional stability, electrical insulation, and heat resistance
UL RTI, Mechanical with Impact	150 °C	302 °F
Resinoid 2016 Phenolic Molding, Fabric Reinforced Data provided by the manufacturer.The Resinoid 2000 organic fiber reinforced series compounds feature mechanical strength, dimensional stability, and shock resistance
UL RTI, Mechanical with Impact	150 °C @Thickness 1.57 mm	302 °F @Thickness 0.0618 in
Plenco 302 Black Impact Grade Woodflour/Flock Filled Phenolic Molding Compound (discontinued **) Plaslok 302 is a two-stage, woodflour and flock-filled phenolic molding compound. It has low specific gravity, broad molding latitude and an excellent balance of electrical and physical properties...
UL RTI, Mechanical with Impact	150 °C @Thickness 1.47 mm	302 °F @Thickness 0.0579 in
Plaslok 5000 Black General Purpose Woodflour Filled Phenolic Molding Compound (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use. Plaslok 5000 is the replacement material for ..
UL RTI, Mechanical with Impact	150 °C	302 °F	1.47 mm
Plaslok 7000 Black General Purpose Woodflour Filled Phenolic Molding Compound (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 7000 is the replacement material for ..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.47 mm	302 °F @Thickness 0.0579 in
Plaslok 504 Black (COM) Heat Resistant Mineral/Cellulose Filled Phenolic Molding Compound (discontinued **)&l Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 504 is a two-stage, mineral and cellu..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.57 mm	302 °F @Thickness 0.0618 in
Plaslok 302 Black Impact Grade Woodflour/Flock Filled Phenolic Molding Compound (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 302 is a two-stage, woodflour and flo..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.57 mm	302 °F @Thickness 0.0618 in
Plaslok 306 Black General Purpose Mineral/Flock Filled Phenolic Molding Compound (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use. Plaslok 306 is a two-stage, mineral and flock..
UL RTI, Mechanical with Impact	150 °C	302 °F	1.47 mm
Plaslok 5314 Black (INJ) Impact Grade Phenolic Molding Compound (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 5314 is the replacement material for ..
UL RTI, Mechanical with Impact	150 °C	302 °F
Resinoid 7201 Phenolic Molding, Glass Reinforced Data provided by the manufacturer.The Resinoid 1300 and 7000 glass fiber reinforced series compounds feature mechanical strength, dimensional stability, electrical insulation, and heat resistance
UL RTI, Mechanical with Impact	150 °C @Thickness 1.50 mm	302 °F @Thickness 0.0591 in	(ALL)
Hexion Bakelite™ PF 2560 Phenolic Formaldehyde Resin, High Surface Quality, For Electrostatic Coating, UL Listed &n Phenolic molding compound, inorganically/organically filled, average heat resistant, high surface quality, lower water absorption than PF 31, minimal distortion, UL listed molding compound 1.5 mm/V-..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.50 mm	302 °F @Thickness 0.0591 in	(BK)
Hexion Bakelite™ PF 2836 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage, UL Listed &nbs Phenolic molding compound, inorganically/organically filled, increased heat resistance, increased tracking resistance, low shrinkage and post shrinkage, improved electrical properties, UL listed mol..
UL RTI, Mechanical with Impact	150 °C	302 °F	1.57 mm
Plaslok 204 Black General Purpose Woodflour/Mineral Filled Phenolic Molding Compound (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use. Plaslok 204 is a two-stage, woodflour and min..