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Hexion Bakelite™ PF 13591 Phenolic Formaldehyde Resin, High Surface Quality, UL Listed  (discontinued **)

Category Polymer , Thermoset , Filled/Reinforced Thermoset , Phenolic
Manufacturer
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Hexion Bakelite™ PF 13591 Phenolic Formaldehyde Resin, High Surface Quality, UL Listed  (discontinued **).pdf
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Material Notes:
Phenolic molding compound, mainly organically filled, very soft flow for large molds, UL listed molding compound 1.5 mm/V-1 (BK), 3.0 mm/V-0 (BK).Application areas: Pan handles, various applications in electrical and automotive area.Information provided by Bakelite AGBakelite AG became a part of Hexion in 2005.
Physical Properties Metric English Comments
Density 1.41 g/cc
0.0509 lb/in³
ISO 1183
Apparent Bulk Density 0.620 g/cc
0.0224 lb/in³
ISO 60
Linear Mold Shrinkage, Flow 0.0065 cm/cm
0.0065 in/in
Compression molding; ISO 2577
Mechanical Properties Metric English Comments
Flexural Strength 90.0 MPa
13100 psi
2 mm/min; ISO 178
Flexural Modulus 7.00 GPa
1020 ksi
ISO 178
Charpy Impact Unnotched 0.550 J/cm²

@Temperature 23.0 °C
2.62 ft-lb/in²

@Temperature 73.4 °F
ISO 179-1/2 eU
Charpy Impact, Notched 0.130 J/cm²

@Temperature 23.0 °C
0.619 ft-lb/in²

@Temperature 73.4 °F
ISO 179-1/2 eA
Thermal Properties Metric English Comments
Deflection Temperature at 8.0 MPa 105 °C
221 °F
ISO 75-2
UL RTI, Electrical 150 °C

@Thickness 1.50 mm
302 °F

@Thickness 0.0591 in
BK
UL RTI, Mechanical with Impact 150 °C

@Thickness 1.50 mm
302 °F

@Thickness 0.0591 in
BK
UL RTI, Mechanical without Impact 150 °C

@Thickness 1.50 mm
302 °F

@Thickness 0.0591 in
BK
Flammability, UL94 V-1

@Thickness 1.50 mm
V-1

@Thickness 0.0591 in
BK
V-0

@Thickness 3.00 mm
V-0

@Thickness 0.118 in
(BK)
Shrinkage 0.650 %

@Temperature 110 °C
0.650 %

@Temperature 230 °F
Compression molding; ISO 2577
Electrical Properties Metric English Comments
Volume Resistivity 1.00e+11 ohm-cm
1.00e+11 ohm-cm
IEC 60093
Surface Resistance 1.00e+10 ohm
1.00e+10 ohm
IEC 60093
Dielectric Constant 15

@Frequency 100 Hz
15

@Frequency 100 Hz
IEC 60250
Dielectric Strength 15.0 kV/mm

@Thickness 1.00 mm
381 kV/in

@Thickness 0.0394 in
IEC 60243-P1
Dissipation Factor 0.40

@Frequency 100 Hz
0.40

@Frequency 100 Hz
IEC 60250
Arc Resistance 60 - 120 sec

@Thickness 3.00 mm
60 - 120 sec

@Thickness 0.118 in
(BK)
High Voltage Arc Resistance to Ignition (HVAR) >= 300 sec

@Thickness 1.50 mm
>= 300 sec

@Thickness 0.0591 in
BK
Comparative Tracking Index 100 - 175 V

@Thickness 3.00 mm
100 - 175 V

@Thickness 0.118 in
(BK)
Hot Wire Ignition, HWI >= 120 sec

@Thickness 1.50 mm
>= 120 sec

@Thickness 0.0591 in
BK
High Amp Arc Ignition, HAI 30 - 60 arcs

@Thickness 1.50 mm
30 - 60 arcs

@Thickness 0.0591 in
BK
60 - 120 arcs

@Thickness 3.00 mm
60 - 120 arcs

@Thickness 0.118 in
(BK)
High Voltage Arc-Tracking Rate, HVTR 0.000 - 10.0 mm/min

@Thickness 1.50 mm
0.000 - 0.394 in/min

@Thickness 0.0591 in
BK
Processing Properties Metric English Comments
Feed Temperature 60.0 - 75.0 °C
140 - 167 °F
Injection molding
Nozzle Temperature 80.0 - 100 °C
176 - 212 °F
Injection molding
Melt Temperature 80.0 - 100 °C
176 - 212 °F
Injection molding
Mold Temperature 160 - 190 °C
320 - 374 °F
Injection molding
160 - 190 °C
320 - 374 °F
Compression molding
Injection Pressure >= 15.0 MPa
>= 2180 psi
Compression and injection cavity mold pressure
Back Pressure 0.500 - 2.00 MPa
72.5 - 290 psi
Injection molding
Cure Time 0.167 - 0.333 min
0.00278 - 0.00556 hour
Per 1 mm of wall thickness, injection molding
0.333 - 0.667 min
0.00556 - 0.0111 hour
Per 1 mm of wall thickness, compression molding
Descriptive Properties Value Comments
Chromatic Spectrum Subdued Colors
Creep Rupture Strength Good
Holding Pressure Approximately 40-60% of injection pressure
Media Resistance Good
Moisture Absorption 80 mg
ISO 62, 24 hours at 23°C
Reserves by Peak Temperature High
Thermal Expansion Slight
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