Polymer Property : Deflection Temperature at 8.0 MPa = 221 °F Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Deflection Temperature at 8.0 MPa	105 °C	221 °F	ISO 75-2
Hexion Bakelite™ PF 13591 Phenolic Formaldehyde Resin, High Surface Quality, UL Listed (discontinued **) Phenolic molding compound, mainly organically filled, very soft flow for large molds, UL listed molding compound 1.5 mm/V-1 (BK), 3.0 mm/V-0 (BK).Application areas: Pan handles, various applications..
Deflection Temperature at 8.0 MPa	105 °C	221 °F	ISO 75-2
Hexion Bakelite™ PF 14600 Phenolic Formaldehyde Resin, High Surface Quality (discontinued **) Phenolic molding compound, mainly organically filled, low specific gravity.Application areas: Cookware fittings, electric devices.Information provided by Bak AGBak AG became a part of Hexion in 2005..
Deflection Temperature at 8.0 MPa	105 °C	221 °F	ISO 75-2
Hexion Bakelite™ PF 38110 Phenolic Formaldehyde Resin, High Surface Quality (discontinued **) Phenolic molding compound, mainly organically filled.Application areas: Devices for the electrical installation, pan handles, knobs, mainly for compression molding.Information provided by Bak AGBak ..
Deflection Temperature at 8.0 MPa	105 °C	221 °F	ISO 75-2
Hexion Bakelite™ 460124 Phenolic Formaldehyde Resin (discontinued **) Phenolic molding compound, mainly organically filled, standard molding compound for normal stress.Application areas: Cookware fittings, electric devices.Information provided by Bak AGBak AG became a..
Deflection Temperature at 8.0 MPa	105 °C	221 °F	ISO 75-2
Hexion Bakelite™ X22 Phenolic Formaldehyde Resin, UL Listed (discontinued **) Phenolic molding compound, mainly organically filled, UL listed molding compound 3.0 mm/V-0 (BN, BK).Application areas: Pot handles, operating controls, electrical isolators, housing parts.Informati..
Deflection Temperature at 8.0 MPa	105 °C	221 °F	ISO 75-2
Hexion Bakelite™ X24 Phenolic Formaldehyde Resin (discontinued **) Phenolic molding compound, mainly organically filled.Application areas: Operating controls, housing parts, lamp holders.Information provided by Bak AGBak AG became a part of Hexion in 2005.
Deflection Temperature at 8.0 MPa	105 °C	221 °F	ISO 75-2
Hexion Bakelite™ X30 Phenolic Formaldehyde Resin (discontinued **) Phenolic molding compound, reinforced with cotton and sisal fibers, increased notched impact strength.Application areas: Covers for electrical and electromagnetic devices.Information provided by Bak..
Deflection Temperature at 8.0 MPa	105 - 160 °C	221 - 320 °F	Average value: 131 °C Grade Count:18
Overview of materials for Nylon 12, 50% Glass Fiber Filled This property data is a summary of similar materials in the MatWeb database for the category "Nylon 12, 50% Glass Fiber Filled". Specific grades with glass content between 45% and 54% are included. ..
Deflection Temperature at 8.0 MPa	105 °C	221 °F	ISO 75-1/-2
EMS-Grivory Grivory® TRVX-50X9 black 9230 PAMACM12-GF50 Product description: Grilamid TRVX-50X9 is a 50% glass fiber reinforced amorphous polyamide. This product shows a very low tendency of distortion and is therefore especially suitable for complex and..
Deflection Temperature at 8.0 MPa	105 °C	221 °F	ISO 75-1/-2
EMS-Grivory Grivory® TRVX-50X9 nat PAMACM12-GF50 Product description: Grilamid TRVX-50X9 is a 50% glass fiber reinforced amorphous polyamide. This product shows a very low tendency of distortion and is therefore especially suitable for complex and..