Songhan Plastic Technology Co.,Ltd.

Epoxy Technology EPO-TEK® P1011S Electrically Conductive Modified Polyimide

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy, Electrically Conductive , Polyimide, TS
Manufacturer Epoxy Technology
Trade Name EPO-TEK®
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Epoxy Technology EPO-TEK® P1011S Electrically Conductive Modified Polyimide.pdf
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Material Notes:
Product Description: EPO-TEK® P1011S is a single component, modified polyimide, high temperature grade, silver-filled electrically and thermally conductive adhesive designed for semiconductor die-attach and hybrid microelectronic packaging. Advantages & Application Notes: It is a lower viscosity version of EPO-TEK® P1011 for improved die-stamping or pin transfer process methodsSuggested applications in hybrid micro-electronics:Resisting ceramic or metal SMD lid sealing processes >300°C.Die attaching quartz crystal oscillators to the Au post of TO-cans or Au/ pads on ceramic PCBs.Down-hole petrochemical circuitsAtomic clocks, microwave or millimeter wave circuitsDie-attaching LED and EEPROM chips inside alpha numeric displays, resisting glass lid-sealing processes >300°C.A two-step cure is suggested for optimal adhesive properties.Available in alternative viscositiesInformation Provided by Epoxy Technology
Physical Properties Metric English Comments
Specific Gravity 2.44 g/cc
2.44 g/cc
Particle Size <= 20 µm
<= 20 µm
Viscosity 6500 - 10500 cP

@Temperature 23.0 °C
6500 - 10500 cP

@Temperature 73.4 °F
20 rpm
Mechanical Properties Metric English Comments
Hardness, Shore D 71
Tensile Modulus 4.41 GPa
639 ksi
Shear Strength >= 9.38 MPa
>= 1360 psi
Thermal Properties Metric English Comments
CTE, linear 28.0 µm/m-°C
15.6 µin/in-°F
Below Tg
57.0 µm/m-°C
31.7 µin/in-°F
Above Tg
Thermal Conductivity >= 2.78 W/m-K
>= 19.3 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 225 °C
437 °F
325 °C
617 °F
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
-55.0 °C
-67.0 °F
Glass Transition Temp, Tg >= 100 °C
>= 212 °F
Ramp 40°C/Min to 300°C
Decomposition Temperature 379 °C
714 °F
Degradation Temperature
Electrical Properties Metric English Comments
Volume Resistivity <= 0.00050 ohm-cm
<= 0.00050 ohm-cm
Processing Properties Metric English Comments
Dry Time <= 168 hour
<= 168 hour
Cure Time 30.0 min

@Temperature 80.0 °C
0.500 hour

@Temperature 176 °F
Pre-Bake, Minimum Bond Line
90.0 min

@Temperature 285 °C
1.50 hour

@Temperature 545 °F
Post-Cure, Minimum Bond Line
Shelf Life 12.0 Month

@Temperature 25.0 °C
12.0 Month

@Temperature 77.0 °F
Descriptive Properties Value Comments
Color Silver
Consistency Smooth slightly thixotropic paste
Number of Components Single
Thixotropic Index 1.8
Weight Loss 0.08%
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