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Polymer Property : Minimum Service Temperature, Air = -55.0 °C Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
| Parker Chomerics THERM-A-GAP™ GEL 8010 High Performance Fully Cured Dispensable Gel Description: Parker Chomerics fully cured dispensable GELs eliminate time consuming hand assembly, decreasing installation costs and reducing customer manufacturing and purchasing (logistical) compl.. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
| Parker Chomerics WIN-SHIELD™ P (Polycarbonate) EMI Shielded Window Description: Parker Chomerics display windows and filters are available in various plastic materials, including polycarbonate, acrylic and cast polycarbonate. A unique feature of Parker Chomerics w.. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
| Parker Chomerics Tecknit Teckfip™ HC FIP-E Formed in Place Conductive Elastomer Heat cure compound. Commercial grade FIP compound designed for moderate shielding performance. The Ag/glass particles are very smooth which leads to very low compression set value.Information provid.. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
| Fujipoly Industries Zebra® 2005 Carbon Sponge Self-Supported Connectors Fujipoly Carbon Zebra Connectors and Low Temperature Carbon Zebra Connectors consist of alternating layers of conductive carbon filled and non-conductive silicone rubber. Contact density of the carb.. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
| ITW Plexus Plexusâ„¢ MA422 Methacrylate Adhesive Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.All purpose adhesive, medium open time.Information provided by Illinois Tool Works. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
| Cytec EN-2534 (Conap) Potting and Encapsulation Adhesive Polyurethane Potting and Encapsulating SystemsConathane® EN-2500 series polyurethane potting and encapsulating systems from Cytek have varying degrees of worklife, viscosity and hardness for many s.. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
| Epoxy Technology EPO-TEK® 302-3M Optically Transparent Epoxy Product Description: EPO-TEK® 302-3M is a two component epoxy used for optical, medical, fiber optic, and semiconductor applications. The epoxy is good for adhesive joining, sealing, potting, or as.. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
| Epoxy Technology EPO-TEK® 320-3 Optically Opaque Epoxy Material Description: A two component, black-colored and optically opaque epoxy designed for optical, medical, and opto-electronic packaging of semiconductor devices and components. It is a modific.. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
| Epoxy Technology EPO-TEK® 360 Low Viscosity Optical Epoxy Adhesive Product Description: EPO-TEK® 360 is a two component, high-temperature grade epoxy for semiconductor, electronics, fiber optics and medical applications.Advantages & Application Notes: Built in col.. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
| Epoxy Technology EPO-TEK® 377 High Temperature Epoxy Product Description: EPO TEK®377 is a two component, high Tg, fiber optic grade epoxy adhesive. It is well suited for semiconductor, medical and optical applications.Advantages & Application Notes:.. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
| Epoxy Technology EPO-TEK® 431 Copper Filled Epoxy A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for interconnecting, grounding and EMI RF shielding... |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
| Epoxy Technology EPO-TEK® E4110 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E4110 is an electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80°C, although other.. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
| Epoxy Technology EPO-TEK® EE149-6 Epoxy Material Description: A single component, silver-filled, B-stageable epoxy designed for semiconductor flip chip packaging or hybrid micro-electronic substrate attach or lid-sealing.Information Provi.. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
| Epoxy Technology EPO-TEK® EE149-6 Epoxy Material Description: A single component, silver-filled, B-stageable epoxy designed for semiconductor flip chip packaging or hybrid micro-electronic substrate attach or lid-sealing.Information Provi.. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
| Epoxy Technology EPO-TEK® OE120 Two Component Epoxy Material Description: A two component, opaque epoxy, designed for fiber optics packaging applications. It is a black-colored version of EPO-TEK 353ND-T. It has a high Tg for resisting elevated ope.. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
| Epoxy Technology EPO-TEK® OG133-8 UV Cure Optical Epoxy Material Description: A single component, UV curable, thixotropic flexible epoxy adhesive/encapsulant designed for semiconductor and opto-electronic packaging. Glob top over IC and wire bonds, and .. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
| Epoxy Technology EPO-TEK® OG142 UV Cure Optical Epoxy Material Description: A single component, UV curable epoxy, designed for adhesive, sealing, and encapsulating applications found in semiconductor, electro-optics, fiber optics, medical, and scientif.. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
| Epoxy Technology EPO-TEK® OG159-2 UV Cure Optical Epoxy Material Description: A single component, high viscosity, UV curable epoxy adhesive designed for sealing glass plates together in the LCD/OLED/display industry. It contains 1mil glass beads for bon.. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
| Epoxy Technology EPO-TEK® P1011 Electrically Conductive Modified Polyimide Product Description: EPO-TEK® P-1011 is a single component, modified polyimide, silver-filled adhesive designed for chip bonding in microelectronic and optoelectronic applications.Advantages & Appl.. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
| Epoxy Technology EPO-TEK® TV1002 Polyimide Adhesive Material Description: A single component, screen printable polyimide adhesive designed for semiconductor wafer passivation applications. It is a high temperature chemistry capable of resisting >400.. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
| Epoxyset Epoxibond EB-106 Unfilled Epoxy Adhesive A two-component, unfilled epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.Information provided by Epoxyset Inc. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
| Epoxyset Epoxibond EB-301 Low Expansion Epoxy Adhesive EB-301 is a highly filled, low expansion, epoxy adhesive. This low out-gassing adhesive exhibits excellent wettability without preheating metal bonding surfaces and has a good dimensional stability .. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
| Epoxy Technology EPO-TEK® H20E-175 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-175 is a two component epoxy designed for semiconductor die-attach. It is a higher Tg version of EPO-TEK® H20E. It was designed to be used in semiconductor / J.. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
| ACC QSil 40 QSI Quantum Silicones 40 Durometer Condensation Cure for Potting QSil 40 is a general purpose two-part, room temperature, condensation cure siloxane elastomer. The two applicable catalysts are 0.5% DBT by weight and 10% Deep Section Catalyst by weight. Cure speed.. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
| Aremco Aremco-Bond™ 2315 High Performance Epoxide High Temperature, Low Viscosity, Potting Compound for Electrical Applications. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
| Tra-Con Tra-Bond 724-17GR1B3 Polyurethane Adhesive TRA-BOND 724-17GR1B3 premixed and frozen polyurethane adhesive is designed for good adhesion, providing strong resilient bonds to a wide variety of substrates, including aluminum, solder, nylon, myl.. |
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