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Polymer Property : Glass Transition Temp, Tg = 212 °F Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Glass Transition Temp, Tg | 100 °C | 212 °F | ISO 11357-1 |
| Murtfeldt Murinit® SP Polyphenylene Sulfide Thanks to the low fiber content and integrated solid lubricant, Murinit® SP offers an excellent combination of good slide and wear behavior, high strength, and dimensional stability – even at high.. |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | 10°C/min; ISO 11357-1/-2 |
| DuPont Performance Polymers Rynite® RE19051 BK507 PET
(Unverified Data**) Rynite® RE19051 BK507 is a 40% glass and mineral reinforced, flame retardant, polyethylene terephthalate black resin.Information provided by DuPont Performance Polymers |
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| Glass Transition Temp, Tg | 100 - 110 °C | 212 - 230 °F | |
| Hybrid Plastics POSS® EP 1000 Epoxy Adhesive EP1000 is a POSS® based epoxy adhesive with outstanding oxidative resistance to ozone, plasma, or atomic oxygen environments. The EP1000 POSS® Epoxy is also well-suited for peroxide and steam... |
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| Glass Transition Temp, Tg | 100 - 110 °C | 212 - 230 °F | |
| Hybrid Plastics POSS® EP 1050 Epoxy Adhesive EP1050 is a POSS® based, high-temperature epoxy adhesive with outstanding resistance to ozone, plasma, or atomic oxygen environments. Major applications include medical devices, optics, semicondu.. |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | |
| Lucite International Elvacite ® 3001 Acrylic Resin Elvacite® 3001 is a medium viscosity, methyl methacrylate based resin for use in plastic and vinyl coatings and inks.Information provided by Lucite International |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | |
| Styron DL 220 Plastic Pigment Performance Features: High stiffness, fast solvent penetrationApplications: Leather BindingEuropeInformation provided by Styron |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | JIS K7121 |
| Zeon Chemicals Zeonor® 1060R Cyclo Olefin Polymer Zeonor® is a line of thermoplastic polyolefin resin with an excellent combination of optical and electronic properties. These unique Cyclo Olefin Polymer (COP) was developed by Zeon Corporation usi.. |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | DMA |
| Hexcel® HexPly® ES70 120°C Curing Epoxy Matrix HexPly® ES70 is a structural epoxy resin particularly well adapted to low pressure molding processes. This system is versatile and allows a polymerization from 100°C (212°F) up to 150°C (302°F).. |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | Ultimate Tg |
| Tra-Con Tra-Bond FDA15 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-15 is a low viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Adminis.. |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | Onset, Cure Temperature: 100°C, Cure Time: 90 min |
| Hexcel® HexPly® M52 120°C/250°F Curing Epoxy HexPly® M52 is a modified epoxy matrix with good mechanical and temperature performance, specifically designed for rapid press curing. HexPly® M52 is ideal for small to high volume industrial appl.. |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | DSC |
| Eastman Sahara Film Sahara Films are developed for use in applications where increased temperature resistance is desired.Applications/UsesHigh temperature printable films |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® 323LP Epoxy Material Description: Longer pot life version of EPO-TEK® 353ND designed for semiconductor, hybrid, fiber-optic, hard-disk drive and medical applications.Information Provided by Epoxy Technology |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® 375 High Temperature Epoxy Product Description: EPO-TEK®375 is a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications. Also available in a single component frozen sy.. |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® 383ND High Temperature Epoxy Material Description: A slightly longer pot life version of EPO-TEK®353ND designed for high temperature, optical and structural applications inside the semiconductor, hybrid, electronic, fiber opti.. |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® E3001-HV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & .. |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® E3035T-2 Electrically Conductive Epoxy Product Description: EPO-TEK® E3035T-2 is a single component, silver-filled epoxy for semiconductor die attach, as well as SMD attach on hybrid circuits.Advantages & Application Notes: This epoxy c.. |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® H24 Electrically Conductive Epoxy Product Description: EPO-TEK® H24 is a two component, electrically and thermally conductive epoxy adhesive designed for semiconductor die attach and hybrid micro-electronics assembly.Advantages & A.. |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® H44 Gold-Filled, Electrically Conductive Epoxy Product Description: EPO-TEK® H44 is a single component, gold-filled, electrically conductive epoxy adhesive designed for hybrid microelectronic packaging.Advantages & Application Notes: High visco.. |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® H81A Epoxy Material Description: A two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging.Information Provided by Epoxy Technolo.. |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® OE100-T High Temperature Epoxy Material Description: A two component, high Tg, high temperature grade epoxy designed for semiconductor, underfill, hard-disk drive and hybrid micro-electronics packaging applications. The epoxy ca.. |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Ramp 40°C/Min to 300°C |
| Epoxy Technology EPO-TEK® P1011S Electrically Conductive Modified Polyimide Product Description: EPO-TEK® P1011S is a single component, modified polyimide, high temperature grade, silver-filled electrically and thermally conductive adhesive designed for semiconductor die-a.. |
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| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® E3035 Electrically Conductive Adhesive Product Description: EPO-TEK® E3035 is a single component, silver-filled epoxy for hybrid die and component attach.Advantages & Application Notes: Performs exceptionally well as a die attach for sm.. |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | |
| BASF Polystyrol® 168 N Polystyrene (Europe) High molecular, heat-resistant grades used where high strength is required. Suitable for expanded film.Data was collected by ISO methods and provided by BASF. |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | ASTM D7426 |
| Perstorp Compounds Akestra™ 110 Thermoplastic Copolyester Transparent sparkling glass-like appearance. Suitable for films, sheets, blow molding, foams and injection molding. It can be used as a polystyrene alternative for heat resistant thin wall contain.. |
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| Glass Transition Temp, Tg | 100 °C | 212 °F | |
| Eastman Tenite 383A-12 CAP Cellulose Acetate Propionate
(discontinued **) 12% Plasticized. ISO data as provided by the manufacturer, Eastman Chemical. |
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