- HOME
- POLYMER SEARCH
- Polymer Property : Glass Transition Temp, Tg = 212 °F
Polymer Property : Glass Transition Temp, Tg = 212 °F Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Glass Transition Temp, Tg | 100 °C | 212 °F | |
| NextGen Adhesives P907-03 Fiber Optic Adhesive Description: NGAC P907-03 is a low viscosity and room temperature curing adhesive specifically formulated for fiber optic terminations.Advantages and Applications: Uses include the termination of si.. |
|||
| Glass Transition Temp, Tg | 100 °C | 212 °F | 10°C/min; ISO 11357-1/-2 |
| DuPont Performance Polymers Rynite® RE19051 BK507 PET
(Unverified Data**) Rynite® RE19051 BK507 is a 40% glass and mineral reinforced, flame retardant, polyethylene terephthalate black resin.Information provided by DuPont Performance Polymers |
|||
| Glass Transition Temp, Tg | 100 °C | 212 °F | |
| Eastman Tenite 130-33 Cellulose Acetate
(discontinued **) 33% Plasticized, contains 100% fiber grade ester.ISO data as provided by the manufacturer, Eastman Chemical. |
|||
| Glass Transition Temp, Tg | 100 - 110 °C | 212 - 230 °F | |
| Hybrid Plastics POSS® EP 1000 Epoxy Adhesive EP1000 is a POSS® based epoxy adhesive with outstanding oxidative resistance to ozone, plasma, or atomic oxygen environments. The EP1000 POSS® Epoxy is also well-suited for peroxide and steam... |
|||
| Glass Transition Temp, Tg | 100 °C | 212 °F | |
| Lucite International Elvacite ® 3001 Acrylic Resin Elvacite® 3001 is a medium viscosity, methyl methacrylate based resin for use in plastic and vinyl coatings and inks.Information provided by Lucite International |
|||
| Glass Transition Temp, Tg | 100 °C | 212 °F | |
| Zeon Chemicals Zeonor® 1060R Cyclo-Olefin Polymer Zeonor 1020R shall be in the form of pellets. |
|||
| Glass Transition Temp, Tg | 100 °C | 212 °F | |
| Zeus PFA Tubing PFA, or perfluoroalkoxy, is well recognized for its ability to maintain mechanical integrity in extreme temperatures even when exposed to caustic chemicals. PFA comes in high purity versions that ar.. |
|||
| Glass Transition Temp, Tg | 100 °C | 212 °F | DMA |
| Hexcel® HexPly® ES70 120°C Curing Epoxy Matrix HexPly® ES70 is a structural epoxy resin particularly well adapted to low pressure molding processes. This system is versatile and allows a polymerization from 100°C (212°F) up to 150°C (302°F).. |
|||
| Glass Transition Temp, Tg | 100 °C | 212 °F | Ultimate Tg |
| Tra-Con Tra-Bond 931-1 Low Viscosity Encapsulant TRA-BOND 931-1 low viscosity epoxy encapsulant is designed for high reliability applications, where capillary action is desired. This encapsulant provides environmental and mechanical protection.Inf.. |
|||
| Glass Transition Temp, Tg | 100 °C | 212 °F | Ultimate Tg |
| Tra-Con Tra-Bond FDA15 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-15 is a low viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Adminis.. |
|||
| Glass Transition Temp, Tg | 100 °C | 212 °F | Onset, Cure Temperature: 100°C, Cure Time: 90 min |
| Hexcel® HexPly® M52 120°C/250°F Curing Epoxy HexPly® M52 is a modified epoxy matrix with good mechanical and temperature performance, specifically designed for rapid press curing. HexPly® M52 is ideal for small to high volume industrial appl.. |
|||
| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® 323LP Epoxy Material Description: Longer pot life version of EPO-TEK® 353ND designed for semiconductor, hybrid, fiber-optic, hard-disk drive and medical applications.Information Provided by Epoxy Technology |
|||
| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® E3001-HV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & .. |
|||
| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® E3035T-2 Electrically Conductive Epoxy Product Description: EPO-TEK® E3035T-2 is a single component, silver-filled epoxy for semiconductor die attach, as well as SMD attach on hybrid circuits.Advantages & Application Notes: This epoxy c.. |
|||
| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® H24 Electrically Conductive Epoxy Product Description: EPO-TEK® H24 is a two component, electrically and thermally conductive epoxy adhesive designed for semiconductor die attach and hybrid micro-electronics assembly.Advantages & A.. |
|||
| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—300°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® H35-175MPT Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H35MPT is a single component, silver-filled, electrically conductive epoxy designed for military hybrid die and component attach. High viscosity version of EPO-TEK® H.. |
|||
| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® H44 Gold-Filled, Electrically Conductive Epoxy Product Description: EPO-TEK® H44 is a single component, gold-filled, electrically conductive epoxy adhesive designed for hybrid microelectronic packaging.Advantages & Application Notes: High visco.. |
|||
| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® H81A Epoxy Material Description: A two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging.Information Provided by Epoxy Technolo.. |
|||
| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® OE100-T High Temperature Epoxy Material Description: A two component, high Tg, high temperature grade epoxy designed for semiconductor, underfill, hard-disk drive and hybrid micro-electronics packaging applications. The epoxy ca.. |
|||
| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Ramp 40°C/Min to 300°C |
| Epoxy Technology EPO-TEK® P1011S Electrically Conductive Modified Polyimide Product Description: EPO-TEK® P1011S is a single component, modified polyimide, high temperature grade, silver-filled electrically and thermally conductive adhesive designed for semiconductor die-a.. |
|||
| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® E3035 Electrically Conductive Adhesive Product Description: EPO-TEK® E3035 is a single component, silver-filled epoxy for hybrid die and component attach.Advantages & Application Notes: Performs exceptionally well as a die attach for sm.. |
|||
| Glass Transition Temp, Tg | 100 °C | 212 °F | |
| BASF Polystyrol® 168 N Polystyrene (Europe) High molecular, heat-resistant grades used where high strength is required. Suitable for expanded film.Data was collected by ISO methods and provided by BASF. |
|||
| Glass Transition Temp, Tg | 100 °C | 212 °F | |
| BASF Polystyrol® 158 K Polystyrene (Global) Heat-resistant, rapid freezing general-purpose grade. Suitable for expanded film and for blending with Styrolux and impact-modified Polystyrol in heat contact applications (e.g. coffee cups).Data w.. |
|||
| Glass Transition Temp, Tg | 100 °C | 212 °F | ASTM D7426 |
| Perstorp Compounds Akestra™ 110 Thermoplastic Copolyester Transparent sparkling glass-like appearance. Suitable for films, sheets, blow molding, foams and injection molding. It can be used as a polystyrene alternative for heat resistant thin wall contain.. |
|||
| Glass Transition Temp, Tg | 100 °C | 212 °F | |
| Eastman Tenite 383A-12 CAP Cellulose Acetate Propionate
(discontinued **) 12% Plasticized. ISO data as provided by the manufacturer, Eastman Chemical. |
|||
Copyright © lookpolymers.com All Rights Reserved