- HOME
- POLYMER SEARCH
- Polymer Property : Glass Transition Temp, Tg = 212 °F
Polymer Property : Glass Transition Temp, Tg = 212 °F Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Glass Transition Temp, Tg | 100 °C | 212 °F | ISO 11357-1 |
| Murtfeldt Murinit® SP Polyphenylene Sulfide Thanks to the low fiber content and integrated solid lubricant, Murinit® SP offers an excellent combination of good slide and wear behavior, high strength, and dimensional stability – even at high.. |
|||
| Glass Transition Temp, Tg | 100 °C | 212 °F | 10°C/min; ISO 11357-1/-2 |
| DuPont Performance Polymers Rynite® RE19051 BK507 PET
(Unverified Data**) Rynite® RE19051 BK507 is a 40% glass and mineral reinforced, flame retardant, polyethylene terephthalate black resin.Information provided by DuPont Performance Polymers |
|||
| Glass Transition Temp, Tg | 100 - 110 °C | 212 - 230 °F | |
| Hybrid Plastics POSS® EP 1000 Epoxy Adhesive EP1000 is a POSS® based epoxy adhesive with outstanding oxidative resistance to ozone, plasma, or atomic oxygen environments. The EP1000 POSS® Epoxy is also well-suited for peroxide and steam... |
|||
| Glass Transition Temp, Tg | 100 - 110 °C | 212 - 230 °F | |
| Hybrid Plastics POSS® EP 1050 Epoxy Adhesive EP1050 is a POSS® based, high-temperature epoxy adhesive with outstanding resistance to ozone, plasma, or atomic oxygen environments. Major applications include medical devices, optics, semicondu.. |
|||
| Glass Transition Temp, Tg | 100 °C | 212 °F | |
| Lucite International Elvacite ® 3001 Acrylic Resin Elvacite® 3001 is a medium viscosity, methyl methacrylate based resin for use in plastic and vinyl coatings and inks.Information provided by Lucite International |
|||
| Glass Transition Temp, Tg | 100 °C | 212 °F | |
| Styron DL 220 Plastic Pigment Performance Features: High stiffness, fast solvent penetrationApplications: Leather BindingEuropeInformation provided by Styron |
|||
| Glass Transition Temp, Tg | 100 °C | 212 °F | DSC |
| Wolf Kunststoff ZEDEX® ZX-530CD3 031 Polymer Alloy, Fiber Reinforced and PTFE Modified Main Characteristics: Dimensionally stable and rigid; Stress resistant; Extremely low wear to 100 ° CApplications: Chemical Engineering; Laboratory Technology; Automitve Technology; Machine ToolsIn.. |
|||
| Glass Transition Temp, Tg | 100 °C | 212 °F | JIS K7121 |
| Zeon Chemicals Zeonor® 1060R Cyclo Olefin Polymer Zeonor® is a line of thermoplastic polyolefin resin with an excellent combination of optical and electronic properties. These unique Cyclo Olefin Polymer (COP) was developed by Zeon Corporation usi.. |
|||
| Glass Transition Temp, Tg | 100 °C | 212 °F | |
| Zeus PFA Tubing PFA, or perfluoroalkoxy, is well recognized for its ability to maintain mechanical integrity in extreme temperatures even when exposed to caustic chemicals. PFA comes in high purity versions that ar.. |
|||
| Glass Transition Temp, Tg | 100 °C | 212 °F | DMA |
| Hexcel® HexPly® ES70 120°C Curing Epoxy Matrix HexPly® ES70 is a structural epoxy resin particularly well adapted to low pressure molding processes. This system is versatile and allows a polymerization from 100°C (212°F) up to 150°C (302°F).. |
|||
| Glass Transition Temp, Tg | 100 °C | 212 °F | Onset, Cure Temperature: 100°C, Cure Time: 90 min |
| Hexcel® HexPly® M52 120°C/250°F Curing Epoxy HexPly® M52 is a modified epoxy matrix with good mechanical and temperature performance, specifically designed for rapid press curing. HexPly® M52 is ideal for small to high volume industrial appl.. |
|||
| Glass Transition Temp, Tg | 100 °C | 212 °F | |
| Hexcel® HexPly® M32 Epoxy Matrix HexPly® M32 is specifically designed for prepreg applications with fabrics and short curing cycles for sporting (e.g. ski and snowboard production) and industrial applications. HexPly® M32 compris.. |
|||
| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® 375 High Temperature Epoxy Product Description: EPO-TEK®375 is a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications. Also available in a single component frozen sy.. |
|||
| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® 383ND High Temperature Epoxy Material Description: A slightly longer pot life version of EPO-TEK®353ND designed for high temperature, optical and structural applications inside the semiconductor, hybrid, electronic, fiber opti.. |
|||
| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® E2001-HV Electrically Conductive, Silver-Filled Epoxy Product Description: EPO-TEK® E2001-HV Is a snap cure, two component, silver-filled die attach adhesive for semiconductor plastic IC packaging.Advantages & Application Notes:Snap cure adhesive or f.. |
|||
| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® E3001-6 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & .. |
|||
| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® E3001-HV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & .. |
|||
| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® E3035T-2 Electrically Conductive Epoxy Product Description: EPO-TEK® E3035T-2 is a single component, silver-filled epoxy for semiconductor die attach, as well as SMD attach on hybrid circuits.Advantages & Application Notes: This epoxy c.. |
|||
| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® H81A Epoxy Material Description: A two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging.Information Provided by Epoxy Technolo.. |
|||
| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Ramp 40°C/Min to 300°C |
| Epoxy Technology EPO-TEK® P1011 Electrically Conductive Modified Polyimide Product Description: EPO-TEK® P-1011 is a single component, modified polyimide, silver-filled adhesive designed for chip bonding in microelectronic and optoelectronic applications.Advantages & Appl.. |
|||
| Glass Transition Temp, Tg | 100 °C | 212 °F | |
| Armstrong A-5/E Epoxy Adhesive Information provided by Ellsworth Adhesives. |
|||
| Glass Transition Temp, Tg | 100 °C | 212 °F | |
| BASF Polystyrol® 168 N Polystyrene (Europe) High molecular, heat-resistant grades used where high strength is required. Suitable for expanded film.Data was collected by ISO methods and provided by BASF. |
|||
| Glass Transition Temp, Tg | 100 °C | 212 °F | |
| Atom Adhesives AA-BOND FDA15 Epoxy Adhesive AA-BOND FDA15 is a low viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Administr.. |
|||
| Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Atom Adhesives AA-BOND G298 Epoxy Adhesive AA-BOND G298 is a two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging.Appearance: Resin: Brown, Hardener: Dark Bro.. |
|||
| Glass Transition Temp, Tg | 100 °C | 212 °F | |
| BASF Polystyrol® 158 K Polystyrene (Global) Heat-resistant, rapid freezing general-purpose grade. Suitable for expanded film and for blending with Styrolux and impact-modified Polystyrol in heat contact applications (e.g. coffee cups).Data w.. |
|||
| Glass Transition Temp, Tg | 100 °C | 212 °F | ASTM D7426 |
| Perstorp Compounds Akestra™ 100 Thermoplastic Copolyester Excellent appearance, clarity, hydrolytic stability, heat resistance and high strength. Used for extrusion and injection molded articles, blow molding, films and sheets. It can be used as a polyst.. |
|||
Copyright © lookpolymers.com All Rights Reserved