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Polymer Property : Glass Transition Temp, Tg = 212 °F Product List

Thermal Properties

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Thermal Properties Metric English Comments
Glass Transition Temp, Tg 100 °C
212 °F
ISO 11357-1
Murtfeldt Murinit® SP Polyphenylene Sulfide
Thanks to the low fiber content and integrated solid lubricant, Murinit® SP offers an excellent combination of good slide and wear behavior, high strength, and dimensional stability – even at high..
Glass Transition Temp, Tg 100 °C
212 °F
10°C/min; ISO 11357-1/-2
DuPont Performance Polymers Rynite® RE19051 BK507 PET  (Unverified Data**)
Rynite® RE19051 BK507 is a 40% glass and mineral reinforced, flame retardant, polyethylene terephthalate black resin.Information provided by DuPont Performance Polymers
Glass Transition Temp, Tg 100 - 110 °C
212 - 230 °F
Hybrid Plastics POSS® EP 1000 Epoxy Adhesive
EP1000 is a POSS® based epoxy adhesive with outstanding oxidative resistance to ozone, plasma, or atomic oxygen environments. The EP1000 POSS® Epoxy is also well-suited for peroxide and steam...
Glass Transition Temp, Tg 100 - 110 °C
212 - 230 °F
Hybrid Plastics POSS® EP 1050 Epoxy Adhesive
EP1050 is a POSS® based, high-temperature epoxy adhesive with outstanding resistance to ozone, plasma, or atomic oxygen environments. Major applications include medical devices, optics, semicondu..
Glass Transition Temp, Tg 100 °C
212 °F
Lucite International Elvacite ® 3001 Acrylic Resin
Elvacite® 3001 is a medium viscosity, methyl methacrylate based resin for use in plastic and vinyl coatings and inks.Information provided by Lucite International
Glass Transition Temp, Tg 100 °C
212 °F
Styron DL 220 Plastic Pigment
Performance Features: High stiffness, fast solvent penetrationApplications: Leather BindingEuropeInformation provided by Styron
Glass Transition Temp, Tg 100 °C
212 °F
JIS K7121
Zeon Chemicals Zeonor® 1060R Cyclo Olefin Polymer
Zeonor® is a line of thermoplastic polyolefin resin with an excellent combination of optical and electronic properties. These unique Cyclo Olefin Polymer (COP) was developed by Zeon Corporation usi..
Glass Transition Temp, Tg 100 °C
212 °F
DMA
Hexcel® HexPly® ES70 120°C Curing Epoxy Matrix
HexPly® ES70 is a structural epoxy resin particularly well adapted to low pressure molding processes. This system is versatile and allows a polymerization from 100°C (212°F) up to 150°C (302°F)..
Glass Transition Temp, Tg 100 °C
212 °F
Ultimate Tg
Tra-Con Tra-Bond FDA15 Food and Drug Application Epoxy Adhesive
TRA-BOND FDA-15 is a low viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Adminis..
Glass Transition Temp, Tg 100 °C
212 °F
Onset, Cure Temperature: 100°C, Cure Time: 90 min
Hexcel® HexPly® M52 120°C/250°F Curing Epoxy
HexPly® M52 is a modified epoxy matrix with good mechanical and temperature performance, specifically designed for rapid press curing. HexPly® M52 is ideal for small to high volume industrial appl..
Glass Transition Temp, Tg 100 °C
212 °F
DSC
Eastman Sahara Film
Sahara Films are developed for use in applications where increased temperature resistance is desired.Applications/UsesHigh temperature printable films
Glass Transition Temp, Tg >= 100 °C
>= 212 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Epoxy Technology EPO-TEK® 323LP Epoxy
Material Description: Longer pot life version of EPO-TEK® 353ND designed for semiconductor, hybrid, fiber-optic, hard-disk drive and medical applications.Information Provided by Epoxy Technology
Glass Transition Temp, Tg >= 100 °C
>= 212 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Epoxy Technology EPO-TEK® 375 High Temperature Epoxy
Product Description: EPO-TEK®375 is a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications. Also available in a single component frozen sy..
Glass Transition Temp, Tg >= 100 °C
>= 212 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Epoxy Technology EPO-TEK® 383ND High Temperature Epoxy
Material Description: A slightly longer pot life version of EPO-TEK®353ND designed for high temperature, optical and structural applications inside the semiconductor, hybrid, electronic, fiber opti..
Glass Transition Temp, Tg >= 100 °C
>= 212 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Epoxy Technology EPO-TEK® E3001-HV Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & ..
Glass Transition Temp, Tg >= 100 °C
>= 212 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Epoxy Technology EPO-TEK® E3035T-2 Electrically Conductive Epoxy
Product Description: EPO-TEK® E3035T-2 is a single component, silver-filled epoxy for semiconductor die attach, as well as SMD attach on hybrid circuits.Advantages & Application Notes: This epoxy c..
Glass Transition Temp, Tg >= 100 °C
>= 212 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Epoxy Technology EPO-TEK® H24 Electrically Conductive Epoxy
Product Description: EPO-TEK® H24 is a two component, electrically and thermally conductive epoxy adhesive designed for semiconductor die attach and hybrid micro-electronics assembly.Advantages & A..
Glass Transition Temp, Tg >= 100 °C
>= 212 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Epoxy Technology EPO-TEK® H44 Gold-Filled, Electrically Conductive Epoxy
Product Description: EPO-TEK® H44 is a single component, gold-filled, electrically conductive epoxy adhesive designed for hybrid microelectronic packaging.Advantages & Application Notes: High visco..
Glass Transition Temp, Tg >= 100 °C
>= 212 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Epoxy Technology EPO-TEK® H81A Epoxy
Material Description: A two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging.Information Provided by Epoxy Technolo..
Glass Transition Temp, Tg >= 100 °C
>= 212 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Epoxy Technology EPO-TEK® OE100-T High Temperature Epoxy
Material Description: A two component, high Tg, high temperature grade epoxy designed for semiconductor, underfill, hard-disk drive and hybrid micro-electronics packaging applications. The epoxy ca..
Glass Transition Temp, Tg >= 100 °C
>= 212 °F
Ramp 40°C/Min to 300°C
Epoxy Technology EPO-TEK® P1011S Electrically Conductive Modified Polyimide
Product Description: EPO-TEK® P1011S is a single component, modified polyimide, high temperature grade, silver-filled electrically and thermally conductive adhesive designed for semiconductor die-a..
Glass Transition Temp, Tg >= 100 °C
>= 212 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Epoxy Technology EPO-TEK® E3035 Electrically Conductive Adhesive
Product Description: EPO-TEK® E3035 is a single component, silver-filled epoxy for hybrid die and component attach.Advantages & Application Notes: Performs exceptionally well as a die attach for sm..
Glass Transition Temp, Tg 100 °C
212 °F
BASF Polystyrol® 168 N Polystyrene (Europe)
High molecular, heat-resistant grades used where high strength is required. Suitable for expanded film.Data was collected by ISO methods and provided by BASF.
Glass Transition Temp, Tg 100 °C
212 °F
ASTM D7426
Perstorp Compounds Akestra™ 110 Thermoplastic Copolyester
Transparent sparkling glass-like appearance. Suitable for films, sheets, blow molding, foams and injection molding. It can be used as a polystyrene alternative for heat resistant thin wall contain..
Glass Transition Temp, Tg 100 °C
212 °F
Eastman Tenite 383A-12 CAP Cellulose Acetate Propionate  (discontinued **)
12% Plasticized. ISO data as provided by the manufacturer, Eastman Chemical.
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