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Polymer Property : Volume Resistivity = 0.00050 ohm-cm Product List

Electrical Properties

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Electrical Properties Metric English Comments
Volume Resistivity 0.00050 ohm-cm
0.00050 ohm-cm
cured 1 hour at 125°C
Resin Technology Group TIGA 908 Gold Bonder - Low Stress Silver Conductive
100 parts resin to 6 parts hardener.TIGA 908 is a low stress, conductive silver filled epoxy adhesive. It is recommended for bonding, and sealing electronic applications which require bonding to gol..
Volume Resistivity 0.00050 ohm-cm
0.00050 ohm-cm
cured 2 min @ 150°C
Tra-Con Tra-Duct 2958 Snap Cure Conductive Silver Epoxy Adhesive
TRA-DUCT 2958 is a two-part, smooth paste of specially refined and processed epoxy and silver components, recommended for electronic, microelectronic and die-attach bonding and sealing applications ..
Volume Resistivity 0.00050 ohm-cm
0.00050 ohm-cm
cured 2 hrs @ 100°C
Tra-Con Tra-Duct 2924 Conductive Silver Epoxy Adhesive
TRA-DUCT 2924 is a two part electrically conductive composition developed for low shrinkage, low resistivity bonding applications where good electrical and physical properties over a wide temperatur..
Volume Resistivity 0.00050 ohm-cm
0.00050 ohm-cm
cured 2 min @ 150°C
Tra-Con Tra-Duct 2956 Low Ion Snap Cure Silver Epoxy Adhesive
TRA-DUCT 2956 is recommended for the bonding and sealing of electronic components where a combination of electrical and mechanical properties are required. This two-part, smooth, paste system of sil..
Volume Resistivity >= 0.00050 ohm-cm
>= 0.00050 ohm-cm
Epoxy Technology EPO-TEK® E2001 Electrically Conductive, Silver-Filled Epoxy
Product Description: EPO-TEK® E2001 is a two component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications using a snap-cure profile. Advantages & Appl..
Volume Resistivity >= 0.00050 ohm-cm
>= 0.00050 ohm-cm
Epoxy Technology EPO-TEK® E2001-HV Electrically Conductive, Silver-Filled Epoxy
Product Description: EPO-TEK® E2001-HV Is a snap cure, two component, silver-filled die attach adhesive for semiconductor plastic IC packaging.Advantages & Application Notes:Snap cure adhesive or f..
Volume Resistivity <= 0.00050 ohm-cm
<= 0.00050 ohm-cm
Epoxy Technology EPO-TEK® E2116 Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® E2116 is a two component, silver-filled and stencil printable electrically conductive adhesive for bonding SMDs onto PCB and substrates. Can be used as a “lead-free”..
Volume Resistivity <= 0.00050 ohm-cm
<= 0.00050 ohm-cm
Epoxy Technology EPO-TEK® E3001-HV Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & ..
Volume Resistivity <= 0.00050 ohm-cm
<= 0.00050 ohm-cm
Epoxy Technology EPO-TEK® E3035T-2 Electrically Conductive Epoxy
Product Description: EPO-TEK® E3035T-2 is a single component, silver-filled epoxy for semiconductor die attach, as well as SMD attach on hybrid circuits.Advantages & Application Notes: This epoxy c..
Volume Resistivity <= 0.00050 ohm-cm
<= 0.00050 ohm-cm
Epoxy Technology EPO-TEK® E3037 Epoxy
Material Description: A single component, electrically conductive, thixotropic silver-filled epoxy for die-attach and SMD-attach inside hybrid microelectronics.Information Provided by Epoxy Technolo..
Volume Resistivity <= 0.00050 ohm-cm
<= 0.00050 ohm-cm
Epoxy Technology EPO-TEK® E4110 Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® E4110 is an electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80°C, although other..
Volume Resistivity <= 0.00050 ohm-cm
<= 0.00050 ohm-cm
Epoxy Technology EPO-TEK® E4110-PFC Electrically Conductive Epoxy
Product Description: EPO-TEK®E4110-PFC is a two-component, silver filled, electrically conductive adhesive designed for semiconductor IC packaging and general electronic assembly. It is a thixotr..
Volume Resistivity <= 0.00050 ohm-cm
<= 0.00050 ohm-cm
Epoxy Technology EPO-TEK® EE149-6 Epoxy
Material Description: A single component, silver-filled, B-stageable epoxy designed for semiconductor flip chip packaging or hybrid micro-electronic substrate attach or lid-sealing.Information Provi..
Volume Resistivity <= 0.00050 ohm-cm
<= 0.00050 ohm-cm
Epoxy Technology EPO-TEK® EV2002 Silver-filled, electrically conductive, flexible epoxy
Material Description: Silver-filled, electrically conductive, flexible epoxyInformation Provided by Epoxy Technology
Volume Resistivity <= 0.00050 ohm-cm
<= 0.00050 ohm-cm
Epoxy Technology EPO-TEK® H20S Electrically Conductive, Silver Epoxy for Die Stamping
Product Description: EPO-TEK® H20S is a modified version of EPO-TEK® H20E, designed primarily for die stamping and dispensing techniques for chip bonding. EPO-TEK®H20S is a highly reliable, two ..
Volume Resistivity <= 0.00050 ohm-cm
<= 0.00050 ohm-cm
Epoxy Technology EPO-TEK® H22 Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H22 is a two component, silver-filled epoxy system designed specifically for die bonding and sealing hybrid circuit packages.Advantages & Application Notes: A smooth, ..
Volume Resistivity <= 0.00050 ohm-cm
<= 0.00050 ohm-cm
Epoxy Technology EPO-TEK® H27D Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H27D is a two component, silver-filled epoxy adhesive designed for semiconductor and hybrid-microelectronic packaging applications.Advantages & Application Notes: Rheo..
Volume Resistivity <= 0.00050 ohm-cm
<= 0.00050 ohm-cm
Epoxy Technology EPO-TEK® H31D Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H31D is a single component, electrically conductive silver epoxy designed for die-bonding of semiconductors, including IC’s, resistors, capacitors, transistors, and d..
Volume Resistivity <= 0.00050 ohm-cm
<= 0.00050 ohm-cm
Epoxy Technology EPO-TEK® H35-175MP Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H35-175MP is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-elec..
Volume Resistivity <= 0.00050 ohm-cm
<= 0.00050 ohm-cm
Epoxy Technology EPO-TEK® H35-175MPLV Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H35-175MPLV is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-el..
Volume Resistivity <= 0.00050 ohm-cm
<= 0.00050 ohm-cm
Epoxy Technology EPO-TEK® H35-175MPT Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H35MPT is a single component, silver-filled, electrically conductive epoxy designed for military hybrid die and component attach. High viscosity version of EPO-TEK® H..
Volume Resistivity <= 0.00050 ohm-cm
<= 0.00050 ohm-cm
Epoxy Technology EPO-TEK® H37-MP Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H37-MP is a single component, electrically conductive, thixotropic silver-filled adhesive for die-attach and SMD attach inside hybrid microelectronic packages. Also av..
Volume Resistivity <= 0.00050 ohm-cm
<= 0.00050 ohm-cm
Epoxy Technology EPO-TEK® P1011 Electrically Conductive Modified Polyimide
Product Description: EPO-TEK® P-1011 is a single component, modified polyimide, silver-filled adhesive designed for chip bonding in microelectronic and optoelectronic applications.Advantages & Appl..
Volume Resistivity <= 0.00050 ohm-cm
<= 0.00050 ohm-cm
Epoxy Technology EPO-TEK® P1011S Electrically Conductive Modified Polyimide
Product Description: EPO-TEK® P1011S is a single component, modified polyimide, high temperature grade, silver-filled electrically and thermally conductive adhesive designed for semiconductor die-a..
Volume Resistivity <= 0.00050 ohm-cm
<= 0.00050 ohm-cm
Epoxy Technology EPO-TEK® E3035 Electrically Conductive Adhesive
Product Description: EPO-TEK® E3035 is a single component, silver-filled epoxy for hybrid die and component attach.Advantages & Application Notes: Performs exceptionally well as a die attach for sm..
Volume Resistivity <= 0.00050 ohm-cm
<= 0.00050 ohm-cm
Epoxy Technology EPO-TEK® H31 Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H31 is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-electronic..
Volume Resistivity <= 0.00050 ohm-cm
<= 0.00050 ohm-cm
Epoxy Technology EPO-TEK® H37-MPT Epoxy
Material Description: A single component, silver-filled and electrically conductive adhesive designed for semiconductor die attach and bonding SMDs for hybrid microelectronic packaging. It is certi..
Volume Resistivity <= 0.00050 ohm-cm
<= 0.00050 ohm-cm
Loctite® 3883 Stencil Print Isotropic Epoxy Adhesive
Electrically Conductive BondersLoctite® Electrically Conductive Adhesives are used in a variety of applications where electrical connectivity is needed, providing a conductive path where traditiona..
Volume Resistivity <= 0.00050 ohm-cm
<= 0.00050 ohm-cm
Loctite® 3889 Rapid Cure Isotropic Epoxy Adhesive
Electrically Conductive BondersLoctite® Electrically Conductive Adhesives are used in a variety of applications where electrical connectivity is needed, providing a conductive path where traditiona..
Volume Resistivity <= 0.00050 ohm-cm
<= 0.00050 ohm-cm
Loctite® 3880 Heat Cure Isotropic Epoxy Adhesive
Electrically Conductive BondersLoctite® Electrically Conductive Adhesives are used in a variety of applications where electrical connectivity is needed, providing a conductive path where traditiona..
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