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Polymer Property : CTE, linear = 57.0 µm/m-°C Product List

Thermal Properties

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Thermal Properties Metric English Comments
CTE, linear 57.0 µm/m-°C

@Temperature 20.0 °C
31.7 µin/in-°F

@Temperature 68.0 °F
ASTM D696
Gharda Chemicals Gafone™ 3100 Polyethersulfone (PES)  (discontinued **)
Characteristics: Excellent Thermal Resistance - Tg 224°C Outstanding Mechanical, Electrical, Flame & Chemical Resistance Very good Hydrolytic & Sterilization Resistance Good Optical Cl..
CTE, linear 57.0 - 170 µm/m-°C

@Temperature 30.0 - 300 °C
31.7 - 94.4 µin/in-°F

@Temperature 86.0 - 572 °F
Average value: 95.7 µm/m-°C Grade Count:9
Overview of materials for Polytetrafluoroethylene (PTFE), Molded
This property data is a summary of similar materials in the MatWeb database for the category "Polytetrafluoroethylene (PTFE), Molded". Each property range of values reported is minimum and maximum v..
CTE, linear 57.0 µm/m-°C

@Temperature -30.0 - 100 °C
31.7 µin/in-°F

@Temperature -22.0 - 212 °F
ASTM D696
LyondellBasell Hostacomâ„¢ CB267 Thermoplastic Polyolefin Elastomer
Description: Hostacomâ„¢ CB267 medium melt flow, 1,600 MPa flexural modulus thermoplastic elastomeric olefin (TEO) resin has an excellent balance of scratch and mar resistance, rigidity and impac..
CTE, linear 57.0 µm/m-°C

@Temperature 40.0 - 130 °C
31.7 µin/in-°F

@Temperature 104 - 266 °F
TMA; ASTM E831
Plenco 2311 Phenolic, Granular, Injection Molded
PLENCO 02311 is a versatile general purpose organic filled phenolic molding compound offering excellent mold processability and optimized cure cycles. PLENCO 02311 is also granulated to provide impr..
CTE, linear 57.0 µm/m-°C

@Temperature 40.0 - 130 °C
31.7 µin/in-°F

@Temperature 104 - 266 °F
TMA; ASTM E831
Plenco 2369 Phenolic, Granular, Injection Molded
PLENCO 02369 is a general purpose, organic filled phenolic molding compound, formulated to minimize the generation of free ammonia for applications that are sensitive to such formation. PLENCO 02369..
CTE, linear 57.0 µm/m-°C
31.7 µin/in-°F
Below Tg
Epoxy Technology EPO-TEK® 377 High Temperature Epoxy
Product Description: EPO TEK®377 is a two component, high Tg, fiber optic grade epoxy adhesive. It is well suited for semiconductor, medical and optical applications.Advantages & Application Notes:..
CTE, linear 57.0 µm/m-°C
31.7 µin/in-°F
Below Tg
Epoxy Technology EPO-TEK® 431 Copper Filled Epoxy
A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for interconnecting, grounding and EMI RF shielding...
CTE, linear 57.0 µm/m-°C
31.7 µin/in-°F
Above Tg
Epoxy Technology EPO-TEK® B9021 Epoxy Paste
Material Description: A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate atta..
CTE, linear 57.0 µm/m-°C
31.7 µin/in-°F
Above Tg
Epoxy Technology EPO-TEK® P1011S Electrically Conductive Modified Polyimide
Product Description: EPO-TEK® P1011S is a single component, modified polyimide, high temperature grade, silver-filled electrically and thermally conductive adhesive designed for semiconductor die-a..
CTE, linear 57.0 µm/m-°C
31.7 µin/in-°F
Below Tg
Epoxy Technology EPO-TEK® TD1001 Thermally Conductive Epoxy
Product Description: EPO-TEK® TD1001 is a single component, thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging.Advantages & Applicat..
CTE, linear 57.0 µm/m-°C
31.7 µin/in-°F
uncured
Atom Adhesives AA-DUCT 2979 Epoxy Adhesive
AA-DUCT 2979 is a fast curing one part epoxy adhesive with superior electrical conductivity and bonding capability. AA-DUCT 2979 has been shown to retain their properties through hundreds of hours o..
CTE, linear 57.0 µm/m-°C
31.7 µin/in-°F
cured
Atom Adhesives AA-DUCT CG2 Epoxy Adhesive
AA-DUCT CG2 is a single component epoxy, formulated with silver coated ceramic that results in lower material costs without adversely sacrificing the properties obtained with a pure silver formulati..
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