Mechanical Properties | Metric | English | Comments |
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Shear Strength | 9.38 MPa | 1360 psi | Die |
Epoxy Technology EPO-TEK® B9021 Epoxy Paste Material Description: A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate atta.. |
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Shear Strength | >= 9.38 MPa | >= 1360 psi | Die |
Epoxy Technology EPO-TEK® B9021-1 Epoxy Paste Material Description: A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate atta.. |
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Shear Strength | >= 9.38 MPa | >= 1360 psi | Die |
Epoxy Technology EPO-TEK® OG142 UV Cure Optical Epoxy Material Description: A single component, UV curable epoxy, designed for adhesive, sealing, and encapsulating applications found in semiconductor, electro-optics, fiber optics, medical, and scientif.. |
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Shear Strength | >= 9.38 MPa | >= 1360 psi | Die |
Epoxy Technology EPO-TEK® P1011S Electrically Conductive Modified Polyimide Product Description: EPO-TEK® P1011S is a single component, modified polyimide, high temperature grade, silver-filled electrically and thermally conductive adhesive designed for semiconductor die-a.. |
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Shear Strength | 9.38 MPa @Temperature 82.0 °C, Time 900 sec |
1360 psi @Temperature 180 °F, Time 0.250 hour |
Aluminum, Overlap |
3M Scotch-Weld™ DP460 NS Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive DP460 Off-White and DP460 NS are high performance, two-part epoxy adhesives offering outstanding shear and peel adhesion and very high levels of durability.Informat.. |