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Polymer Property : Cure Time = 1.50 hour Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 90.0 min @Temperature 82.2 °C |
1.50 hour @Temperature 180 °F |
De-mold Time |
| Northstar Polymers MSN-V40A Polyester Base Low-Rebound Impact/Vibration Dampening Gel This polyurethane casting material is developed for applications that require Shore OO 40 range casting material with vibration dampening property and higher strength than standard polyurethane gel .. |
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| Cure Time | 90.0 min @Temperature 150 °C |
1.50 hour @Temperature 302 °F |
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| Lord Adhesives Thermosetâ„¢ ME-541 Underfill Encapsulant LORD Thermosetâ„¢ ME-541 encapsulant is an anhydride free, high purity, semi-conductor grade epoxy underfill product developed for the encapsulation of densely populated area array flip chip devi.. |
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| Cure Time | 90.0 min @Temperature 125 °C |
1.50 hour @Temperature 257 °F |
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| Momentive Performance Materials TSE3221 Flowable, Heat Cured One Component Silicone Adhesive TSE 3221 is a one-component, flowable, heat curing adhesive which is translucent in color and offers primerless adhesion to a wide variety of substrates. This product requires an elevated temperatur.. |
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| Cure Time | 90.0 min @Temperature 121 °C |
1.50 hour @Temperature 250 °F |
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| Henkel Hysol MA 562S Core Splice Adhesive Modified epoxy foaming adhesive that may be cured at 250°F / 121°C or 350°F / 177°C. Nonmetallic, medium tack, excellent slump resistance. |
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| Cure Time | 90.0 min @Temperature 121 °C |
1.50 hour @Temperature 250 °F |
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| Henkel Hysol PL 795SF Composite Surfacing Film Modified epoxy film specifically formulated to improve the surface appearance of composite honeycomb structures. Excellent surface appearance; reduced pinholing, extra finishing. Superior out-time. .. |
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| Cure Time | 90.0 - 120 min @Temperature 149 °C |
1.50 - 2.00 hour @Temperature 300 °F |
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| Master Bond EP17HT One component epoxy system for bonding, sealing, coating and casting Product Description: Master Bond EP17HT is an one component, heat cured epoxy system for bonding, sealing, coating and encapsulating. It features good physical properties, electrical insulation prof.. |
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| Cure Time | 90.0 - 120 min @Temperature 149 °C |
1.50 - 2.00 hour @Temperature 300 °F |
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| Master Bond EP17HT-LO One component epoxy system for bonding, sealing, coating and casting Product Description: Master Bond EP17HT-LO is a one component, heat cured epoxy system for bonding, sealing, coating and encapsulating. It features good physical properties, electrical insulation pr.. |
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| Cure Time | 90.0 min @Temperature 95.0 °C |
1.50 hour @Temperature 203 °F |
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| Tra-Con Tra-Bond 293-1 General Purpose Instrument Epoxy Adhesive TRA-BOND 293-1 general purpose epoxy adhesive is designed to provide strong, resilient bonds to a variety of difficult-to-bond substrates, such as gold, nickel, silver, copper, and brass. The 293-se.. |
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| Cure Time | 90.0 min @Temperature 100 °C |
1.50 hour @Temperature 212 °F |
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| Trelleborg Emerson & Cuming Eccobond® G 909 One-Component Fast Cure Epoxy Adhesive Emerson & Cuming G 909 Eccobond® One-Component Fast Cure Epoxy AdhesiveHigh strength, thixotropic, flexible, epoxy adhesive. High peel strength (30 pli). Recommended for bonding copper, aluminum an.. |
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| Cure Time | 90.0 min @Temperature 100 °C |
1.50 hour @Temperature 212 °F |
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| Trelleborg Emerson & Cuming Eccobond® A 359 One-Component High Temperature Performance Epoxy Adhesive Emerson & Cuming A 359 Eccobond® One-Component High Temperature Performance Epoxy AdhesiveAluminum filled, heat curing, epoxy adhesive. Sag resistant. Exceptional thermal and chemical resistance. H.. |
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| Cure Time | 90.0 min @Temperature 125 °C |
1.50 hour @Temperature 257 °F |
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| Trelleborg Emerson & Cuming Eccobond® C429-2 One-Component Silver Filled Electrically Conductive Epoxy Adhesive Emerson & Cuming C429-2 Eccobond® One-Component Silver Filled Electrically Conductive Epoxy AdhesiveOne component, high strength, moderate cost, silver filled, electrically conductive, epoxy adhesi.. |
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| Cure Time | 90.0 min @Temperature 32.0 °C |
1.50 hour @Temperature 89.6 °F |
Foot Traffic |
| Chesterton ARC 988 Composite Description: A high performance, quartz reinforced composite designed to resurface and restore concrete surfaces, to protect new concrete, and to repair concrete damaged by severe chemical and physi.. |
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| Cure Time | 90.0 min @Temperature 21.0 °C |
1.50 hour @Temperature 69.8 °F |
Foot Traffic |
| Chesterton ARC NVE SYSTEM Vinyl Ester Lining Description: ARC NVE is a high performance, quartz reinforced, three-component, modified novolac vinyl ester lining capable of being applied to horizontal and vertical surfaces. The NVE system kit i.. |
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| Cure Time | 90.0 min @Temperature 80.0 °C |
1.50 hour @Temperature 176 °F |
Minimum Bond Line |
| Epoxy Technology EPO-TEK® 375 High Temperature Epoxy Product Description: EPO-TEK®375 is a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications. Also available in a single component frozen sy.. |
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| Cure Time | 90.0 min @Temperature 165 °C |
1.50 hour @Temperature 329 °F |
Minimum Bond Line |
| Epoxy Technology EPO-TEK® H35-175MP Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H35-175MP is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-elec.. |
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| Cure Time | 90.0 min @Temperature 165 °C |
1.50 hour @Temperature 329 °F |
Minimum Bond Line |
| Epoxy Technology EPO-TEK® H35-175MPLV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H35-175MPLV is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-el.. |
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| Cure Time | 90.0 min @Temperature 165 °C |
1.50 hour @Temperature 329 °F |
Minimum Bond Line |
| Epoxy Technology EPO-TEK® E3035 Electrically Conductive Adhesive Product Description: EPO-TEK® E3035 is a single component, silver-filled epoxy for hybrid die and component attach.Advantages & Application Notes: Performs exceptionally well as a die attach for sm.. |
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| Cure Time | 90.0 min @Temperature 25.0 °C |
1.50 hour @Temperature 77.0 °F |
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| ACC QGel 311 QSI Quantum Silicones General Purpose Silicone Gel QGel 311 is a clear, fast cure, tough moderately cross-linked silicone polymer. Silicone gels are used to provide protection from vibration and thermal or mechanical shock. Silicone gels also provid.. |
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| Cure Time | 90.0 min @Temperature 121 °C |
1.50 hour @Temperature 250 °F |
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| Henkel Hysol PL 795 Film Adhesive Epoxy film adhesive designed for composite bonding applications. May cure at 250°F / 121°C or 350°F / 177°C, with service temperatures up to 350°F / 177°C. Ideal for co-cure or secondary bondi.. |
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| Cure Time | 90.0 min @Temperature 21.0 °C |
1.50 hour @Temperature 69.8 °F |
Light Load |
| Chesterton ARC NVE VC Vinyl Ester Sealer Description: ARC NVE VC (Veil Coat) is a two-component, modified epoxy novolac vinyl ester sealer coat formulated for application by brush, roller or spray at 0.15-0.25 mm (0.07-0.010”) wet film th.. |
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| Cure Time | 90.0 min @Temperature 121 °C |
1.50 hour @Temperature 250 °F |
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| Henkel Hysol EA 9820 Paste Adhesive System High-density, one-component epoxy syntactic for use on honeycomb composite parts requiring high compressive strength at temperatures up to 350°F / 177°C. Ideal for fastener or attachment potting a.. |
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| Cure Time | 90.0 min @Temperature 121 °C |
1.50 hour @Temperature 250 °F |
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| Henkel Hysol EA 9825 Paste Adhesive System Low-density, one-component epoxy syntactic for use on honeycomb composite parts requiring high compressive strength at temperatures up to 350°F / 177°C. Ideal for fastener or attachment potting an.. |
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| Cure Time | 90.0 min @Temperature 121 °C |
1.50 hour @Temperature 250 °F |
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| Henkel Hysol PL 460 Core Splice Adhesive Foaming epoxy adhesive in paste form for easy extrusion through packaged cartridges. Expands and cures at temperatures from 250°F / 121°C to 350°F / 177°C. Qualified to Boeing BMS 5-90, Type IV... |
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