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Polymer Property : Cure Time = 1.50 hour Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 90.0 min @Temperature 150 °C |
1.50 hour @Temperature 302 °F |
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| Lord Adhesives Thermosetâ„¢ ME-541 Underfill Encapsulant LORD Thermosetâ„¢ ME-541 encapsulant is an anhydride free, high purity, semi-conductor grade epoxy underfill product developed for the encapsulation of densely populated area array flip chip devi.. |
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| Cure Time | 90.0 min @Temperature 150 °C |
1.50 hour @Temperature 302 °F |
|
| Lord Adhesives Thermosetâ„¢ ME-542 Underfill Encapsulant LORD Thermosetâ„¢ ME-542 encapsulant is an anhydridefree, thermally conductive, semiconductor grade epoxy underfill product developed for the encapsulation of densely populated area array flip ch.. |
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| Cure Time | 90.0 min @Temperature 121 °C |
1.50 hour @Temperature 250 °F |
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| Henkel Hysol EA 9695 Film Adhesive Second generation, low flow, composite bonding film; excellent environmental resistance. Composite structure repair, cure and co-cure with composite laminates. Qualified to Airbus. Data from .050 ps.. |
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| Cure Time | 90.0 min @Temperature 121 °C |
1.50 hour @Temperature 250 °F |
|
| Henkel Hysol MA 557 Core Splice Adhesive Modified epoxy foaming adhesive that may be cured at 250°F / 121°C or 350°F / 177°C. Designed to seal, splice or reinforce honeycomb materials. Excellent slump resistance, medium tack, n.. |
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| Cure Time | 90.0 - 120 min @Temperature 121 °C |
1.50 - 2.00 hour @Temperature 250 °F |
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| Henkel Hysol PL 7000 Film Adhesive Epoxy film adhesive formulated to provide excellent performance properties in composite bonding, and has excellent results on composite surfaces that have been exposed to bond shop environments and .. |
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| Cure Time | 90.0 - 120 min @Temperature 149 °C |
1.50 - 2.00 hour @Temperature 300 °F |
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| Master Bond EP17HT One component epoxy system for bonding, sealing, coating and casting Product Description: Master Bond EP17HT is an one component, heat cured epoxy system for bonding, sealing, coating and encapsulating. It features good physical properties, electrical insulation prof.. |
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| Cure Time | 90.0 min @Temperature 95.0 °C |
1.50 hour @Temperature 203 °F |
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| Tra-Con Tra-Bond 293-1 General Purpose Instrument Epoxy Adhesive TRA-BOND 293-1 general purpose epoxy adhesive is designed to provide strong, resilient bonds to a variety of difficult-to-bond substrates, such as gold, nickel, silver, copper, and brass. The 293-se.. |
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| Cure Time | 90.0 min @Temperature 95.0 °C |
1.50 hour @Temperature 203 °F |
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| Tra-Con Tra-Bond 293-1M General Purpose Instrument Epoxy Adhesive TRA-BOND 293-1M general purpose epoxy adhesive is designed to provide strong, resilient bonds to a variety of difficult-to-bond substrates, such as gold, nickel, silver, copper and brass. The 293-se.. |
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| Cure Time | 90.0 min @Temperature 100 °C |
1.50 hour @Temperature 212 °F |
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| Trelleborg Emerson & Cuming Eccobond® G 909 One-Component Fast Cure Epoxy Adhesive Emerson & Cuming G 909 Eccobond® One-Component Fast Cure Epoxy AdhesiveHigh strength, thixotropic, flexible, epoxy adhesive. High peel strength (30 pli). Recommended for bonding copper, aluminum an.. |
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| Cure Time | 90.0 min @Temperature >=105 °C |
1.50 hour @Temperature >=221 °F |
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| Trelleborg Emerson & Cuming Eccobond® 1962-31 Needle Bonding Epoxy Adhesive Emerson & Cuming 1962-31 Eccobond® Needle Bonding Epoxy AdhesiveOne component, medium viscosity, epoxy needle bonding adhesive. Designed to bond stainless steel cannulae into polypropylene hubs. Al.. |
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| Cure Time | 90.0 min @Temperature 100 °C |
1.50 hour @Temperature 212 °F |
|
| Trelleborg Emerson & Cuming Eccobond® A 359 One-Component High Temperature Performance Epoxy Adhesive Emerson & Cuming A 359 Eccobond® One-Component High Temperature Performance Epoxy AdhesiveAluminum filled, heat curing, epoxy adhesive. Sag resistant. Exceptional thermal and chemical resistance. H.. |
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| Cure Time | 90.0 min @Temperature 43.0 °C |
1.50 hour @Temperature 109 °F |
Light Load |
| Chesterton ARC 890 Course Grade Sliding Wear Compound An advanced ceramic composite for the repair and protection of all metal surfaces subjected to severe erosion, corrosion, and chemical attack. It is normally applied at the thickness of 6 mm (1/4”).. |
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| Cure Time | 90.0 min @Temperature 43.0 °C |
1.50 hour @Temperature 109 °F |
Light Load |
| Chesterton ARC 897 Fine Grade Sliding Wear Compound Description: ARC 897 is an advanced ceramic reinforced composite for the repair and protection of all metal surfaces subjected to severe erosion, corrosion, and chemical attack. It is applied at a t.. |
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| Cure Time | 90.0 min @Temperature 32.0 °C |
1.50 hour @Temperature 89.6 °F |
Foot Traffic |
| Chesterton ARC 988 Composite Description: A high performance, quartz reinforced composite designed to resurface and restore concrete surfaces, to protect new concrete, and to repair concrete damaged by severe chemical and physi.. |
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| Cure Time | 90.0 min @Temperature 43.0 °C |
1.50 hour @Temperature 109 °F |
Light Load |
| Chesterton ARC I BX1 Impact & Wear Resistant Epoxy Composite Description: An advanced grade epoxy and urethane composite for the repair and protection of all metal surfaces subjected to severe abrasion and impact. It is normally applied at a thickness of 6 mm.. |
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| Cure Time | 90.0 min @Temperature 21.0 °C |
1.50 hour @Temperature 69.8 °F |
Foot Traffic |
| Chesterton ARC NVE SYSTEM Vinyl Ester Lining Description: ARC NVE is a high performance, quartz reinforced, three-component, modified novolac vinyl ester lining capable of being applied to horizontal and vertical surfaces. The NVE system kit i.. |
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| Cure Time | 90.0 min @Temperature 21.0 °C |
1.50 hour @Temperature 69.8 °F |
Light Load |
| Chesterton ARC NVE SYSTEM Vinyl Ester Lining Description: ARC NVE is a high performance, quartz reinforced, three-component, modified novolac vinyl ester lining capable of being applied to horizontal and vertical surfaces. The NVE system kit i.. |
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| Cure Time | 90.0 min @Temperature 165 °C |
1.50 hour @Temperature 329 °F |
Minimum Bond Line |
| Epoxy Technology EPO-TEK® H35-175MPLV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H35-175MPLV is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-el.. |
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| Cure Time | 90.0 min @Temperature 165 °C |
1.50 hour @Temperature 329 °F |
Minimum Bond Line |
| Epoxy Technology EPO-TEK® H35-175MPT Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H35MPT is a single component, silver-filled, electrically conductive epoxy designed for military hybrid die and component attach. High viscosity version of EPO-TEK® H.. |
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| Cure Time | 90.0 min @Temperature 285 °C |
1.50 hour @Temperature 545 °F |
Post-Cure, Minimum Bond Line |
| Epoxy Technology EPO-TEK® P1011 Electrically Conductive Modified Polyimide Product Description: EPO-TEK® P-1011 is a single component, modified polyimide, silver-filled adhesive designed for chip bonding in microelectronic and optoelectronic applications.Advantages & Appl.. |
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| Cure Time | 90.0 min @Temperature 165 °C |
1.50 hour @Temperature 329 °F |
Minimum Bond Line |
| Epoxy Technology EPO-TEK® E3035 Electrically Conductive Adhesive Product Description: EPO-TEK® E3035 is a single component, silver-filled epoxy for hybrid die and component attach.Advantages & Application Notes: Performs exceptionally well as a die attach for sm.. |
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| Cure Time | 90.0 min @Temperature 121 °C |
1.50 hour @Temperature 250 °F |
|
| Henkel Hysol PL 795 Film Adhesive Epoxy film adhesive designed for composite bonding applications. May cure at 250°F / 121°C or 350°F / 177°C, with service temperatures up to 350°F / 177°C. Ideal for co-cure or secondary bondi.. |
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| Cure Time | 90.0 min @Temperature 21.0 °C |
1.50 hour @Temperature 69.8 °F |
Light Load |
| Chesterton ARC NVE VC Vinyl Ester Sealer Description: ARC NVE VC (Veil Coat) is a two-component, modified epoxy novolac vinyl ester sealer coat formulated for application by brush, roller or spray at 0.15-0.25 mm (0.07-0.010”) wet film th.. |
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