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Polymer Property : Cure Time = 1.50 hour Product List

Processing Properties

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Processing Properties Metric English Comments
Cure Time 90.0 min

@Temperature 150 °C
1.50 hour

@Temperature 302 °F
Lord Adhesives Thermosetâ„¢ ME-541 Underfill Encapsulant
LORD Thermosetâ„¢ ME-541 encapsulant is an anhydride free, high purity, semi-conductor grade epoxy underfill product developed for the encapsulation of densely populated area array flip chip devi..
Cure Time 90.0 min

@Temperature 150 °C
1.50 hour

@Temperature 302 °F
Lord Adhesives Thermosetâ„¢ ME-542 Underfill Encapsulant
LORD Thermosetâ„¢ ME-542 encapsulant is an anhydridefree, thermally conductive, semiconductor grade epoxy underfill product developed for the encapsulation of densely populated area array flip ch..
Cure Time 90.0 min

@Temperature 125 °C
1.50 hour

@Temperature 257 °F
Momentive Performance Materials TSE3221 Flowable, Heat Cured One Component Silicone Adhesive
TSE 3221 is a one-component, flowable, heat curing adhesive which is translucent in color and offers primerless adhesion to a wide variety of substrates. This product requires an elevated temperatur..
Cure Time 90.0 min

@Temperature 177 °C
1.50 hour

@Temperature 351 °F
Henkel Hysol EA 9695 Film Adhesive
Second generation, low flow, composite bonding film; excellent environmental resistance. Composite structure repair, cure and co-cure with composite laminates. Qualified to Airbus. Data from .050 ps..
Cure Time 90.0 min

@Temperature 121 °C
1.50 hour

@Temperature 250 °F
Henkel Hysol MA 557 Core Splice Adhesive
Modified epoxy foaming adhesive that may be cured at 250°F / 121°C or 350°F / 177°C. Designed to seal, splice or reinforce honeycomb materials. Excellent slump resistance, medium tack, n..
Cure Time 90.0 min

@Temperature 121 °C
1.50 hour

@Temperature 250 °F
Henkel Hysol PL 795-1 Film Adhesive
Tougher version of Hysol PL 795. Excellent flow characteristics. Excellent tack and handling characteristics. Improved elevated temperature performance. Can be used for both surfacing film and light..
Cure Time 90.0 min

@Temperature 121 °C
1.50 hour

@Temperature 250 °F
Henkel Hysol PL 795SF Composite Surfacing Film
Modified epoxy film specifically formulated to improve the surface appearance of composite honeycomb structures. Excellent surface appearance; reduced pinholing, extra finishing. Superior out-time. ..
Cure Time 90.0 - 120 min

@Temperature 149 °C
1.50 - 2.00 hour

@Temperature 300 °F
Master Bond EP17HT-LO One component epoxy system for bonding, sealing, coating and casting
Product Description: Master Bond EP17HT-LO is a one component, heat cured epoxy system for bonding, sealing, coating and encapsulating. It features good physical properties, electrical insulation pr..
Cure Time 90.0 min

@Temperature 80.0 °C
1.50 hour

@Temperature 176 °F
Tra-Con Tra-Duct 925M01 Low Ion Snap Cure Silver-Filled Epoxy
TRA-DUCT 925M01 is a low ion snap cure silver-filled epoxy. TRA-DUCT 925M01 develops strong, durable, void free electrically and thermally conducting bonds. The product can be screen printed, stenci..
Cure Time 90.0 min

@Temperature 100 °C
1.50 hour

@Temperature 212 °F
Trelleborg Emerson & Cuming Eccobond® G 909 One-Component Fast Cure Epoxy Adhesive
Emerson & Cuming G 909 Eccobond® One-Component Fast Cure Epoxy AdhesiveHigh strength, thixotropic, flexible, epoxy adhesive. High peel strength (30 pli). Recommended for bonding copper, aluminum an..
Cure Time 90.0 min

@Temperature 100 °C
1.50 hour

@Temperature 212 °F
Trelleborg Emerson & Cuming Eccobond® A 359 One-Component High Temperature Performance Epoxy Adhesive
Emerson & Cuming A 359 Eccobond® One-Component High Temperature Performance Epoxy AdhesiveAluminum filled, heat curing, epoxy adhesive. Sag resistant. Exceptional thermal and chemical resistance. H..
Cure Time 90.0 min

@Temperature 43.0 °C
1.50 hour

@Temperature 109 °F
Light Load
Chesterton ARC 858 Abrasion resistant rebuilding and faring composite
An advanced ceramic composite for the repair and protection of all metal surfaces subjected to erosion, corrosion and chemical attack. It is normally applied at a thickness of 0.15 mm (60 mils) or m..
Cure Time 90.0 min

@Temperature 43.0 °C
1.50 hour

@Temperature 109 °F
Light Load
Chesterton ARC 890 Course Grade Sliding Wear Compound
An advanced ceramic composite for the repair and protection of all metal surfaces subjected to severe erosion, corrosion, and chemical attack. It is normally applied at the thickness of 6 mm (1/4”)..
Cure Time 90.0 min

@Temperature 32.0 °C
1.50 hour

@Temperature 89.6 °F
Foot Traffic
Chesterton ARC 988 Composite
Description: A high performance, quartz reinforced composite designed to resurface and restore concrete surfaces, to protect new concrete, and to repair concrete damaged by severe chemical and physi..
Cure Time 90.0 min

@Temperature 43.0 °C
1.50 hour

@Temperature 109 °F
Light Load
Chesterton ARC BX2 Contractor Grade Fine Sliding Wear Compound
Description: ARC BX2 is an advanced contractor grade ceramic reinforced composite for the repair and protection of all metal surfaces subjected to severe erosion, corrosion, and chemical attack. It ..
Cure Time 90.0 min

@Temperature 80.0 °C
1.50 hour

@Temperature 176 °F
Minimum Bond Line
Epoxy Technology EPO-TEK® 375 High Temperature Epoxy
Product Description: EPO-TEK®375 is a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications. Also available in a single component frozen sy..
Cure Time 90.0 min

@Temperature 165 °C
1.50 hour

@Temperature 329 °F
Minimum Bond Line
Epoxy Technology EPO-TEK® H35-175MP Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H35-175MP is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-elec..
Cure Time 90.0 min

@Temperature 150 °C
1.50 hour

@Temperature 302 °F
Minimum Bond Line
Epoxy Technology EPO-TEK® H70E-175 Thermally Conductive Epoxy
Product Description: EPO-TEK® H70E-175 is a two component, thermally conductive, electrically insulating epoxy adhesive for semiconductor, microelectronic and opto-electronic packaging. It may be ..
Cure Time 90.0 min

@Temperature 80.0 °C
1.50 hour

@Temperature 176 °F
Minimum Bond Line
Epoxy Technology EPO-TEK® H70S Thermally Conductive Epoxy for Die Stamping
Product Description: EPO TEK® H70S is a modified version of EPO TEK® H70E, designed primarily for die stamping. It is a highly reliable, alumina- filled epoxy with a smooth, flowable consistency,..
Cure Time 90.0 min

@Temperature 285 °C
1.50 hour

@Temperature 545 °F
Post-Cure, Minimum Bond Line
Epoxy Technology EPO-TEK® P1011 Electrically Conductive Modified Polyimide
Product Description: EPO-TEK® P-1011 is a single component, modified polyimide, silver-filled adhesive designed for chip bonding in microelectronic and optoelectronic applications.Advantages & Appl..
Cure Time 90.0 min

@Temperature 285 °C
1.50 hour

@Temperature 545 °F
Post-Cure, Minimum Bond Line
Epoxy Technology EPO-TEK® P1011S Electrically Conductive Modified Polyimide
Product Description: EPO-TEK® P1011S is a single component, modified polyimide, high temperature grade, silver-filled electrically and thermally conductive adhesive designed for semiconductor die-a..
Cure Time 90.0 min

@Temperature 80.0 °C
1.50 hour

@Temperature 176 °F
Minimum
Epoxy Technology EPO-TEK® TV2001 Thermally Conductive, Electrically Insulating Epoxy
Material Description: A two component, thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging. Low Tg, moderate potlife, snap-curing and..
Cure Time 90.0 min

@Temperature 165 °C
1.50 hour

@Temperature 329 °F
Minimum Bond Line
Epoxy Technology EPO-TEK® E3035 Electrically Conductive Adhesive
Product Description: EPO-TEK® E3035 is a single component, silver-filled epoxy for hybrid die and component attach.Advantages & Application Notes: Performs exceptionally well as a die attach for sm..
Cure Time 90.0 min

@Temperature 80.0 °C
1.50 hour

@Temperature 176 °F
Atom Adhesives AA-BOND G298 Epoxy Adhesive
AA-BOND G298 is a two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging.Appearance: Resin: Brown, Hardener: Dark Bro..
Cure Time 90.0 min

@Temperature 180 °C
1.50 hour

@Temperature 356 °F
Atom Adhesives AA-DUCT AD1 Epoxy Adhesive
AA-DUCT AD1 is a single component epoxy, formulated with pure silver power combined with organic binders and solvents to produce electrically conductive paths, films or patterns over non-conductive ..
Cure Time 90.0 min

@Temperature 180 °C
1.50 hour

@Temperature 356 °F
Atom Adhesives AA-DUCT CG2 Epoxy Adhesive
AA-DUCT CG2 is a single component epoxy, formulated with silver coated ceramic that results in lower material costs without adversely sacrificing the properties obtained with a pure silver formulati..
Cure Time 90.0 min

@Temperature 121 °C
1.50 hour

@Temperature 250 °F
Henkel Hysol PL 795 Film Adhesive
Epoxy film adhesive designed for composite bonding applications. May cure at 250°F / 121°C or 350°F / 177°C, with service temperatures up to 350°F / 177°C. Ideal for co-cure or secondary bondi..
Cure Time 90.0 min

@Temperature 21.0 °C
1.50 hour

@Temperature 69.8 °F
Foot Traffic
Chesterton ARC NVE VC Vinyl Ester Sealer
Description: ARC NVE VC (Veil Coat) is a two-component, modified epoxy novolac vinyl ester sealer coat formulated for application by brush, roller or spray at 0.15-0.25 mm (0.07-0.010”) wet film th..
Cure Time 90.0 min

@Temperature 121 °C
1.50 hour

@Temperature 250 °F
Henkel Hysol EA 9820 Paste Adhesive System
High-density, one-component epoxy syntactic for use on honeycomb composite parts requiring high compressive strength at temperatures up to 350°F / 177°C. Ideal for fastener or attachment potting a..
Cure Time 90.0 min

@Temperature 121 °C
1.50 hour

@Temperature 250 °F
Henkel Hysol EA 9825 Paste Adhesive System
Low-density, one-component epoxy syntactic for use on honeycomb composite parts requiring high compressive strength at temperatures up to 350°F / 177°C. Ideal for fastener or attachment potting an..
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