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Polymer Property : Particle Size = 20 µm Product List

Physical Properties

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Physical Properties Metric English Comments
Particle Size <= 20 µm
<= 20 µm
90% smaller than
Nyco NYGLOS® 4W Wollastonite
High aspect ratio grade. This grade is recommended for polymer reinforcement.Wollastonite is a naturally occurring white mineral with an acicular (needle-shaped) particle structure. This distinctiv..
Particle Size <= 20 µm
<= 20 µm
90% smaller than
Nyco RRIMGLOS® 4W Wollastonite
Wollastonite is a naturally occurring white mineral with an acicular (needle-shaped) particle structure. This distinctive particle morphology makes wollastonite an ideal performance mineral for a br..
Particle Size <= 20 µm
<= 20 µm
91.1% of particles less than
Old Hickory M&M Clays, Inc. Wilco-UPF Kaolin Clay
Wilco UPF is finer grained kaolin and can be employed in a ceramic formulation where higher permeability type kaolin is not required. It has excellent suspension qualities and lends good film streng..
Particle Size 20 µm
20 µm
Median Diameter
Omya OMYACARB® BP - AZ Calcium Carbonate
A dry ground calcium carbonate with a medium and closely sized particle distribution and excellent shrink resistance properties.Applications: Ideal for joint compounds, unsaturated polyester, cement..
Particle Size 20 µm
20 µm
97% finer than
Imerys Allenâ„¢ G Kaolin
Allen G is an intermediate-grained kaolin used as a suspension aid in ceramic glazes.Information provided by Imerys
Particle Size 20 µm
20 µm
99% finer than
Imerys Bardenâ„¢ Kaolin
Barden is a high surface area kaolin product used a filler in rubber and plastic applications.Information provided by Imerys
Particle Size 20 µm
20 µm
95% finer than
Imerys KT Castâ„¢ Kaolin
KT Cast is a coarse-grained, white firing kaolin that is used primarily in casting bodies based on its fast casting and exceptional deflocculation characteristics.Information provided by Imerys
Particle Size 20 µm
20 µm
Maximum of .5% less than, Ni-SF RC 60
H.C. Starck Amperit® 568.062 Tungsten Carbide-Nickel 92-8 - Nickel SF RC 60 65-35
Composition is of NiSF RC 60 only
Particle Size 20 µm
20 µm
Silberline Sparkle Silvex® Premier 890-20-D
Sparkle Silvex® D grades are aluminum pigment flakes dampened with a plasticizer to help prevent the individual flakes from becoming airborne during handling and processing. They are well suited ..
Particle Size 20 µm
20 µm
Springback 13%, pressure 0.477 t/cc
TIMCAL TIMREX® KS5-25 Primary Synthetic Graphite
TIMREX Primary Synthetic Graphite is produced in a unique highly controlled graphitization process which assures narrow specifications and unequalled consistent quality due to: monitoring of all pro..
Particle Size 20 - 80 µm
20 - 80 µm
DayGlo Gem-Tone GC-19F Sapphire Blue
Gem-Tone™ Sapphire Blue is a rich blue colorant intended for use in clarified polypropylene. Clean, haze free, non-warping color formulations can easily be achieved with the use of this colorant. N..
Particle Size 20 - 60 µm
20 - 60 µm
DayGlo ZQ Pigments ZQ-14 Fire Orange
DAY-GLO ZQ-Pigments are an improved version of DAY-GLO Z-Pigments. They offer lower mold plateout, increased plastic compatibility, are mostly stronger, require processing temperatures, and have lar..
Particle Size 20 - 60 µm
20 - 60 µm
DayGlo ZQ Pigments ZQ-19 Horizon Blue
DAY-GLO ZQ-Pigments are an improved version of DAY-GLO Z-Pigments. They offer lower mold plateout, increased plastic compatibility, are mostly stronger, require processing temperatures, and have lar..
Particle Size 20 - 60 µm
20 - 60 µm
DayGlo ZQ Pigments ZQ-21 Corona Magenta
DAY-GLO ZQ-Pigments are an improved version of DAY-GLO Z-Pigments. They offer lower mold plateout, increased plastic compatibility, are mostly stronger, require processing temperatures, and have lar..
Particle Size <= 20 µm
<= 20 µm
Epoxy Technology EPO-TEK® 353ND-T4 Thixotropic Epoxy
Product Description: EPO-TEK® 353ND-T4 is a two component, highly thixotropic epoxy with non-flowing properties and high temperature resistance. This is a higher viscosity version of EPO-TEK® 353..
Particle Size <= 20 µm
<= 20 µm
Epoxy Technology EPO-TEK® 731 Epoxy Adhesive
Material Description: A two component, thixotropic, room temperature-curing epoxy adhesive. It is an electrically and thermally insulating epoxy designed for general applications in semiconductor p..
Particle Size <= 20 µm
<= 20 µm
Epoxy Technology EPO-TEK® 930-1 Thermally Conductive, Electrically Insulating Epoxy
Material Description: A two part, thermally conductive, electrically insulating epoxy. It can be used for heat sinking semiconductor devices, hybrid microelectronics, optics or medical devices. It..
Particle Size <= 20 µm
<= 20 µm
Epoxy Technology EPO-TEK® 930-4 Thermally Conductive Epoxy
Product Description: EPO-TEK® 930-4 is a two component, thermally conductive epoxy, formulated with a very fine boron-nitride filler particle. Also available in a single component frozen syringe. ..
Particle Size <= 20 µm
<= 20 µm
Epoxy Technology EPO-TEK® E2036 Epoxy
Product Description: A two component, slightly flexible, silver-filled, electrically conductive adhesive for semiconductor and electronic assemblies. It is a low Tg epoxy, intended for many kinds o..
Particle Size <= 20 µm
<= 20 µm
Epoxy Technology EPO-TEK® GE116 Electrically and Thermally Insulating Epoxy
Material Description: A single component, thixotropic, electrically and thermally insulating epoxy adhesive designed for bonding SMDs to the PCB. It can be used for electronic assembly in many devi..
Particle Size <= 20 µm
<= 20 µm
Epoxy Technology EPO-TEK® H31D Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H31D is a single component, electrically conductive silver epoxy designed for die-bonding of semiconductors, including IC’s, resistors, capacitors, transistors, and d..
Particle Size <= 20 µm
<= 20 µm
Epoxy Technology EPO-TEK® H35-175MPT Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H35MPT is a single component, silver-filled, electrically conductive epoxy designed for military hybrid die and component attach. High viscosity version of EPO-TEK® H..
Particle Size <= 20 µm
<= 20 µm
Epoxy Technology EPO-TEK® H70E-TI Thermally Conductive, Electrically Insulating Epoxy
Material Description: A two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronic applications.Information Provided by Epoxy ..
Particle Size <= 20 µm
<= 20 µm
Epoxy Technology EPO-TEK® H74F Thermally Conductive, Electrically Insulating Epoxy
Material Description: A two component, high Tg, thermally conductive, electrically insulating epoxy designed for semiconductor packaging including heat sinking, hermetic sealing, and opto-electronic..
Particle Size <= 20 µm
<= 20 µm
Epoxy Technology EPO-TEK® M10-D Epoxy Paste
Material Description: A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate atta..
Particle Size <= 20 µm
<= 20 µm
Epoxy Technology EPO-TEK® T6067 Thermally Conductive, Electrically Insulating Epoxy
Material Description: A single component, thermally conductive and electrically insulating epoxy designed for semiconductor die attach and bonding of SMDs for hybrid microelectronic packaging. It c..
Particle Size <= 20 µm
<= 20 µm
Epoxy Technology EPO-TEK® T7109-17 Thermally Conductive Epoxy
Product Description: EPO-TEK® T7109-17 is a flexible, thermally conductive, electrically insulating epoxy paste designed for low stress and heat dissipation applications within the semiconductor, h..
Particle Size <= 20 µm
<= 20 µm
Epoxy Technology EPO-TEK® TD1001 Thermally Conductive Epoxy
Product Description: EPO-TEK® TD1001 is a single component, thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging.Advantages & Applicat..
Particle Size 20 µm
20 µm
10th%
3M K37 Glass Bubbles
3M™ Glass Bubbles are engineered hollow glass microspheres that are alternatives to conventional fillers and additives such as silicas, calcium carbonate, talc, clay, etc., for many demanding appli..
Particle Size 20 µm
20 µm
10th%
3M S32 Glass Bubbles
3M™ Glass Bubbles are engineered hollow glass microspheres that are alternatives to conventional fillers and additives such as silicas, calcium carbonate, talc, clay, etc., for many demanding appli..
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