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Polymer Property : Particle Size = 20 µm Product List
Physical PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Particle Size | <= 20 µm | <= 20 µm | 90% smaller than |
| Nyco NYGLOS® 4W Wollastonite High aspect ratio grade. This grade is recommended for polymer reinforcement.Wollastonite is a naturally occurring white mineral with an acicular (needle-shaped) particle structure. This distinctiv.. |
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| Particle Size | <= 20 µm | <= 20 µm | 90% smaller than |
| Nyco RRIMGLOS® 4W Wollastonite Wollastonite is a naturally occurring white mineral with an acicular (needle-shaped) particle structure. This distinctive particle morphology makes wollastonite an ideal performance mineral for a br.. |
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| Particle Size | <= 20 µm | <= 20 µm | 96.2% of particles less than |
| Old Hickory M&M Clays, Inc. Wilco-SLU Kaolin Clay Wilco SLU is an aqueous suspension of kaolin produced at 70% solids content. The slurry is deflocculated and rheology stabilized with sodium silicate. The Wilco SLU grade is a highly permeable selec.. |
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| Particle Size | 20 µm | 20 µm | 5% max, wet sieve |
| Magyar Aluminum ALO-P90-02 Alumina Alumina for Polishing |
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| Particle Size | <= 20 µm | <= 20 µm | 99% finer |
| Malvern Minerals Novakup® Daper Surface-Treated Lamellar Quartz Filler/Extender Novakup® is a surface modified or silane treated Novacite®. It has been used its barrier prosperities in chemical and corrosion resistant applications and as a filler/extender/reinforcing agen.. |
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| Particle Size | 20 µm | 20 µm | 97% finer than |
| Imerys Diamondâ„¢ Kaolin Diamond is an intermediate-grained montmorillonitc kaolin used primarily in plastic formed bodies. This kaolin is known for its good strength and white-firing characteristics.Information provided by.. |
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| Particle Size | 20 µm | 20 µm | Maximum of 15% less than |
| H.C. Starck Amperit® 821.084 Zirconia-Yttria 80-20 (ZrO2-Y2O3) |
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| Particle Size | <= 20 µm | <= 20 µm | 50 |
| Solvay Chemicals Ixper® 60C Calcium Peroxide IXPER® 60C is a Calcium Peroxide powder used in a wide range of applications in environmental, seed coating, baking e.g. marketsEINECS Number: 215-139-4/CAS Number: 1305-79-9Information provided .. |
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| Particle Size | 20 µm | 20 µm | |
| Silberline SilBerCote® PC 6222X SilBerCote® PC X can be formulated into post-blend and bonded metallic powder coatings. The inorganic surface treatment on the flake imparts improved chemical and environmental resistance propert.. |
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| Particle Size | 20 µm | 20 µm | Springback 13%, pressure 0.477 t/cc |
| TIMCAL TIMREX® KS75 Primary Synthetic Graphite TIMREX Primary Synthetic Graphite is produced in a unique highly controlled graphitization process which assures narrow specifications and unequalled consistent quality due to: monitoring of all pro.. |
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| Particle Size | 20 - 60 µm | 20 - 60 µm | |
| DayGlo ZQ Pigments ZQ-11 Aurora Pink DAY-GLO ZQ-Pigments are an improved version of DAY-GLO Z-Pigments. They offer lower mold plateout, increased plastic compatibility, are mostly stronger, require processing temperatures, and have lar.. |
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| Particle Size | 20 - 60 µm | 20 - 60 µm | |
| DayGlo ZQ Pigments ZQ-21 Corona Magenta DAY-GLO ZQ-Pigments are an improved version of DAY-GLO Z-Pigments. They offer lower mold plateout, increased plastic compatibility, are mostly stronger, require processing temperatures, and have lar.. |
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| Particle Size | <= 20 µm | <= 20 µm | |
| Epoxy Technology EPO-TEK® 730 General Purpose Epoxy Product Description: EPO-TEK® 730 is a two component, thixotropic, room temperature-curing epoxy adhesive. Advantages & Application Notes: Excellent all purpose adhesive. Many uses in job shop and .. |
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| Particle Size | <= 20 µm | <= 20 µm | |
| Epoxy Technology EPO-TEK® E3035T-2 Electrically Conductive Epoxy Product Description: EPO-TEK® E3035T-2 is a single component, silver-filled epoxy for semiconductor die attach, as well as SMD attach on hybrid circuits.Advantages & Application Notes: This epoxy c.. |
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| Particle Size | <= 20 µm | <= 20 µm | |
| Epoxy Technology EPO-TEK® EM127 Electrically Conductive Epoxy Product Description: EPO-TEK® EM127 is a single component, heat curable, electrically conductive epoxy adhesive for semiconductor IC and LED die attach applications.Advantages & Application Notes: .. |
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| Particle Size | <= 20 µm | <= 20 µm | |
| Epoxy Technology EPO-TEK® EV2118-2 Silver-filled, electrically conductive epoxy Preliminary Product Information SheetMaterial Description: A silver-filled, electrically conductive epoxy designed for semiconductor and electronic assembly.Information Provided by Epoxy Technology |
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| Particle Size | <= 20 µm | <= 20 µm | |
| Epoxy Technology EPO-TEK® H35-175MP Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H35-175MP is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-elec.. |
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| Particle Size | <= 20 µm | <= 20 µm | |
| Epoxy Technology EPO-TEK® H35-175MPLV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H35-175MPLV is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-el.. |
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| Particle Size | <= 20 µm | <= 20 µm | |
| Epoxy Technology EPO-TEK® H37-MP Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H37-MP is a single component, electrically conductive, thixotropic silver-filled adhesive for die-attach and SMD attach inside hybrid microelectronic packages. Also av.. |
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| Particle Size | <= 20 µm | <= 20 µm | |
| Epoxy Technology EPO-TEK® M10-D Epoxy Paste Material Description: A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate atta.. |
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| Particle Size | <= 20 µm | <= 20 µm | |
| Epoxy Technology EPO-TEK® OG116-31 UV Cure Optical Epoxy Product Description: EPO-TEK® OG116-31 is a single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, medical.. |
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| Particle Size | <= 20 µm | <= 20 µm | |
| Epoxy Technology EPO-TEK® T7109-18 Electrically Insulating Epoxy Paste Material Description: A flexible, electrically insulating epoxy paste designed for low stress and heat dissipation applications. Alternative to EPO-TEK® T7109-17.Information Provided by Epoxy Tec.. |
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| Particle Size | 20 µm | 20 µm | 10th% |
| 3M S35 Glass Bubbles 3M™ Glass Bubbles are engineered hollow glass microspheres that are alternatives to conventional fillers and additives such as silicas, calcium carbonate, talc, clay, etc., for many demanding appli.. |
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| Particle Size | 20 µm | 20 µm | 10th% |
| 3M S22 Glass Bubbles 3M™ Glass Bubbles are engineered hollow glass microspheres that are alternatives to conventional fillers and additives such as silicas, calcium carbonate, talc, clay, etc., for many demanding appli.. |
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| Particle Size | <= 20 µm | <= 20 µm | 90% smaller than |
| Nyco ULTRAFIBRE® 4W Wollastonite Wollastonite is a naturally occurring white mineral with an acicular (needle-shaped) particle structure. This distinctive particle morphology makes wollastonite an ideal performance mineral for a br.. |
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| Particle Size | 20 - 24 µm | 20 - 24 µm | 10% |
| H.C. Starck Amperit® 584.1 Chromium Carbide-Nickel Chromium 75-25 (Cr3C2-NiCr) |
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