- HOME
- POLYMER SEARCH
- Polymer Property : Particle Size = 20 µm
Polymer Property : Particle Size = 20 µm Product List
Physical PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Particle Size | <= 20 µm | <= 20 µm | 90% smaller than |
| Nyco NYGLOS® 4W Wollastonite High aspect ratio grade. This grade is recommended for polymer reinforcement.Wollastonite is a naturally occurring white mineral with an acicular (needle-shaped) particle structure. This distinctiv.. |
|||
| Particle Size | <= 20 µm | <= 20 µm | 90% smaller than |
| Nyco RRIMGLOS® 4W Wollastonite Wollastonite is a naturally occurring white mineral with an acicular (needle-shaped) particle structure. This distinctive particle morphology makes wollastonite an ideal performance mineral for a br.. |
|||
| Particle Size | <= 20 µm | <= 20 µm | 91.1% of particles less than |
| Old Hickory M&M Clays, Inc. Wilco-UPF Kaolin Clay Wilco UPF is finer grained kaolin and can be employed in a ceramic formulation where higher permeability type kaolin is not required. It has excellent suspension qualities and lends good film streng.. |
|||
| Particle Size | 20 µm | 20 µm | Median Diameter |
| Omya OMYACARB® BP - AZ Calcium Carbonate A dry ground calcium carbonate with a medium and closely sized particle distribution and excellent shrink resistance properties.Applications: Ideal for joint compounds, unsaturated polyester, cement.. |
|||
| Particle Size | 20 µm | 20 µm | 97% finer than |
| Imerys Allenâ„¢ G Kaolin Allen G is an intermediate-grained kaolin used as a suspension aid in ceramic glazes.Information provided by Imerys |
|||
| Particle Size | 20 µm | 20 µm | 99% finer than |
| Imerys Bardenâ„¢ Kaolin Barden is a high surface area kaolin product used a filler in rubber and plastic applications.Information provided by Imerys |
|||
| Particle Size | 20 µm | 20 µm | 95% finer than |
| Imerys KT Castâ„¢ Kaolin KT Cast is a coarse-grained, white firing kaolin that is used primarily in casting bodies based on its fast casting and exceptional deflocculation characteristics.Information provided by Imerys |
|||
| Particle Size | 20 µm | 20 µm | Maximum of .5% less than, Ni-SF RC 60 |
| H.C. Starck Amperit® 568.062 Tungsten Carbide-Nickel 92-8 - Nickel SF RC 60 65-35 Composition is of NiSF RC 60 only |
|||
| Particle Size | 20 µm | 20 µm | |
| Silberline Sparkle Silvex® Premier 890-20-D Sparkle Silvex® D grades are aluminum pigment flakes dampened with a plasticizer to help prevent the individual flakes from becoming airborne during handling and processing. They are well suited .. |
|||
| Particle Size | 20 µm | 20 µm | Springback 13%, pressure 0.477 t/cc |
| TIMCAL TIMREX® KS5-25 Primary Synthetic Graphite TIMREX Primary Synthetic Graphite is produced in a unique highly controlled graphitization process which assures narrow specifications and unequalled consistent quality due to: monitoring of all pro.. |
|||
| Particle Size | 20 - 80 µm | 20 - 80 µm | |
| DayGlo Gem-Tone GC-19F Sapphire Blue Gem-Tone™ Sapphire Blue is a rich blue colorant intended for use in clarified polypropylene. Clean, haze free, non-warping color formulations can easily be achieved with the use of this colorant. N.. |
|||
| Particle Size | 20 - 60 µm | 20 - 60 µm | |
| DayGlo ZQ Pigments ZQ-14 Fire Orange DAY-GLO ZQ-Pigments are an improved version of DAY-GLO Z-Pigments. They offer lower mold plateout, increased plastic compatibility, are mostly stronger, require processing temperatures, and have lar.. |
|||
| Particle Size | 20 - 60 µm | 20 - 60 µm | |
| DayGlo ZQ Pigments ZQ-19 Horizon Blue DAY-GLO ZQ-Pigments are an improved version of DAY-GLO Z-Pigments. They offer lower mold plateout, increased plastic compatibility, are mostly stronger, require processing temperatures, and have lar.. |
|||
| Particle Size | 20 - 60 µm | 20 - 60 µm | |
| DayGlo ZQ Pigments ZQ-21 Corona Magenta DAY-GLO ZQ-Pigments are an improved version of DAY-GLO Z-Pigments. They offer lower mold plateout, increased plastic compatibility, are mostly stronger, require processing temperatures, and have lar.. |
|||
| Particle Size | <= 20 µm | <= 20 µm | |
| Epoxy Technology EPO-TEK® 353ND-T4 Thixotropic Epoxy Product Description: EPO-TEK® 353ND-T4 is a two component, highly thixotropic epoxy with non-flowing properties and high temperature resistance. This is a higher viscosity version of EPO-TEK® 353.. |
|||
| Particle Size | <= 20 µm | <= 20 µm | |
| Epoxy Technology EPO-TEK® 731 Epoxy Adhesive Material Description: A two component, thixotropic, room temperature-curing epoxy adhesive. It is an electrically and thermally insulating epoxy designed for general applications in semiconductor p.. |
|||
| Particle Size | <= 20 µm | <= 20 µm | |
| Epoxy Technology EPO-TEK® 930-1 Thermally Conductive, Electrically Insulating Epoxy Material Description: A two part, thermally conductive, electrically insulating epoxy. It can be used for heat sinking semiconductor devices, hybrid microelectronics, optics or medical devices. It.. |
|||
| Particle Size | <= 20 µm | <= 20 µm | |
| Epoxy Technology EPO-TEK® 930-4 Thermally Conductive Epoxy Product Description: EPO-TEK® 930-4 is a two component, thermally conductive epoxy, formulated with a very fine boron-nitride filler particle. Also available in a single component frozen syringe. .. |
|||
| Particle Size | <= 20 µm | <= 20 µm | |
| Epoxy Technology EPO-TEK® E2036 Epoxy Product Description: A two component, slightly flexible, silver-filled, electrically conductive adhesive for semiconductor and electronic assemblies. It is a low Tg epoxy, intended for many kinds o.. |
|||
| Particle Size | <= 20 µm | <= 20 µm | |
| Epoxy Technology EPO-TEK® GE116 Electrically and Thermally Insulating Epoxy Material Description: A single component, thixotropic, electrically and thermally insulating epoxy adhesive designed for bonding SMDs to the PCB. It can be used for electronic assembly in many devi.. |
|||
| Particle Size | <= 20 µm | <= 20 µm | |
| Epoxy Technology EPO-TEK® H31D Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H31D is a single component, electrically conductive silver epoxy designed for die-bonding of semiconductors, including IC’s, resistors, capacitors, transistors, and d.. |
|||
| Particle Size | <= 20 µm | <= 20 µm | |
| Epoxy Technology EPO-TEK® H35-175MPT Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H35MPT is a single component, silver-filled, electrically conductive epoxy designed for military hybrid die and component attach. High viscosity version of EPO-TEK® H.. |
|||
| Particle Size | <= 20 µm | <= 20 µm | |
| Epoxy Technology EPO-TEK® H70E-TI Thermally Conductive, Electrically Insulating Epoxy Material Description: A two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronic applications.Information Provided by Epoxy .. |
|||
| Particle Size | <= 20 µm | <= 20 µm | |
| Epoxy Technology EPO-TEK® H74F Thermally Conductive, Electrically Insulating Epoxy Material Description: A two component, high Tg, thermally conductive, electrically insulating epoxy designed for semiconductor packaging including heat sinking, hermetic sealing, and opto-electronic.. |
|||
| Particle Size | <= 20 µm | <= 20 µm | |
| Epoxy Technology EPO-TEK® M10-D Epoxy Paste Material Description: A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate atta.. |
|||
| Particle Size | <= 20 µm | <= 20 µm | |
| Epoxy Technology EPO-TEK® T6067 Thermally Conductive, Electrically Insulating Epoxy Material Description: A single component, thermally conductive and electrically insulating epoxy designed for semiconductor die attach and bonding of SMDs for hybrid microelectronic packaging. It c.. |
|||
| Particle Size | <= 20 µm | <= 20 µm | |
| Epoxy Technology EPO-TEK® T7109-17 Thermally Conductive Epoxy Product Description: EPO-TEK® T7109-17 is a flexible, thermally conductive, electrically insulating epoxy paste designed for low stress and heat dissipation applications within the semiconductor, h.. |
|||
| Particle Size | <= 20 µm | <= 20 µm | |
| Epoxy Technology EPO-TEK® TD1001 Thermally Conductive Epoxy Product Description: EPO-TEK® TD1001 is a single component, thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging.Advantages & Applicat.. |
|||
| Particle Size | 20 µm | 20 µm | 10th% |
| 3M K37 Glass Bubbles 3M™ Glass Bubbles are engineered hollow glass microspheres that are alternatives to conventional fillers and additives such as silicas, calcium carbonate, talc, clay, etc., for many demanding appli.. |
|||
| Particle Size | 20 µm | 20 µm | 10th% |
| 3M S32 Glass Bubbles 3M™ Glass Bubbles are engineered hollow glass microspheres that are alternatives to conventional fillers and additives such as silicas, calcium carbonate, talc, clay, etc., for many demanding appli.. |
|||
Copyright © lookpolymers.com All Rights Reserved