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Polymer Property : Cure Time = 90.0 min Product List

Processing Properties

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Processing Properties Metric English Comments
Cure Time 90.0 min

@Temperature 150 °C
1.50 hour

@Temperature 302 °F
Lord Adhesives Thermosetâ„¢ ME-541 Underfill Encapsulant
LORD Thermosetâ„¢ ME-541 encapsulant is an anhydride free, high purity, semi-conductor grade epoxy underfill product developed for the encapsulation of densely populated area array flip chip devi..
Cure Time 90.0 min

@Temperature 177 °C
1.50 hour

@Temperature 351 °F
Henkel Hysol EA 9695 Film Adhesive
Second generation, low flow, composite bonding film; excellent environmental resistance. Composite structure repair, cure and co-cure with composite laminates. Qualified to Airbus. Data from .050 ps..
Cure Time 90.0 min

@Temperature 121 °C
1.50 hour

@Temperature 250 °F
Henkel Hysol MA 562S Core Splice Adhesive
Modified epoxy foaming adhesive that may be cured at 250°F / 121°C or 350°F / 177°C. Nonmetallic, medium tack, excellent slump resistance.
Cure Time 90.0 min

@Temperature 121 °C
1.50 hour

@Temperature 250 °F
Henkel Hysol MA 557 Core Splice Adhesive
Modified epoxy foaming adhesive that may be cured at 250°F / 121°C or 350°F / 177°C. Designed to seal, splice or reinforce honeycomb materials. Excellent slump resistance, medium tack, n..
Cure Time 90.0 min

@Temperature 121 °C
1.50 hour

@Temperature 250 °F
Henkel Hysol PL 777-1FR Film Adhesive
Flame retardant, nonmetallic modified epoxy film adhesiveApplications: Metal and Honeycomb Bonding
Cure Time 90.0 - 120 min

@Temperature 121 °C
1.50 - 2.00 hour

@Temperature 250 °F
Henkel Hysol PL 7000 Film Adhesive
Epoxy film adhesive formulated to provide excellent performance properties in composite bonding, and has excellent results on composite surfaces that have been exposed to bond shop environments and ..
Cure Time 90.0 min

@Temperature 95.0 °C
1.50 hour

@Temperature 203 °F
Tra-Con Tra-Bond 293-1 General Purpose Instrument Epoxy Adhesive
TRA-BOND 293-1 general purpose epoxy adhesive is designed to provide strong, resilient bonds to a variety of difficult-to-bond substrates, such as gold, nickel, silver, copper, and brass. The 293-se..
Cure Time 90.0 min

@Temperature 80.0 °C
1.50 hour

@Temperature 176 °F
Tra-Con Tra-Duct 29121 Snap Cure Conductive Silver Epoxy Adhesive
TRA-DUCT 29121 is 100% solids, two component silver filled epoxy designed for chip bonding in microelectronic and optoelectronic applications. TRA-DUCT 29121 is a soft, smooth paste. This two-part f..
Cure Time 90.0 min

@Temperature 100 °C
1.50 hour

@Temperature 212 °F
Trelleborg Emerson & Cuming Eccobond® G 909 One-Component Fast Cure Epoxy Adhesive
Emerson & Cuming G 909 Eccobond® One-Component Fast Cure Epoxy AdhesiveHigh strength, thixotropic, flexible, epoxy adhesive. High peel strength (30 pli). Recommended for bonding copper, aluminum an..
Cure Time 90.0 min

@Temperature 95.0 °C
1.50 hour

@Temperature 203 °F
Tra-Con Tra-Bond 293-1T General Purpose Instrument Epoxy Adhesive-Thixotropic
TRA-BOND 293-1T general purpose epoxy adhesive is designed to provide strong, semi-rigid bonds to a variety of difficult-to-bond substrates, such as gold, nickel, silver, copper, and brass. This ver..
Cure Time 90.0 min

@Temperature 43.0 °C
1.50 hour

@Temperature 109 °F
Light Load
Chesterton ARC 890 Course Grade Sliding Wear Compound
An advanced ceramic composite for the repair and protection of all metal surfaces subjected to severe erosion, corrosion, and chemical attack. It is normally applied at the thickness of 6 mm (1/4”)..
Cure Time 90.0 min

@Temperature 43.0 °C
1.50 hour

@Temperature 109 °F
Light Load
Chesterton ARC BX1 Sliding Wear Compound
Description: An advanced contractor grade ceramic composite for the repair and protection of all metal surfaces subjected to severe erosion, corrosion, and chemical attack. It is normally applied at..
Cure Time 90.0 min

@Temperature 80.0 °C
1.50 hour

@Temperature 176 °F
Minimum Bond Line
Epoxy Technology EPO-TEK® 375 High Temperature Epoxy
Product Description: EPO-TEK®375 is a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications. Also available in a single component frozen sy..
Cure Time 90.0 min

@Temperature 165 °C
1.50 hour

@Temperature 329 °F
Minimum Bond Line
Epoxy Technology EPO-TEK® H35-175MPLV Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H35-175MPLV is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-el..
Cure Time 90.0 min

@Temperature 165 °C
1.50 hour

@Temperature 329 °F
Minimum Bond Line
Epoxy Technology EPO-TEK® H35-175MPT Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H35MPT is a single component, silver-filled, electrically conductive epoxy designed for military hybrid die and component attach. High viscosity version of EPO-TEK® H..
Cure Time 90.0 min

@Temperature 285 °C
1.50 hour

@Temperature 545 °F
Post-Cure, Minimum Bond Line
Epoxy Technology EPO-TEK® P1011S Electrically Conductive Modified Polyimide
Product Description: EPO-TEK® P1011S is a single component, modified polyimide, high temperature grade, silver-filled electrically and thermally conductive adhesive designed for semiconductor die-a..
Cure Time 90.0 min

@Temperature 43.0 °C
1.50 hour

@Temperature 109 °F
Light Load
Chesterton ARC MX2 High Wear Fine Particle Wear Compound
Description: An advanced ceramic composite for the repair and protection of all metal surfaces subjected to severe erosion, corrosion and chemical attack. It is applied at a thickness of 3 mm (1/8”..
Cure Time 90.0 min

@Temperature 165 °C
1.50 hour

@Temperature 329 °F
Minimum Bond Line
Epoxy Technology EPO-TEK® E3035 Electrically Conductive Adhesive
Product Description: EPO-TEK® E3035 is a single component, silver-filled epoxy for hybrid die and component attach.Advantages & Application Notes: Performs exceptionally well as a die attach for sm..
Cure Time 90.0 min

@Temperature 80.0 °C
1.50 hour

@Temperature 176 °F
Atom Adhesives AA-BOND G298 Epoxy Adhesive
AA-BOND G298 is a two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging.Appearance: Resin: Brown, Hardener: Dark Bro..
Cure Time 90.0 min

@Temperature 180 °C
1.50 hour

@Temperature 356 °F
Atom Adhesives AA-DUCT CG2 Epoxy Adhesive
AA-DUCT CG2 is a single component epoxy, formulated with silver coated ceramic that results in lower material costs without adversely sacrificing the properties obtained with a pure silver formulati..
Cure Time 90.0 min

@Temperature 121 °C
1.50 hour

@Temperature 250 °F
Henkel Hysol MA 562 Core Splice Adhesive
General-purpose 250°F / 121°C or 350°F / 177°C curing foaming adhesive. Designed for service temperatures from -67°F / -55°C to 350°F / 177°C. Medium tack, nonmetallic, low exotherm properti..
Cure Time 90.0 min

@Temperature 121 °C
1.50 hour

@Temperature 250 °F
Henkel Hysol PL 795 Film Adhesive
Epoxy film adhesive designed for composite bonding applications. May cure at 250°F / 121°C or 350°F / 177°C, with service temperatures up to 350°F / 177°C. Ideal for co-cure or secondary bondi..
Cure Time 90.0 min

@Temperature 121 °C
1.50 hour

@Temperature 250 °F
Henkel Hysol MA 562SFR Core Splice Adhesive
Modified epoxy foaming adhesive that may be cured at 250°F / 121°C or 350°F / 177°C. Flame-retardant, nonmetallic, medium tack, excellent slump resistance.
Cure Time 90.0 min

@Temperature 121 °C
1.50 hour

@Temperature 250 °F
Henkel Hysol PL 460 Core Splice Adhesive
Foaming epoxy adhesive in paste form for easy extrusion through packaged cartridges. Expands and cures at temperatures from 250°F / 121°C to 350°F / 177°C. Qualified to Boeing BMS 5-90, Type IV...
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