Processing Properties | Metric | English | Comments |
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Cure Time | 90.0 min @Temperature 150 °C |
1.50 hour @Temperature 302 °F |
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Lord Adhesives Thermosetâ„¢ ME-541 Underfill Encapsulant LORD Thermosetâ„¢ ME-541 encapsulant is an anhydride free, high purity, semi-conductor grade epoxy underfill product developed for the encapsulation of densely populated area array flip chip devi.. |
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Cure Time | 90.0 min @Temperature 177 °C |
1.50 hour @Temperature 351 °F |
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Henkel Hysol EA 9695 Film Adhesive Second generation, low flow, composite bonding film; excellent environmental resistance. Composite structure repair, cure and co-cure with composite laminates. Qualified to Airbus. Data from .050 ps.. |
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Cure Time | 90.0 min @Temperature 121 °C |
1.50 hour @Temperature 250 °F |
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Henkel Hysol MA 562S Core Splice Adhesive Modified epoxy foaming adhesive that may be cured at 250°F / 121°C or 350°F / 177°C. Nonmetallic, medium tack, excellent slump resistance. |
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Cure Time | 90.0 min @Temperature 121 °C |
1.50 hour @Temperature 250 °F |
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Henkel Hysol MA 557 Core Splice Adhesive Modified epoxy foaming adhesive that may be cured at 250°F / 121°C or 350°F / 177°C. Designed to seal, splice or reinforce honeycomb materials. Excellent slump resistance, medium tack, n.. |
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Cure Time | 90.0 min @Temperature 121 °C |
1.50 hour @Temperature 250 °F |
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Henkel Hysol PL 777-1FR Film Adhesive Flame retardant, nonmetallic modified epoxy film adhesiveApplications: Metal and Honeycomb Bonding |
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Cure Time | 90.0 - 120 min @Temperature 121 °C |
1.50 - 2.00 hour @Temperature 250 °F |
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Henkel Hysol PL 7000 Film Adhesive Epoxy film adhesive formulated to provide excellent performance properties in composite bonding, and has excellent results on composite surfaces that have been exposed to bond shop environments and .. |
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Cure Time | 90.0 min @Temperature 95.0 °C |
1.50 hour @Temperature 203 °F |
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Tra-Con Tra-Bond 293-1 General Purpose Instrument Epoxy Adhesive TRA-BOND 293-1 general purpose epoxy adhesive is designed to provide strong, resilient bonds to a variety of difficult-to-bond substrates, such as gold, nickel, silver, copper, and brass. The 293-se.. |
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Cure Time | 90.0 min @Temperature 80.0 °C |
1.50 hour @Temperature 176 °F |
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Tra-Con Tra-Duct 29121 Snap Cure Conductive Silver Epoxy Adhesive TRA-DUCT 29121 is 100% solids, two component silver filled epoxy designed for chip bonding in microelectronic and optoelectronic applications. TRA-DUCT 29121 is a soft, smooth paste. This two-part f.. |
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Cure Time | 90.0 min @Temperature 100 °C |
1.50 hour @Temperature 212 °F |
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Trelleborg Emerson & Cuming Eccobond® G 909 One-Component Fast Cure Epoxy Adhesive Emerson & Cuming G 909 Eccobond® One-Component Fast Cure Epoxy AdhesiveHigh strength, thixotropic, flexible, epoxy adhesive. High peel strength (30 pli). Recommended for bonding copper, aluminum an.. |
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Cure Time | 90.0 min @Temperature 95.0 °C |
1.50 hour @Temperature 203 °F |
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Tra-Con Tra-Bond 293-1T General Purpose Instrument Epoxy Adhesive-Thixotropic TRA-BOND 293-1T general purpose epoxy adhesive is designed to provide strong, semi-rigid bonds to a variety of difficult-to-bond substrates, such as gold, nickel, silver, copper, and brass. This ver.. |
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Cure Time | 90.0 min @Temperature 43.0 °C |
1.50 hour @Temperature 109 °F |
Light Load |
Chesterton ARC 890 Course Grade Sliding Wear Compound An advanced ceramic composite for the repair and protection of all metal surfaces subjected to severe erosion, corrosion, and chemical attack. It is normally applied at the thickness of 6 mm (1/4”).. |
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Cure Time | 90.0 min @Temperature 43.0 °C |
1.50 hour @Temperature 109 °F |
Light Load |
Chesterton ARC BX1 Sliding Wear Compound Description: An advanced contractor grade ceramic composite for the repair and protection of all metal surfaces subjected to severe erosion, corrosion, and chemical attack. It is normally applied at.. |
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Cure Time | 90.0 min @Temperature 80.0 °C |
1.50 hour @Temperature 176 °F |
Minimum Bond Line |
Epoxy Technology EPO-TEK® 375 High Temperature Epoxy Product Description: EPO-TEK®375 is a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications. Also available in a single component frozen sy.. |
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Cure Time | 90.0 min @Temperature 165 °C |
1.50 hour @Temperature 329 °F |
Minimum Bond Line |
Epoxy Technology EPO-TEK® H35-175MPLV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H35-175MPLV is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-el.. |
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Cure Time | 90.0 min @Temperature 165 °C |
1.50 hour @Temperature 329 °F |
Minimum Bond Line |
Epoxy Technology EPO-TEK® H35-175MPT Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H35MPT is a single component, silver-filled, electrically conductive epoxy designed for military hybrid die and component attach. High viscosity version of EPO-TEK® H.. |
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Cure Time | 90.0 min @Temperature 285 °C |
1.50 hour @Temperature 545 °F |
Post-Cure, Minimum Bond Line |
Epoxy Technology EPO-TEK® P1011S Electrically Conductive Modified Polyimide Product Description: EPO-TEK® P1011S is a single component, modified polyimide, high temperature grade, silver-filled electrically and thermally conductive adhesive designed for semiconductor die-a.. |
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Cure Time | 90.0 min @Temperature 43.0 °C |
1.50 hour @Temperature 109 °F |
Light Load |
Chesterton ARC MX2 High Wear Fine Particle Wear Compound Description: An advanced ceramic composite for the repair and protection of all metal surfaces subjected to severe erosion, corrosion and chemical attack. It is applied at a thickness of 3 mm (1/8”.. |
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Cure Time | 90.0 min @Temperature 165 °C |
1.50 hour @Temperature 329 °F |
Minimum Bond Line |
Epoxy Technology EPO-TEK® E3035 Electrically Conductive Adhesive Product Description: EPO-TEK® E3035 is a single component, silver-filled epoxy for hybrid die and component attach.Advantages & Application Notes: Performs exceptionally well as a die attach for sm.. |
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Cure Time | 90.0 min @Temperature 80.0 °C |
1.50 hour @Temperature 176 °F |
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Atom Adhesives AA-BOND G298 Epoxy Adhesive AA-BOND G298 is a two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging.Appearance: Resin: Brown, Hardener: Dark Bro.. |
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Cure Time | 90.0 min @Temperature 180 °C |
1.50 hour @Temperature 356 °F |
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Atom Adhesives AA-DUCT CG2 Epoxy Adhesive AA-DUCT CG2 is a single component epoxy, formulated with silver coated ceramic that results in lower material costs without adversely sacrificing the properties obtained with a pure silver formulati.. |
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Cure Time | 90.0 min @Temperature 121 °C |
1.50 hour @Temperature 250 °F |
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Henkel Hysol MA 562 Core Splice Adhesive General-purpose 250°F / 121°C or 350°F / 177°C curing foaming adhesive. Designed for service temperatures from -67°F / -55°C to 350°F / 177°C. Medium tack, nonmetallic, low exotherm properti.. |
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Cure Time | 90.0 min @Temperature 121 °C |
1.50 hour @Temperature 250 °F |
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Henkel Hysol PL 795 Film Adhesive Epoxy film adhesive designed for composite bonding applications. May cure at 250°F / 121°C or 350°F / 177°C, with service temperatures up to 350°F / 177°C. Ideal for co-cure or secondary bondi.. |
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Cure Time | 90.0 min @Temperature 121 °C |
1.50 hour @Temperature 250 °F |
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Henkel Hysol MA 562SFR Core Splice Adhesive Modified epoxy foaming adhesive that may be cured at 250°F / 121°C or 350°F / 177°C. Flame-retardant, nonmetallic, medium tack, excellent slump resistance. |
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Cure Time | 90.0 min @Temperature 121 °C |
1.50 hour @Temperature 250 °F |
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Henkel Hysol PL 460 Core Splice Adhesive Foaming epoxy adhesive in paste form for easy extrusion through packaged cartridges. Expands and cures at temperatures from 250°F / 121°C to 350°F / 177°C. Qualified to Boeing BMS 5-90, Type IV... |