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Polymer Property : Minimum Service Temperature, Air = -67.0 °F Product List

Thermal Properties

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Thermal Properties Metric English Comments
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Recommended use; SAE J-2236
Rogers Corporation Bisco™ BF-1000 Cellular Silicone Foam
Soft, low compression set silicone foam often specified to meet safely-conscious requirements. UL recognized for flame retardance.Applications: Low closure-force gaskets and seals, Vibration and sh..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Non-brittle after 3 minutes
Precision Polymer Engineering H70B Epichlorohydrin
Peroxide Cured, Epichlorohydrin Rubber, 65-75 °IRHD. Terpolymer of epichlorohydrin, ethylene oxide and an unsaturated monomer. ASTM and ISO designation = GECO.Applications: Excellent resistance t..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Fujipoly Industries Zebra® 2004 Carbon Sponge Self-Supported Connectors
Fujipoly Carbon Zebra Connectors and Low Temperature Carbon Zebra Connectors consist of alternating layers of conductive carbon filled and non-conductive silicone rubber. Contact density of the carb..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Momentive Performance Materials TSE399 One Component RTV Adhesive Sealant/Coating, Clear/White/Black
TSE392, TSE397 and TSE399 adhesive sealants/coatings are one component RTV’s that cure quickly by reacting with atmospheric moisture forming a soft dielectric silicone rubber. These materials i..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Cytec EN-2521 (Conap) Potting and Encapsulation Adhesive
Polyurethane Potting and Encapsulating SystemsConathane® EN-2500 series polyurethane potting and encapsulating systems from Cytek have varying degrees of worklife, viscosity and hardness for many s..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Intermittent
Epoxy Technology EPO-TEK® 302 Fast Setting, Optical Epoxy
Product Description: EPO-TEK® 302 is a two component, fast-gelling, room temperature curing epoxy, designed for electronic, optical, medical, and general applications. Advantages & Application No..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Intermittent
Epoxy Technology EPO-TEK® 330 Low Viscosity, Optical Epoxy
Product Description: EPO-TEK® 330 is a two component, high-temperature grade, electrically and thermally insulating epoxy for semiconductor, electronics, fiber optics and medical applications.Advan..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
Epoxy Technology EPO-TEK® 431 Copper Filled Epoxy
A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for interconnecting, grounding and EMI RF shielding...
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Intermittent
Epoxy Technology EPO-TEK® 730 Unfilled Black General and Structural Grade Epoxy
Material Description: A two component, room temperature curing, general and structural grade epoxy. It can be used for adhesive, sealing, and encapsulating applications in medical, xray device, fil..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Intermittent
Epoxy Technology EPO-TEK® EK2000 Epoxy
Preliminary Product Information SheetMaterial Description: A two component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance ..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Intermittent
Epoxy Technology EPO-TEK® H20E-PFC Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H20E-PFC is a two component, semiconductor grade epoxy, designed for flip chip interconnects using a solder-free joining method.Advantages & Application Notes: Stencil..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Intermittent
Epoxy Technology EPO-TEK® H20F Electrically Conductive, Flexible Epoxy
Product Description: EPO-TEK® H20F is a two component, flexible silver epoxy. It was designed for flexible type circuitry, such as switching circuits in a flexible panel system, as well as large di..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
Epoxy Technology EPO-TEK® H22 Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H22 is a two component, silver-filled epoxy system designed specifically for die bonding and sealing hybrid circuit packages.Advantages & Application Notes: A smooth, ..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Intermittent
Epoxy Technology EPO-TEK® H24 Electrically Conductive Epoxy
Product Description: EPO-TEK® H24 is a two component, electrically and thermally conductive epoxy adhesive designed for semiconductor die attach and hybrid micro-electronics assembly.Advantages & A..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
Epoxy Technology EPO-TEK® H37-MP Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H37-MP is a single component, electrically conductive, thixotropic silver-filled adhesive for die-attach and SMD attach inside hybrid microelectronic packages. Also av..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Intermittent
Epoxy Technology EPO-TEK® OE101 Two Component Epoxy
Material Description: A two component epoxy designed for low stress applications in fiber optic packaging, opto-electronics and semiconductors. It is a lower modulus version of EPO-TEK® 353ND.Inf..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
Epoxy Technology EPO-TEK® OG116-31 UV Cure Optical Epoxy
Product Description: EPO-TEK® OG116-31 is a single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, medical..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
Epoxy Technology EPO-TEK® OM125 Optical Epoxy
Product Description: EPO-TEK® OM125 is two component, high Tg, optical epoxy designed for bonding multi-mode fiber optic connectors. Advantages & Application Notes: Color coded blue for easy operat..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Epoxyset Epoxibond EB-119SP Unfilled Epoxy Adhesive
A two-component, unfilled, high temperature epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.Information provided by Epoxyset Inc...
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Epoxyset Epoxiohm EO-97M Electrically Conductive Epoxy Adhesive
EPOXIOHM-97M is one part, pure silver filled, high electrical conductivity, epoxy adhesive. It is designed for microelectronics chip bonding application.Information provided by Epoxyset Inc.
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
Epoxy Technology EPO-TEK® H20E Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H20E is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also ..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Intermittent
Epoxy Technology EPO-TEK® H20E-175 Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H20E-175 is a two component epoxy designed for semiconductor die-attach. It is a higher Tg version of EPO-TEK® H20E. It was designed to be used in semiconductor / J..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
ITW Plexus Plexus™ MA922 Methacrylate Adhesive
Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.All purpose, low odor, medium open time.Information provided by Illinois Tool Works.
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