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Polymer Property : Minimum Service Temperature, Air = -67.0 °F Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Recommended use; SAE J-2236 |
| Rogers Corporation Bisco™ BF-1000 Cellular Silicone Foam Soft, low compression set silicone foam often specified to meet safely-conscious requirements. UL recognized for flame retardance.Applications: Low closure-force gaskets and seals, Vibration and sh.. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Non-brittle after 3 minutes |
| Precision Polymer Engineering H70B Epichlorohydrin Peroxide Cured, Epichlorohydrin Rubber, 65-75 °IRHD. Terpolymer of epichlorohydrin, ethylene oxide and an unsaturated monomer. ASTM and ISO designation = GECO.Applications: Excellent resistance t.. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
| Fujipoly Industries Zebra® 2004 Carbon Sponge Self-Supported Connectors Fujipoly Carbon Zebra Connectors and Low Temperature Carbon Zebra Connectors consist of alternating layers of conductive carbon filled and non-conductive silicone rubber. Contact density of the carb.. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
| Momentive Performance Materials TSE399 One Component RTV Adhesive Sealant/Coating, Clear/White/Black TSE392, TSE397 and TSE399 adhesive sealants/coatings are one component RTV’s that cure quickly by reacting with atmospheric moisture forming a soft dielectric silicone rubber. These materials i.. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
| Cytec EN-2521 (Conap) Potting and Encapsulation Adhesive Polyurethane Potting and Encapsulating SystemsConathane® EN-2500 series polyurethane potting and encapsulating systems from Cytek have varying degrees of worklife, viscosity and hardness for many s.. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
| Epoxy Technology EPO-TEK® 302 Fast Setting, Optical Epoxy Product Description: EPO-TEK® 302 is a two component, fast-gelling, room temperature curing epoxy, designed for electronic, optical, medical, and general applications. Advantages & Application No.. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
| Epoxy Technology EPO-TEK® 330 Low Viscosity, Optical Epoxy Product Description: EPO-TEK® 330 is a two component, high-temperature grade, electrically and thermally insulating epoxy for semiconductor, electronics, fiber optics and medical applications.Advan.. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
| Epoxy Technology EPO-TEK® 431 Copper Filled Epoxy A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for interconnecting, grounding and EMI RF shielding... |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
| Epoxy Technology EPO-TEK® 730 Unfilled Black General and Structural Grade Epoxy Material Description: A two component, room temperature curing, general and structural grade epoxy. It can be used for adhesive, sealing, and encapsulating applications in medical, xray device, fil.. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
| Epoxy Technology EPO-TEK® EK2000 Epoxy Preliminary Product Information SheetMaterial Description: A two component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance .. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
| Epoxy Technology EPO-TEK® H20E-PFC Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-PFC is a two component, semiconductor grade epoxy, designed for flip chip interconnects using a solder-free joining method.Advantages & Application Notes: Stencil.. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
| Epoxy Technology EPO-TEK® H20F Electrically Conductive, Flexible Epoxy Product Description: EPO-TEK® H20F is a two component, flexible silver epoxy. It was designed for flexible type circuitry, such as switching circuits in a flexible panel system, as well as large di.. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
| Epoxy Technology EPO-TEK® H22 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H22 is a two component, silver-filled epoxy system designed specifically for die bonding and sealing hybrid circuit packages.Advantages & Application Notes: A smooth, .. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
| Epoxy Technology EPO-TEK® H24 Electrically Conductive Epoxy Product Description: EPO-TEK® H24 is a two component, electrically and thermally conductive epoxy adhesive designed for semiconductor die attach and hybrid micro-electronics assembly.Advantages & A.. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
| Epoxy Technology EPO-TEK® H37-MP Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H37-MP is a single component, electrically conductive, thixotropic silver-filled adhesive for die-attach and SMD attach inside hybrid microelectronic packages. Also av.. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
| Epoxy Technology EPO-TEK® OE101 Two Component Epoxy Material Description: A two component epoxy designed for low stress applications in fiber optic packaging, opto-electronics and semiconductors. It is a lower modulus version of EPO-TEK® 353ND.Inf.. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
| Epoxy Technology EPO-TEK® OG116-31 UV Cure Optical Epoxy Product Description: EPO-TEK® OG116-31 is a single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, medical.. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
| Epoxy Technology EPO-TEK® OM125 Optical Epoxy Product Description: EPO-TEK® OM125 is two component, high Tg, optical epoxy designed for bonding multi-mode fiber optic connectors. Advantages & Application Notes: Color coded blue for easy operat.. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
| Epoxyset Epoxibond EB-119SP Unfilled Epoxy Adhesive A two-component, unfilled, high temperature epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.Information provided by Epoxyset Inc... |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
| Epoxyset Epoxiohm EO-97M Electrically Conductive Epoxy Adhesive EPOXIOHM-97M is one part, pure silver filled, high electrical conductivity, epoxy adhesive. It is designed for microelectronics chip bonding application.Information provided by Epoxyset Inc. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
| Epoxy Technology EPO-TEK® H20E Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also .. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
| Epoxy Technology EPO-TEK® H20E-175 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-175 is a two component epoxy designed for semiconductor die-attach. It is a higher Tg version of EPO-TEK® H20E. It was designed to be used in semiconductor / J.. |
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| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
| ITW Plexus Plexus™ MA922 Methacrylate Adhesive Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.All purpose, low odor, medium open time.Information provided by Illinois Tool Works. |
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