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Polymer Property : Minimum Service Temperature, Air = -67.0 °F Product List

Thermal Properties

Tips: 30 items are displayed at most. For the rest of the results, please contact customer service.
Thermal Properties Metric English Comments
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Parker Chomerics CHO-BOND 4660 Conductive Caulk/Sealant
CHO-BOND® 4660 caulking compound is a single-component, electrically conductive, paste-like material intended for EMI shielding and grounding applications. Its non-hardening characteristic makes it..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Parker Chomerics CHO-BOND 589-29 Conductive Epoxy
Low cost, highly conductive adhesive system which combines the strong adhesion characteristics of an epoxy with the superior conductivity of silver. CHO-BOND 589-29 adhesive meets the most exacting ..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Flex TR10; ASTM D1329
Parker Chomerics CHO-SEAL 1287 Conductive Elastomer
Conductive Fluorosilicone EMI/EMP Gasket. This material is silver-plated-aluminum-filled fluorosilicone elastomer which provides pressure and environmental sealing as well as high levels of EMI shie..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Parker Chomerics Tecknit Consil®-E 811 Extruded Silver-Filled Silicone Elastomer
Description: CONSIL-E is a continuously extruded silicone elastomer filled with silver-plated inert particles. It is a medium hardness material providing high electrical conductivity and moisture se..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Parker Chomerics Tecknit Teckfip™ FIP-R Formed in Place Conductive Elastomer
Description: FIP-R is based on a very rugged pure silver particle. By using silver as the conductive medium, this compound offers great performance in terms of heat aged electrical conductive stabil..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
dry
ITW Devcon Plastic Welderâ„¢ Methacrylate Adhesive II, Straw, Black
Information provided by ITW Devcon
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Tra-Con Tra-Bond 724-17 Polyurethane Adhesive
TRA-BOND 724-17 premixed and frozen, polyurethane adhesive is designed for good adhesion, providing strong resilient bonds to a wide variety of substrates, including aluminum, solder, nylon, mylar a..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Tra-Con Tra-Bond 2155 Thermally Conductive Electrically Insulating Compound
TRA-BOND 2155 is a heat conductive epoxy system used for die and heat sink attach, staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit ..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Trelleborg Emerson & Cuming Stycast® 2057FR/11 Two-Component Epoxy Flame Retardant Encapsulant
Features and Typical ApplicationsProvide flame resistance down to 1/8 of an inch. These products also offer various other features such as thermal shock protection, low viscosity, and thermal conduc..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Cytec EN-2521 (Conap) Potting and Encapsulation Adhesive
Polyurethane Potting and Encapsulating SystemsConathane® EN-2500 series polyurethane potting and encapsulating systems from Cytek have varying degrees of worklife, viscosity and hardness for many s..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
Epoxy Technology EPO-TEK® 320-LV Optically Opaque Epoxy
Material Description: A two component, optically opaque epoxy adhesive designed for semiconductor and PCB applications in optoelectronic instrumentation and assemblies. A lower viscosity version of..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Intermittent
Epoxy Technology EPO-TEK® 353ND High Temperature Epoxy
Product Description: EPO-TEK® 353ND is a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications. It is one of the most popular EPO-TEK® bra..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Intermittent
Epoxy Technology EPO-TEK® 353ND-T High Temperature Thixotropic Epoxy
Product Description: EPO TEK® 353ND-T is a two component, highly thixotropic epoxy with non-flowing properties and high temperature resistance. Advantages & Application Notes: Suitable for fiber op..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Intermittent
Epoxy Technology EPO-TEK® 354 High Temperature Epoxy
Product Description: EPO-TEK® 354 is a two component, high Tg epoxy designed for semiconductor packaging in medical, fiber optic and optoelectronic assemblies. It is an electrically and thermally i..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
Epoxy Technology EPO-TEK® 360ST High Temperature Epoxy
Material Description: A two component, high-temperature grade, electrically and thermally insulating epoxy for semiconductor, electronics, fiber optics and medical applications. It is a slightly th..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Intermittent
Epoxy Technology EPO-TEK® 730 General Purpose Epoxy
Product Description: EPO-TEK® 730 is a two component, thixotropic, room temperature-curing epoxy adhesive. Advantages & Application Notes: Excellent all purpose adhesive. Many uses in job shop and ..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Intermittent
Epoxy Technology EPO-TEK® H20E-8 Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H20E-8 is a two component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is a higher viscos..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Intermittent
Epoxy Technology EPO-TEK® H20E-MP Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H20E-MP is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is al..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Intermittent
Epoxy Technology EPO-TEK® H20S Electrically Conductive, Silver Epoxy for Die Stamping
Product Description: EPO-TEK® H20S is a modified version of EPO-TEK® H20E, designed primarily for die stamping and dispensing techniques for chip bonding. EPO-TEK®H20S is a highly reliable, two ..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
Epoxy Technology EPO-TEK® H31D-LV Epoxy
Material Description: A single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and optoelectronic packaging. It i..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Intermittent
Epoxy Technology EPO-TEK® H31D-LV Epoxy
Material Description: A single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and optoelectronic packaging. It i..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Intermittent
Epoxy Technology EPO-TEK® H35-175MP Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H35-175MP is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-elec..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
Epoxy Technology EPO-TEK® H75 Thermally Conductive, Electrically Insulating Epoxy
Material Description: A two component, high Tg, thermally conductive, electrically insulating epoxy designed for semiconductor packaging including heat sinking, hermetic sealing, and opto-electronic..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Intermittent
Epoxy Technology EPO-TEK® H77S Thermally Conductive, Electrically Insulating Epoxy
Material Description: A two component, thermally conductive, electrically insulating high-temperature epoxy adhesive. It can be used for high temperature applications within semiconductor packaging..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Intermittent
Epoxy Technology EPO-TEK® OE100-T High Temperature Epoxy
Material Description: A two component, high Tg, high temperature grade epoxy designed for semiconductor, underfill, hard-disk drive and hybrid micro-electronics packaging applications. The epoxy ca..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Intermittent
Epoxy Technology EPO-TEK® OE101 Two Component Epoxy
Material Description: A two component epoxy designed for low stress applications in fiber optic packaging, opto-electronics and semiconductors. It is a lower modulus version of EPO-TEK® 353ND.Inf..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Intermittent
Epoxy Technology EPO-TEK® T7109 Thermally Conductive Epoxy
Product Description: EPO-TEK® T7109 is a two component, thermally conductive epoxy designed for die attach and heat-sinking applications found in the semiconductor, hybrid, medical and optical indu..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Intermittent
Epoxy Technology EPO-TEK® TV1002 Polyimide Adhesive
Material Description: A single component, screen printable polyimide adhesive designed for semiconductor wafer passivation applications. It is a high temperature chemistry capable of resisting >400..
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
Epoxy Technology EPO-TEK® TZ101 Thermally Conductive Epoxy
Product Description: EPO-TEK® TZ101 is a single component, electrically insulating, thermally conductive epoxy adhesive designed for heatsinking of semiconductors, hybrids, electronics, and optics...
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
ACC QM 262F QSI Quantum Silicones 60 Durometer Addition Cure Moldmaking Material
QM 262F is a two component, room temperature addition cure silicone material. The cured rubber has excellent mechanical properties, good shelf-life stability, excellent physical properties and resin..
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