- HOME
- POLYMER SEARCH
- Polymer Property : Minimum Service Temperature, Air = -67.0 °F
Polymer Property : Minimum Service Temperature, Air = -67.0 °F Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
| P & P Technology EC-J Silver Aluminum Loaded Silicone P & P Technology material reference EC-J is a silicone elastomer with a Silver/Aluminum conductive filler. The material is specially compounded to offer excellent physical and electrical properties.. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
| Parker Chomerics CHO-SHIELD® 4076 Conductive Coating CHO-SHIELD® 4076 nickel-filled polyurethane is recommended for shielding an entire room. This durable coating adheres well to plaster, wood, glass, concrete, drywall and most metals.Information pro.. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
| Parker Chomerics WIN-SHIELD™ A (Acrylic) EMI Shielded Window Description: Parker Chomerics display windows and filters are available in various plastic materials, including polycarbonate, acrylic and cast polycarbonate. A unique feature of Parker Chomerics w.. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
| Parker Chomerics WIN-SHIELD™ P (Polycarbonate) EMI Shielded Window Description: Parker Chomerics display windows and filters are available in various plastic materials, including polycarbonate, acrylic and cast polycarbonate. A unique feature of Parker Chomerics w.. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Acrylic |
| Parker Chomerics Tecknit ECTC™ Windows Electrically Conductive Transparent Coating Description: ECTC WINDOWS are custom designed optical display panels produced by depositing a very thin electrically conductive transparent coating directly onto the surface of various optical subst.. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Recommended use; SAE J-2236 |
| Rogers Corporation Bisco™ HT-870 Cellular Silicone Foam Gasketing and sealing rating is JMLU-2 (Listed) per UL 157. No UV degradation per SAE J-1960. Ozone effect rating is 0 (no cracks) per ASTM D-1171. No staining per ASTM D-925(A). Passes AMS-3568.. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
| Parker Chomerics METALKLIP® Clip-On EMI Gasket Description: Chomerics’ METALKLIP® gasketing is a simple, quick means of mounting on EMI gasket onto 15-20 gauge sheet metal enclosure doors or frames. EMI shielding is provided by either a carbon.. |
|||
| Minimum Service Temperature, Air | -55.0 - -40.0 °C | -67.0 - -40.0 °F | Average value: -46.7 °C Grade Count:3 |
| Overview of materials for Polycarbonate, Optical Grade This property data is a summary of similar materials in the MatWeb database for the category "Polycarbonate, Optical Grade". Each property range of values reported is minimum and maximum values of a.. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
| Cytec EN-2527 (Conap) Potting and Encapsulation Adhesive Polyurethane Potting and Encapsulating SystemsConathane® EN-2500 series polyurethane potting and encapsulating systems from Cytek have varying degrees of worklife, viscosity and hardness for many s.. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
| Epoxy Technology EPO-TEK® 301-2FL Low Stress, Optical Epoxy Product Description: EPO-TEK® 301-2FL is a two component optical, medical, and semiconductor grade epoxy resin. It is a more flexible version of EPO-TEK® 301-2.Advantages & Application Notes: Sug.. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
| Epoxy Technology EPO-TEK® 330 Low Viscosity, Optical Epoxy Product Description: EPO-TEK® 330 is a two component, high-temperature grade, electrically and thermally insulating epoxy for semiconductor, electronics, fiber optics and medical applications.Advan.. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
| Epoxy Technology EPO-TEK® 353ND-T Black High Temperature Thixotropic Epoxy Product Description: EPO-TEK® 353ND-T Black is a two component, high temperature, thixotropic epoxy for fiber optic, PCB and various medical applications. Advantages & Application Notes: This produ.. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
| Epoxy Technology EPO-TEK® 360ST High Temperature Epoxy Material Description: A two component, high-temperature grade, electrically and thermally insulating epoxy for semiconductor, electronics, fiber optics and medical applications. It is a slightly th.. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
| Epoxy Technology EPO-TEK® E2116 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E2116 is a two component, silver-filled and stencil printable electrically conductive adhesive for bonding SMDs onto PCB and substrates. Can be used as a “lead-free”.. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
| Epoxy Technology EPO-TEK® E3001-HV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & .. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
| Epoxy Technology EPO-TEK® E3035T-2 Electrically Conductive Epoxy Product Description: EPO-TEK® E3035T-2 is a single component, silver-filled epoxy for semiconductor die attach, as well as SMD attach on hybrid circuits.Advantages & Application Notes: This epoxy c.. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
| Epoxy Technology EPO-TEK® ED1021 Epoxy Preliminary Product Information SheetMaterial Description: A single component, silver-filled epoxy designed for low power semiconductor LED die attach applications. Unique features include its abil.. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
| Epoxy Technology EPO-TEK® H22 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H22 is a two component, silver-filled epoxy system designed specifically for die bonding and sealing hybrid circuit packages.Advantages & Application Notes: A smooth, .. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
| Epoxy Technology EPO-TEK® H35-175MPLV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H35-175MPLV is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-el.. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
| Epoxy Technology EPO-TEK® H55 Epoxy Material Description: A two component, thixotropic and high temperature epoxy designed to be used for hybrids and PCB applications.Information Provided by Epoxy Technology |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
| Epoxy Technology EPO-TEK® OE120 Two Component Epoxy Material Description: A two component, opaque epoxy, designed for fiber optics packaging applications. It is a black-colored version of EPO-TEK 353ND-T. It has a high Tg for resisting elevated ope.. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
| Epoxyset Epoxibond EB-107LP-1 Unfilled Epoxy Adhesive A two-component, unfilled epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.Information provided by Epoxyset Inc. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
| Epoxy Technology EPO-TEK® H37-MPT Epoxy Material Description: A single component, silver-filled and electrically conductive adhesive designed for semiconductor die attach and bonding SMDs for hybrid microelectronic packaging. It is certi.. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
| Aremco Aremco-Bond™ 2315X High Temperature Epoxide Potting Compound Improved Crack Resistance & Bond Strength. High Temperature Resistance, Thermally Conductive, Low Viscosity. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
| Atom Adhesives AA-SUPERTHERM 195 Epoxy Adhesive AA-SUPERTHERM 195 is a two component, thermally conductive epoxy system recommended for staking transistors, diodes, resistors, integrated circuits and other heat sensitive components to printed cir.. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
| 3M VFP-876 Tubing 3M VFP-876 is the most flexible of the heat-shrinkable, polyolefin tubings. Rated at 135°C. VFP-876 Tubing has been engineered to offer a low shrink temperature of 100°C. This allows the tubing to.. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
| Aremco Aremco-Bond™ 2335 Ultra High Temperature Epoxy Ceramic-Filled, Low Expansion, High Lap-Shear Strength & Chemical Resistance, Low Outgassing. |
|||
Copyright © lookpolymers.com All Rights Reserved