|Specific Gravity||2.44 g/cc||2.44 g/cc||ASTM D 792|
|RTP Company RTP 299 X 127044 D Nylon 6/6 (PA); Thermally Conductive - Flame Retardant
|Specific Gravity||2.44 g/cc||2.44 g/cc|
|Epoxy Technology EPO-TEK® P1011S Electrically Conductive Modified Polyimide
Product Description: EPO-TEK® P1011S is a single component, modified polyimide, high temperature grade, silver-filled electrically and thermally conductive adhesive designed for semiconductor die-a..
|Specific Gravity||2.44 g/cc||2.44 g/cc||uncured|
|Atom Adhesives AA-BOND 2153 Epoxy Adhesive
AA-BOND 2153 is a thixotropic (smooth paste) thermal conductive epoxy system that passes the NASA Outgassing Specification. It is used for staking transistors, diodes, resistors, integrated circuits..