Polymer Property : Volume Resistivity = 0.00050 ohm-cm Product List

Electrical Properties

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Electrical Properties	Metric	English	Comments
Volume Resistivity	0.00050 ohm-cm	0.00050 ohm-cm	cured 1 hour at 125°C
Resin Technology Group TIGA 908 Gold Bonder - Low Stress Silver Conductive 100 parts resin to 6 parts hardener.TIGA 908 is a low stress, conductive silver filled epoxy adhesive. It is recommended for bonding, and sealing electronic applications which require bonding to gol..
Volume Resistivity	0.00050 ohm-cm	0.00050 ohm-cm	cured 2 min @ 150°C
Tra-Con Tra-Duct 2958 Snap Cure Conductive Silver Epoxy Adhesive TRA-DUCT 2958 is a two-part, smooth paste of specially refined and processed epoxy and silver components, recommended for electronic, microelectronic and die-attach bonding and sealing applications ..
Volume Resistivity	0.00050 ohm-cm	0.00050 ohm-cm	cured 15 min @ 150°C
Tra-Con Tra-Duct 2902 Room Temperature Conductive Silver Epoxy Adhesive TRA-DUCT 2902 is an electrically conducting silver-filled epoxy compound recommended for electronic bonding and sealing applications that require a combination of good mechanical and electrical prop..
Volume Resistivity	0.00050 ohm-cm	0.00050 ohm-cm	cured 2 hrs @ 100°C
Tra-Con Tra-Duct 2924 Conductive Silver Epoxy Adhesive TRA-DUCT 2924 is a two part electrically conductive composition developed for low shrinkage, low resistivity bonding applications where good electrical and physical properties over a wide temperatur..
Volume Resistivity	0.00050 ohm-cm	0.00050 ohm-cm	cured 2 min @ 150°C
Tra-Con Tra-Duct 2956 Low Ion Snap Cure Silver Epoxy Adhesive TRA-DUCT 2956 is recommended for the bonding and sealing of electronic components where a combination of electrical and mechanical properties are required. This two-part, smooth, paste system of sil..
Volume Resistivity	>= 0.00050 ohm-cm	>= 0.00050 ohm-cm
Epoxy Technology EPO-TEK® E2001 Electrically Conductive, Silver-Filled Epoxy Product Description: EPO-TEK® E2001 is a two component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications using a snap-cure profile. Advantages & Appl..
Volume Resistivity	>= 0.00050 ohm-cm	>= 0.00050 ohm-cm
Epoxy Technology EPO-TEK® E2001-HV Electrically Conductive, Silver-Filled Epoxy Product Description: EPO-TEK® E2001-HV Is a snap cure, two component, silver-filled die attach adhesive for semiconductor plastic IC packaging.Advantages & Application Notes:Snap cure adhesive or f..
Volume Resistivity	<= 0.00050 ohm-cm	<= 0.00050 ohm-cm
Epoxy Technology EPO-TEK® E2101 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E2101 is a two component, thixotropic, electrically conductive adhesive. It may be used for circuit assembly and semiconductor applications. Advantages & Application ..
Volume Resistivity	<= 0.00050 ohm-cm	<= 0.00050 ohm-cm
Epoxy Technology EPO-TEK® E2116 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E2116 is a two component, silver-filled and stencil printable electrically conductive adhesive for bonding SMDs onto PCB and substrates. Can be used as a “lead-free”..
Volume Resistivity	<= 0.00050 ohm-cm	<= 0.00050 ohm-cm
Epoxy Technology EPO-TEK® E3001-HV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & ..
Volume Resistivity	<= 0.00050 ohm-cm	<= 0.00050 ohm-cm
Epoxy Technology EPO-TEK® E3035T-2 Electrically Conductive Epoxy Product Description: EPO-TEK® E3035T-2 is a single component, silver-filled epoxy for semiconductor die attach, as well as SMD attach on hybrid circuits.Advantages & Application Notes: This epoxy c..
Volume Resistivity	<= 0.00050 ohm-cm	<= 0.00050 ohm-cm
Epoxy Technology EPO-TEK® E3037 Epoxy Material Description: A single component, electrically conductive, thixotropic silver-filled epoxy for die-attach and SMD-attach inside hybrid microelectronics.Information Provided by Epoxy Technolo..
Volume Resistivity	<= 0.00050 ohm-cm	<= 0.00050 ohm-cm
Epoxy Technology EPO-TEK® E4110 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E4110 is an electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80°C, although other..
Volume Resistivity	<= 0.00050 ohm-cm	<= 0.00050 ohm-cm
Epoxy Technology EPO-TEK® E4110-PFC Electrically Conductive Epoxy Product Description: EPO-TEK®E4110-PFC is a two-component, silver filled, electrically conductive adhesive designed for semiconductor IC packaging and general electronic assembly. It is a thixotr..
Volume Resistivity	<= 0.00050 ohm-cm	<= 0.00050 ohm-cm
Epoxy Technology EPO-TEK® EE149-6 Epoxy Material Description: A single component, silver-filled, B-stageable epoxy designed for semiconductor flip chip packaging or hybrid micro-electronic substrate attach or lid-sealing.Information Provi..
Volume Resistivity	<= 0.00050 ohm-cm	<= 0.00050 ohm-cm
Epoxy Technology EPO-TEK® EV2002 Silver-filled, electrically conductive, flexible epoxy Material Description: Silver-filled, electrically conductive, flexible epoxyInformation Provided by Epoxy Technology
Volume Resistivity	<= 0.00050 ohm-cm	<= 0.00050 ohm-cm
Epoxy Technology EPO-TEK® EV2118-2 Silver-filled, electrically conductive epoxy Preliminary Product Information SheetMaterial Description: A silver-filled, electrically conductive epoxy designed for semiconductor and electronic assembly.Information Provided by Epoxy Technology
Volume Resistivity	<= 0.00050 ohm-cm	<= 0.00050 ohm-cm
Epoxy Technology EPO-TEK® H20S Electrically Conductive, Silver Epoxy for Die Stamping Product Description: EPO-TEK® H20S is a modified version of EPO-TEK® H20E, designed primarily for die stamping and dispensing techniques for chip bonding. EPO-TEK®H20S is a highly reliable, two ..
Volume Resistivity	<= 0.00050 ohm-cm	<= 0.00050 ohm-cm
Epoxy Technology EPO-TEK® H22 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H22 is a two component, silver-filled epoxy system designed specifically for die bonding and sealing hybrid circuit packages.Advantages & Application Notes: A smooth, ..
Volume Resistivity	<= 0.00050 ohm-cm	<= 0.00050 ohm-cm
Epoxy Technology EPO-TEK® H27D Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H27D is a two component, silver-filled epoxy adhesive designed for semiconductor and hybrid-microelectronic packaging applications.Advantages & Application Notes: Rheo..
Volume Resistivity	<= 0.00050 ohm-cm	<= 0.00050 ohm-cm
Epoxy Technology EPO-TEK® H35-175MPLV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H35-175MPLV is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-el..
Volume Resistivity	<= 0.00050 ohm-cm	<= 0.00050 ohm-cm
Epoxy Technology EPO-TEK® H37-MP Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H37-MP is a single component, electrically conductive, thixotropic silver-filled adhesive for die-attach and SMD attach inside hybrid microelectronic packages. Also av..
Volume Resistivity	<= 0.00050 ohm-cm	<= 0.00050 ohm-cm
Epoxy Technology EPO-TEK® H44 Gold-Filled, Electrically Conductive Epoxy Product Description: EPO-TEK® H44 is a single component, gold-filled, electrically conductive epoxy adhesive designed for hybrid microelectronic packaging.Advantages & Application Notes: High visco..
Volume Resistivity	<= 0.00050 ohm-cm	<= 0.00050 ohm-cm
Epoxy Technology EPO-TEK® P1011 Electrically Conductive Modified Polyimide Product Description: EPO-TEK® P-1011 is a single component, modified polyimide, silver-filled adhesive designed for chip bonding in microelectronic and optoelectronic applications.Advantages & Appl..
Volume Resistivity	<= 0.00050 ohm-cm	<= 0.00050 ohm-cm
Epoxy Technology EPO-TEK® P1011S Electrically Conductive Modified Polyimide Product Description: EPO-TEK® P1011S is a single component, modified polyimide, high temperature grade, silver-filled electrically and thermally conductive adhesive designed for semiconductor die-a..
Volume Resistivity	<= 0.00050 ohm-cm	<= 0.00050 ohm-cm
Epoxy Technology EPO-TEK® E3035 Electrically Conductive Adhesive Product Description: EPO-TEK® E3035 is a single component, silver-filled epoxy for hybrid die and component attach.Advantages & Application Notes: Performs exceptionally well as a die attach for sm..
Volume Resistivity	<= 0.00050 ohm-cm	<= 0.00050 ohm-cm
Epoxy Technology EPO-TEK® H31 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H31 is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-electronic..
Volume Resistivity	<= 0.00050 ohm-cm	<= 0.00050 ohm-cm
Epoxy Technology EPO-TEK® H37-MPT Epoxy Material Description: A single component, silver-filled and electrically conductive adhesive designed for semiconductor die attach and bonding SMDs for hybrid microelectronic packaging. It is certi..
Volume Resistivity	<= 0.00050 ohm-cm	<= 0.00050 ohm-cm
Loctite® 3889 Rapid Cure Isotropic Epoxy Adhesive Electrically Conductive BondersLoctite® Electrically Conductive Adhesives are used in a variety of applications where electrical connectivity is needed, providing a conductive path where traditiona..
Volume Resistivity	<= 0.00050 ohm-cm	<= 0.00050 ohm-cm
Loctite® 3880 Heat Cure Isotropic Epoxy Adhesive Electrically Conductive BondersLoctite® Electrically Conductive Adhesives are used in a variety of applications where electrical connectivity is needed, providing a conductive path where traditiona..