Songhan Plastic Technology Co.,Ltd.

Epoxy Technology EPO-TEK® H31 Electrically Conductive, Silver Epoxy

Category Polymer , Thermoset , Epoxy , Epoxy, Electrically Conductive
Manufacturer Epoxy Technology
Trade Name EPO-TEK®
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Epoxy Technology EPO-TEK® H31 Electrically Conductive, Silver Epoxy.pdf
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Material Notes:
Product Description: EPO-TEK® H31 is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-electronic packaging.Advantages & Application Notes: Bright /shiny silver provides high reflectance, especially good for enhancing LED overall brightness.Creamy thixotropic paste allows for high volume dispensing and pin transfer methods of application.Available in several different viscosity versions.Suggested applications:Semiconductor: die attach chips onto lead-frames for JEDEC Level III and II packaging. Adhesion to Ag-spot lead-frame.Hybrids: GaAs and Si die attach, adhesion to Au-plated chips, general electrical contacts for ceramic circuits, substrate attach to ground package.Opto-electronic: single LED packaging in TO-cans, LED arrays on PCB or substrate, adhesion to ITO in LCDs, and sensor device/OEM instrumentation.PCB/General: EMI or Rf shielding of electronics.Passes NASA low outgassing standard ASTM E595 with proper cure Long pot-life, up to 28 days, yields low waste between manufacturing shifts and avoids higher cost dry ice shipmentsInformation Provided by Epoxy Technology
Physical Properties Metric English Comments
Specific Gravity 2.20 g/cc
2.20 g/cc
Particle Size <= 45 µm
<= 45 µm
Viscosity 15000 - 25000 cP

@Temperature 23.0 °C
15000 - 25000 cP

@Temperature 73.4 °F
5 rpm
Mechanical Properties Metric English Comments
Hardness, Shore D 84
Tensile Modulus 5.6857 GPa
824.64 ksi
Shear Strength 9.10 MPa
1320 psi
>= 11.7 MPa
>= 1700 psi
Thermal Properties Metric English Comments
CTE, linear 48.0 µm/m-°C
26.7 µin/in-°F
Below Tg
201 µm/m-°C
112 µin/in-°F
Above Tg
Thermal Conductivity 1.10 W/m-K
7.63 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 200 °C
392 °F
300 °C
572 °F
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
-55.0 °C
-67.0 °F
Glass Transition Temp, Tg >= 110 °C
>= 230 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature 370 °C
698 °F
Degradation Temperature
Electrical Properties Metric English Comments
Volume Resistivity <= 0.00050 ohm-cm
<= 0.00050 ohm-cm
Chemical Properties Metric English Comments
Ionic Impurities - Na (Sodium) 143 ppm
143 ppm
Ionic Impurities - K (Potassium) 41 ppm
41 ppm
Ionic Impurities - Cl (Chloride) 7.0 ppm
7.0 ppm
Processing Properties Metric English Comments
Cure Time 60.0 min

@Temperature 150 °C
1.00 hour

@Temperature 302 °F
Minimum Bond Line
Pot Life 40320 min
40320 min
Shelf Life 3.00 Month

@Temperature 25.0 °C
3.00 Month

@Temperature 77.0 °F
Descriptive Properties Value Comments
Color Silver
Consistency Smooth paste
Ionic Impurities NH4 8 ppm
Number of Components Single
Thixotropic Index 3
Weight Loss 0.06%
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