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Polymer Property : CTE, linear = 26.7 µin/in-°F Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 48.0 µm/m-°C @Temperature 20.0 °C |
26.7 µin/in-°F @Temperature 68.0 °F |
NOVA |
| NOVA Chemicals Dylark® 238P20 High Performance Glass Filled Styrenic Very high modulus, High heat resistance, Excellent flow characteristics, Excellent adhesion to urethaneApplications: Instrument panel substrates, consoles, Cluster housing, interior trimInjection Sp.. |
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| CTE, linear | 48.0 µm/m-°C | 26.7 µin/in-°F | |
| Resinlab® EP1320 Heat Cure Epoxy Conformal Coating Resinlab™ EP1320 and EP1320LV are one part heat cure epoxy conformal coatings. They can also be used as a small mass potting compounds, structural adhesives, or insulating polymer systems where the.. |
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| CTE, linear | 48.0 µm/m-°C | 26.7 µin/in-°F | |
| Resinlab® EP1320LV Heat Cure Epoxy Conformal Coating Resinlab™ EP1320 and EP1320LV are one part heat cure epoxy conformal coatings. They can also be used as a small mass potting compounds, structural adhesives, or insulating polymer systems where the.. |
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| CTE, linear | 48.0 µm/m-°C | 26.7 µin/in-°F | |
| Resinlab® EP1325 Thixotropic, Heat Curing Epoxy Adhesive Resinlab™ EP1325 and EP1325LV are one part thixotropic, heat curing epoxy adhesives. They can also be used as a small mass potting compounds, staking or damming adhesives, or polymer systems where .. |
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| CTE, linear | 48.0 µm/m-°C | 26.7 µin/in-°F | |
| Resinlab® EP1325LV Thixotropic, Heat Curing Epoxy Adhesive Resinlab™ EP1325 and EP1325LV are one part thixotropic, heat curing epoxy adhesives. They can also be used as a small mass potting compounds, staking or damming adhesives, or polymer systems where .. |
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| CTE, linear | 48.0 - 74.4 µm/m-°C | 26.7 - 41.3 µin/in-°F | Average value: 65.6 µm/m-°C Grade Count:26 |
| Overview of materials for Polycarbonate, Impact Modified This property data is a summary of similar materials in the MatWeb database for the category "Polycarbonate, Impact Modified". Each property range of values reported is minimum and maximum values of.. |
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| CTE, linear | 48.1 µm/m-°C @Temperature 20.0 °C |
26.7 µin/in-°F @Temperature 68.0 °F |
modified; ASTM D696 |
| LyondellBasell SEQUEL® E3000 TPO Description: SEQUEL® E3000 thermoplastic olefinic elastomer (TPO) is designed for thermoformed exterior and interior applications that require toughness and dimensional stability. This extrusion.. |
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| CTE, linear | 48.1 µm/m-°C @Temperature 0.000 - 30.0 °C |
26.7 µin/in-°F @Temperature 32.0 - 86.0 °F |
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| Mateck Cesium Iodide, CsI Optical crystals |
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| CTE, linear | 48.0 µm/m-°C @Temperature 20.0 °C |
26.7 µin/in-°F @Temperature 68.0 °F |
DIN 53752 |
| GEHR Plastics PPS-40GF Polyphenylene Sulfide, 40% Glass Fiber The linear polyphenylensulfide belongs to the semi-crystalline materials and offers a very high mechanical capacity, thermal and chemical resistance distinguished at the same time, high dimensional .. |
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| CTE, linear | 48.0 µm/m-°C | 26.7 µin/in-°F | DIN 52328 |
| Isoflon PEEK Polyetheretherketone Materials with strong mechanical and electrical performances under high temperatures.Information provided by Isoflon. |
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| CTE, linear | 48.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
26.7 µin/in-°F @Temperature -22.0 - 86.0 °F |
ASTM D696 |
| LyondellBasell Astryn BR33GC Polypropylene Copolymer, Mineral Filled Key Features: conventional melt flow, high modulus, UV-stabilized, mineral-filled polypropylene copolymer, high rigidity, high impact strength, good dimensional stability, low foggingApplications: k.. |
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| CTE, linear | 48.0 µm/m-°C @Temperature -30.0 - 100 °C |
26.7 µin/in-°F @Temperature -22.0 - 212 °F |
ASTM D696 |
| LyondellBasell Hostacomâ„¢ XFBR712 Thermoplastic Polyolefin Elastomer Description: Hostacomâ„¢ XFBR712 medium melt flow, 1,800 MPa flexural modulus, mineral-filled thermoplastic elastomeric olefin (TEO) resin has an excellent balance of stiffness, impact resistance.. |
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| CTE, linear | 48.0 µm/m-°C @Temperature 40.0 - 130 °C |
26.7 µin/in-°F @Temperature 104 - 266 °F |
TMA; ASTM E831 |
| Plenco 1510 Polyester, Pellet, Injection Molded PLENCO 01510 is a mineral filled, pelletized polyester molding compound, which offers an excellent combination of electrical properties and dimensional stability. UL recognized under component file .. |
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| CTE, linear | 48.0 µm/m-°C @Temperature 20.0 °C |
26.7 µin/in-°F @Temperature 68.0 °F |
Alpha 1 |
| Tra-Con Tra-Bond 516H02 Fiber Optic Adhesive TRA-BOND 516H02 is a low viscosity, room temperature or low temperature curing fiber optic adhesive with good stress relief, high adhesion, and low shrinkage upon cure. TRA-BOND 516H02 contains very.. |
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| CTE, linear | 48.0 µm/m-°C @Temperature 20.0 °C |
26.7 µin/in-°F @Temperature 68.0 °F |
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| Tra-Con Tra-Cast 3109 Low Cost Epoxy Casting System TRA-CAST 3109 is a versatile epoxy casting system developed for solvent-free production casting, potting, encapsulating, and coating applications where low cost, easy handling and flowability, and e.. |
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| CTE, linear | 48.0 µm/m-°C @Temperature 40.0 - 130 °C |
26.7 µin/in-°F @Temperature 104 - 266 °F |
TMA; ASTM E831 |
| Plenco 2571 Phenolic, Granular, Injection Molded PLENCO 02571 is a general purpose, organic filled phenolic molding compound offering optimum cure characteristics while maintaining excellent mechanical and electrical properties. UL recognized unde.. |
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| CTE, linear | 48.0 µm/m-°C @Temperature 40.0 - 130 °C |
26.7 µin/in-°F @Temperature 104 - 266 °F |
TMA; ASTM E831 |
| Plenco 3597 Phenolic, Granular, Injection Molded PLENCO 03597 is a mineral filled phenolic molding compound offering excellent flammability ratings even at thin cross sections, along with excellent arc and comparative track resistance values. UL r.. |
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| CTE, linear | 48.0 µm/m-°C @Temperature 40.0 - 130 °C |
26.7 µin/in-°F @Temperature 104 - 266 °F |
TMA; ASTM E831 |
| Plenco 4309 Phenolic, Nodular, Injection Molded PLENCO 04309 is a heat resistant, glass reinforced phenolic molding compound offering improved mechanical strength and electrical strength properties. UL recognized under component file E40654. 0430.. |
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| CTE, linear | 48.0 µm/m-°C @Temperature 20.0 °C |
26.7 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
| Toyobo T-422T Nylon, Mineral-Reinforced Key Feature: High heat distortion and good toughnessInformation provided by Toyobo Co., Ltd |
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| CTE, linear | 48.0 µm/m-°C @Temperature 50.0 - 200 °C |
26.7 µin/in-°F @Temperature 122 - 392 °F |
DIN 53 752 |
| Ensinger TECASINT 5011 Polyimide (PI) TECASINT is a range of non-melting high temperature polyimides characterized by high strength over a wide range of temperatures, good long term thermal stability, minimal thermal expansion and excel.. |
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| CTE, linear | 48.0 µm/m-°C | 26.7 µin/in-°F | Below Tg |
| Epoxy Technology EPO-TEK® 320-LV Optically Opaque Epoxy Material Description: A two component, optically opaque epoxy adhesive designed for semiconductor and PCB applications in optoelectronic instrumentation and assemblies. A lower viscosity version of.. |
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| CTE, linear | 48.0 µm/m-°C | 26.7 µin/in-°F | Below Tg |
| Epoxy Technology EPO-TEK® 375 High Temperature Epoxy Product Description: EPO-TEK®375 is a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications. Also available in a single component frozen sy.. |
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| CTE, linear | 48.0 µm/m-°C | 26.7 µin/in-°F | Below Tg |
| Epoxy Technology EPO-TEK® E2101 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E2101 is a two component, thixotropic, electrically conductive adhesive. It may be used for circuit assembly and semiconductor applications. Advantages & Application .. |
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| CTE, linear | 48.0 µm/m-°C | 26.7 µin/in-°F | Below Tg |
| Epoxy Technology EPO-TEK® E4110 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E4110 is an electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80°C, although other.. |
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| CTE, linear | 48.0 µm/m-°C | 26.7 µin/in-°F | Below Tg |
| Epoxy Technology EPO-TEK® E4110-PFC Electrically Conductive Epoxy Product Description: EPO-TEK®E4110-PFC is a two-component, silver filled, electrically conductive adhesive designed for semiconductor IC packaging and general electronic assembly. It is a thixotr.. |
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| CTE, linear | 48.0 µm/m-°C | 26.7 µin/in-°F | Below Tg |
| Epoxy Technology EPO-TEK® H31 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H31 is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-electronic.. |
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| CTE, linear | 48.0 µm/m-°C @Temperature 20.0 °C |
26.7 µin/in-°F @Temperature 68.0 °F |
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| Armstrong A-3/A Epoxy Adhesive A Jet black epoxy paste especially formulated for bonding rigid materials. When used with Activator A or E, A-3 exhibits excellent bonding properties to phenolics, precious stones, ceramics, glass,.. |
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| CTE, linear | 48.0 µm/m-°C @Temperature 0.000 - 80.0 °C |
26.7 µin/in-°F @Temperature 32.0 - 176 °F |
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| 3M Scotch-Weld™ 2214 Hi-Temp Epoxy Adhesive 3M™ Scotch-Weld™ Adhesive 2214 Hi-Temp is an aluminum filled, deaerated products fro use where higher strengths are required between 82-177°C. One part 250°F (121°C) curing 100% solids, 3M™ Sc.. |
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