Mechanical Properties | Metric | English | Comments |
---|---|---|---|
Shear Strength | 11.7 MPa | 1700 psi | ASTM D732 |
Quadrant EPP Fluorosint® 207 PTFE, Compression Molded Synthetic Mica-filled PTFE (ASTM Product Data Sheet) |
|||
Shear Strength | >= 11.7 MPa | >= 1700 psi | Die |
Epoxy Technology EPO-TEK® 301-1 Optical Grade Epoxy Material Description: A two component, room temperature curing, optical grade epoxy, designed for optics, medical, and opto-electronic packaging of semiconductor devices, components, and electronics.. |
|||
Shear Strength | >= 11.7 MPa | >= 1700 psi | Die |
Epoxy Technology EPO-TEK® 302 Fast Setting, Optical Epoxy Product Description: EPO-TEK® 302 is a two component, fast-gelling, room temperature curing epoxy, designed for electronic, optical, medical, and general applications. Advantages & Application No.. |
|||
Shear Strength | >= 11.7 MPa | >= 1700 psi | Die |
Epoxy Technology EPO-TEK® 430 Epoxy Product Description: A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for interconnecting, grounding .. |
|||
Shear Strength | >= 11.7 MPa | >= 1700 psi | Die |
Epoxy Technology EPO-TEK® B9021-6 Epoxy Paste Material Description: A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate atta.. |
|||
Shear Strength | >= 11.7 MPa | >= 1700 psi | Die |
Epoxy Technology EPO-TEK® E2001 Electrically Conductive, Silver-Filled Epoxy Product Description: EPO-TEK® E2001 is a two component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications using a snap-cure profile. Advantages & Appl.. |
|||
Shear Strength | >= 11.7 MPa | >= 1700 psi | Die |
Epoxy Technology EPO-TEK® E2101 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E2101 is a two component, thixotropic, electrically conductive adhesive. It may be used for circuit assembly and semiconductor applications. Advantages & Application .. |
|||
Shear Strength | >= 11.7 MPa | >= 1700 psi | Die |
Epoxy Technology EPO-TEK® E4110-PFC Electrically Conductive Epoxy Product Description: EPO-TEK®E4110-PFC is a two-component, silver filled, electrically conductive adhesive designed for semiconductor IC packaging and general electronic assembly. It is a thixotr.. |
|||
Shear Strength | >= 11.7 MPa | >= 1700 psi | Die |
Epoxy Technology EPO-TEK® EE165-3 Silver Filled Epoxy A two component, silver-filled, electrically conductive epoxy made for bonding of SMDs, and general solder replacement at the PCB level and circuit assembly. It was designed to be low modulus and f.. |
|||
Shear Strength | >= 11.7 MPa | >= 1700 psi | Die after 1000 hrs 85C/85%R |
Epoxy Technology EPO-TEK® EK2000 Epoxy Preliminary Product Information SheetMaterial Description: A two component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance .. |
|||
Shear Strength | >= 11.7 MPa | >= 1700 psi | Die |
Epoxy Technology EPO-TEK® EV2002 Silver-filled, electrically conductive, flexible epoxy Material Description: Silver-filled, electrically conductive, flexible epoxyInformation Provided by Epoxy Technology |
|||
Shear Strength | >= 11.7 MPa | >= 1700 psi | Die |
Epoxy Technology EPO-TEK® H31D Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H31D is a single component, electrically conductive silver epoxy designed for die-bonding of semiconductors, including IC’s, resistors, capacitors, transistors, and d.. |
|||
Shear Strength | >= 11.7 MPa | >= 1700 psi | Die |
Epoxy Technology EPO-TEK® H31LV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H31LV is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-electron.. |
|||
Shear Strength | >= 11.7 MPa | >= 1700 psi | Die |
Epoxy Technology EPO-TEK® H55 Epoxy Material Description: A two component, thixotropic and high temperature epoxy designed to be used for hybrids and PCB applications.Information Provided by Epoxy Technology |
|||
Shear Strength | >= 11.7 MPa | >= 1700 psi | Die |
Epoxy Technology EPO-TEK® H81A Epoxy Material Description: A two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging.Information Provided by Epoxy Technolo.. |
|||
Shear Strength | >= 11.7 MPa | >= 1700 psi | Die |
Epoxy Technology EPO-TEK® P1011 Electrically Conductive Modified Polyimide Product Description: EPO-TEK® P-1011 is a single component, modified polyimide, silver-filled adhesive designed for chip bonding in microelectronic and optoelectronic applications.Advantages & Appl.. |
|||
Shear Strength | 11.7 MPa | 1700 psi | Die |
Epoxy Technology EPO-TEK® T7109-19 Electrically Insulating Epoxy Paste Material Description: A flexible, thermally conductive, electrically insulating epoxy paste designed for low stress and heat dissipation applications. It is an alternative to EPO-TEK® T7109-17, de.. |
|||
Shear Strength | >= 11.7 MPa | >= 1700 psi | Die |
Epoxy Technology EPO-TEK® H20E Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also .. |
|||
Shear Strength | 11.7 MPa | 1700 psi | Overlap, Stainless Steel MEK/abrade/MEK |
3M Scotch-Weld™ DP420 Off-White Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive are high performance, two-part epoxy adhesives offering outstanding shear and peel adhesion, and very high levels of durability.Information provided by 3M |
|||
Shear Strength | 11.7 MPa | 1700 psi | Die, @ 23°C: = 5 Kg |
Atom Adhesives AA-BOND G298 Epoxy Adhesive AA-BOND G298 is a two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging.Appearance: Resin: Brown, Hardener: Dark Bro.. |
|||
Shear Strength | 11.7 MPa | 1700 psi | Overlap, CRS/CRS; ASTM D1002 |
3M Scotch-Weld™ 2216 B/A Gray Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive 2216 B/A is a flexible, two-part, room temperature curing epoxy with high peel and shear strength. Scotch-Weld epoxy adhesive 2216 B/A is identical to 3M Scotch-Wel.. |
|||
Shear Strength | 11.7 MPa | 1700 psi | ASTM D732 |
Quadrant EPP Semitron® ESd 500 HR PTFE, static dissipative, compression molded (ASTM Product Data Sheet) |