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- Polymer Property : Glass Transition Temp, Tg = 110 °C
Polymer Property : Glass Transition Temp, Tg = 110 °C Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Glass Transition Temp, Tg | 110 °C | 230 °F | |
| NextGen Adhesives G907-08 Epoxy Adhesive Description: NGAC G907-08 is a low viscosity, electrically insulating, heat cured and 2-part adhesive systems designed for applications where temperature and chemical resistance is critical. The NGA.. |
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| Glass Transition Temp, Tg | 110 °C | 230 °F | |
| NextGen Adhesives G907-21 Structural Epoxy Adhesive Description: NGAC G907-21 is a high viscosity and thixotropic adhesive system that is specifically formulated for structural bonding applications: industrial, electronics and aerospace.Advantages an.. |
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| Glass Transition Temp, Tg | 110 °C | 230 °F | |
| Eastman Tenite 383A-08 Cellulose Acetate Propionate
(discontinued **) 8% Plasticized. ISO data as provided by the manufacturer, Eastman Chemical. |
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| Glass Transition Temp, Tg | 110 °C | 230 °F | |
| Eastman Tenite 371A-10 Cellulose Acetate Propionate
(discontinued **) 10% Plasticized. ISO data as provided by the manufacturer, Eastman Chemical. |
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| Glass Transition Temp, Tg | 110 °C | 230 °F | ASTM D3418 |
| Kolon DIAMAT® EM Description: DIAMAT® is a specially formulated high impact grade PMMA resin from KOLON. The acrylic composition results in an excellent balance of impact resistance and high modulus at reasonabl.. |
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| Glass Transition Temp, Tg | 110 - 120 °C | 230 - 248 °F | |
| Master Bond EP17HT-3 One component, snap-curing epoxy system Product Description: Master Bond Polymer System EP17HT-3 is a one part epoxy that fully cures in 2-3 minutes at 250-300°F. It is capable of service up to +400°F with excellent strength retention p.. |
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| Glass Transition Temp, Tg | 110 °C | 230 °F | DSC |
| Wolf Kunststoff ZEDEX® ZX-530 A5D Polymer Alloy Main Characteristics: Low Creep; Low moisture absorption; Flame retardant; Low impurity ions; Good machinability; FDA compliant LABS; Extremely low outgassing; Less expensive than PEEK; Stress resis.. |
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| Glass Transition Temp, Tg | 110 °C | 230 °F | Ultimate Tg |
| Tra-Con Tra-Bond 2123 Metal Repair Steel/Epoxy Adhesive TRA-BOND 2123 is a versatile steel metal/epoxy adhesive formulation developed for modern industrial repair, casting and bonding applications where a steel-like or cast iron finish is required. This .. |
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| Glass Transition Temp, Tg | 110 °C | 230 °F | Ultimate Tg |
| Tra-Con Tra-Bond F230 Color Keyed High Temperature Epoxy Adhesive TRA-BOND F230 is a clear, low viscosity, high temperature, two-part epoxy adhesive that changes colors during the curing process to indicate cure status. The unmixed components are light yellow; the.. |
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| Glass Transition Temp, Tg | 110 °C | 230 °F | |
| Cosmic Plastics E4905 Mineral Filled Epoxy Molding Compound, Encapsulated Grade Data provided by the manufacturer. |
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| Glass Transition Temp, Tg | 110 °C | 230 °F | Ultimate Tg |
| Tra-Con Tra-Bond F253HV Color Keyed High Temperature Epoxy Adhesive TRA-BOND F253HV is a clear, high temperature, two-part epoxy formulation that changes colors during the curing process to indicate cure status. The unmixed components are light yellow; the mixture i.. |
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| Glass Transition Temp, Tg | 110 - 120 °C | 230 - 248 °F | DMA |
| Hexcel® HexPly® 1454 125°C Curing Epoxy Matrix HexPly® 1454 is a self-extinguishing epoxy resin system with very high self adhesion properties. It has good handling and is tolerant of a wide range of processing conditions. HexPly® 1454 is idea.. |
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| Glass Transition Temp, Tg | 110 - 120 °C | 230 - 248 °F | DAN 432 |
| Hexcel® HexPly® 171/174/176 120°C Curing Epoxy Matrix The HexPly® 174 family is a range of flexible 120°C curing matrix systems for a wide variety of industrial applications and is ideally matched to the following processes: shrink wrap tape, vacuum .. |
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| Glass Transition Temp, Tg | 110 °C | 230 °F | DSC |
| Eastman Tritan FX100 Copolyester Eastman Tritan FX100 is an amorphous copolyester that combines clarity and toughness with heat and chemical resistance. Films manufactured from this new-generation copolyester can be thermoformed w.. |
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| Glass Transition Temp, Tg | >= 110 °C | >= 230 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® 430 Epoxy Product Description: A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for interconnecting, grounding .. |
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| Glass Transition Temp, Tg | >= 110 °C | >= 230 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® CF6-2 High Temperature Epoxy Product Description: EPO-TEK® CF6-2 is a two component, high temperature and high Tg epoxy designed for fiber optic packaging. Advantages & Application Notes: The low viscosity nature allows for wi.. |
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| Glass Transition Temp, Tg | >= 110 °C | >= 230 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—250°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® H31D Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H31D is a single component, electrically conductive silver epoxy designed for die-bonding of semiconductors, including IC’s, resistors, capacitors, transistors, and d.. |
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| Glass Transition Temp, Tg | >= 110 °C | >= 230 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—250°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® H31D-LV Epoxy Material Description: A single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and optoelectronic packaging. It i.. |
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| Glass Transition Temp, Tg | >= 110 °C | >= 230 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—250°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® H31LV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H31LV is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-electron.. |
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| Glass Transition Temp, Tg | >= 110 °C | >= 230 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® H61 Unfilled Epoxy Adhesive Material Description: A single component, high Tg, electrically insulating epoxy adhesive for semiconductor, microelectronic, and opto-electronic packaging applications. It is a liquid version of E.. |
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| Glass Transition Temp, Tg | 110 °C | 230 °F | |
| Epoxyset Epoxibond EB-119SP Unfilled Epoxy Adhesive A two-component, unfilled, high temperature epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.Information provided by Epoxyset Inc... |
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| Glass Transition Temp, Tg | >= 110 °C | >= 230 °F | |
| Epoxyset Epoxiohm EO-98HT Electrically Conductive Epoxy Adhesive EO-98HT is a one component, electrically and thermally conductive, snap cure, die attach epoxy. It was designed for IC plastic packaging of semiconductors, hybrid micro-electronics, and photonic dev.. |
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| Glass Transition Temp, Tg | >= 110 °C | >= 230 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® H31 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H31 is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-electronic.. |
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| Glass Transition Temp, Tg | 110 °C | 230 °F | |
| Atom Adhesives AA-BOND 2123 Epoxy Adhesive AA-BOND 2123 is a versatile steel metal/epoxy adhesive formulation developed for modern industrial repair, casting and bonding applications where a steel-like or cast iron finish is required. AA-BON.. |
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