Polymer Property : Decomposition Temperature = 370 °C Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Decomposition Temperature	370 - 390 °C	698 - 734 °F	TGA; 5% weight loss; IPC-TM-650 2.3.40
Rogers Corporation Theta® MCL-HE-679G Laminate, GHA-679G Prepreg Halogen-Free, Low Dielectric Constant, High heat Resistant Multi-Layer Circuit Material Theta® circuit materials are halogen free and have good dielectric characteristics suitable for high speed digital applications. Theta materials, in part due to their superior heat resistance, hav..
Decomposition Temperature	370 °C	698 °F	5% weight loss; TGA; IPC-TM-650.2.4.24.6
Park Electrochemical Nelco® N4000-12 SI® High Speed/Low Loss, CAF Resistant Laminate and Prepreg The Nelco® N4000-12 series is an enhanced epoxy resin system designed for use in high speed, low loss applications requiring thermal stability, excellent signal speed and CAF resistance.Key Feature..
Decomposition Temperature	370 °C	698 °F	Degradation Temperature
Epoxy Technology EPO-TEK® M10-D Epoxy Paste Material Description: A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate atta..
Decomposition Temperature	370 °C	698 °F	Degradation Temperature
Epoxy Technology EPO-TEK® H31 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H31 is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-electronic..
Decomposition Temperature	370 °C	698 °F	5% weight loss; TGA; IPC-TM-650.2.4.24.6
Park Electrochemical Nelco® N4000-12 High Speed/Low Loss, CAF Resistant Laminate and Prepreg The Nelco® N4000-12 series is an enhanced epoxy resin system designed for use in high speed, low loss applications requiring thermal stability, excellent signal speed and CAF resistance.Key Feature..