Epoxy Technology EPO-TEK® E3001-6 Electrically Conductive, Silver Epoxy

Category	Polymer , Thermoset , Epoxy , Epoxy, Electrically Conductive
Manufacturer	Epoxy Technology
Trade Name	EPO-TEK®
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Epoxy Technology EPO-TEK® E3001-6 Electrically Conductive, Silver Epoxy.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & Application Notes: The thixotropic and paste-like rheology allows for application by screen or stencil printing techniques. It was designed to be printed for SMT joining similar to printing solder paste. It may also be hand applied or dispensed.A “lead-free” solution for PCB level circuit assemblies. It is suggested to use this epoxy with SMDs that do not contain Pb plated leads. Preferable to solder: Snap cure adhesive or fast-cure; chips can be cured in-line < 90 seconds travel time; or lead-frames can be loaded into magazines for box oven curing

Physical Properties	Metric	English	Comments
Specific Gravity	2.71 g/cc	2.71 g/cc
Particle Size	<= 20 µm	<= 20 µm
Viscosity	5500 - 7500 cP @Temperature 23.0 °C	5500 - 7500 cP @Temperature 73.4 °F	50 rpm

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	83	83
Tensile Modulus	2.02 GPa	293 ksi	Storage
Shear Strength	7.991 MPa	1159 psi	Lap
	>= 8.20 MPa	>= 1190 psi	Die

Thermal Properties	Metric	English	Comments
CTE, linear	50.0 µm/m-°C	27.8 µin/in-°F	Below Tg
	106 µm/m-°C	58.9 µin/in-°F	Above Tg
Thermal Conductivity	1.29 W/m-K	8.95 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air	250 °C	482 °F	Continuous
	350 °C	662 °F	Intermittent
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Continuous
	-55.0 °C	-67.0 °F	Intermittent
Glass Transition Temp, Tg	>= 100 °C	>= 212 °F	Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature	425 °C	797 °F	Degradation Temperature; TGA

Electrical Properties	Metric	English	Comments
Volume Resistivity	<= 0.0020 ohm-cm	<= 0.0020 ohm-cm

Chemical Properties	Metric	English
Ionic Impurities - Na (Sodium)	14 ppm	14 ppm
Ionic Impurities - K (Potassium)	1.0 ppm	1.0 ppm
Ionic Impurities - Cl (Chloride)	103 ppm	103 ppm

Processing Properties	Metric	English	Comments
Cure Time	2.00 min @Temperature 150 °C	0.0333 hour @Temperature 302 °F	Minimum Bond Line
	15.0 min @Temperature 130 °C	0.250 hour @Temperature 266 °F	Minimum Bond Line
Pot Life	480 min	480 min
Shelf Life	6.00 Month @Temperature -40.0 °C	6.00 Month @Temperature -40.0 °F

Descriptive Properties	Value	Comments
Color	Silver
Consistency	Smooth, Thixotropic Paste
Ionic Impurities NH4	26 ppm
Number of Components	Single
Thixotropic Index	2.41
Weight Loss	0.17%	200°C
	0.28%	300°C

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