Polymer Property : Decomposition Temperature = 797 °F Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Decomposition Temperature	425 °C	797 °F	TGA; ASTM D3850
Rogers Corporation RO4003C Glass-Reinforced Hydrocarbon and Ceramic Laminate with Thin Film Resistor Foil RO4000® Series High Frequency Circuit Materials are glass-reinforced hydrocarbon and ceramic (not PTFE) laminates with TICER™ TCR® Thin Film Resistor Foils. These laminates are designed for perf..
Decomposition Temperature	425 °C	797 °F	TGA; ASTM D3850
Rogers Corporation TMM® TMM10 Ceramic Thermoset Polymer Composite TMM® Thermoset microwave materials are ceramic thermoset polymer composites designed for high plate-thru-hole reliability stripline and microstrip applications. The electrical and mechanical prope..
Decomposition Temperature	425 °C	797 °F	TGA; ASTM D3850
Rogers Corporation TMM® TMM101 Ceramic Thermoset Polymer Composite TMM® Thermoset microwave materials are ceramic thermoset polymer composites designed for high plate-thru-hole reliability stripline and microstrip applications. The electrical and mechanical prope..
Decomposition Temperature	425 °C	797 °F	TGA; ASTM D3850
Rogers Corporation TMM® TMM3 Ceramic Thermoset Polymer Composite TMM® Thermoset microwave materials are ceramic thermoset polymer composites designed for high plate-thru-hole reliability stripline and microstrip applications. The electrical and mechanical prope..
Decomposition Temperature	425 °C	797 °F	TGA; ASTM D3850
Rogers Corporation TMM® TMM4 Ceramic Thermoset Polymer Composite TMM® Thermoset microwave materials are ceramic thermoset polymer composites designed for high plate-thru-hole reliability stripline and microstrip applications. The electrical and mechanical prope..
Decomposition Temperature	425 °C	797 °F	TGA; ASTM D3850
Rogers Corporation TMM® TMM6 Ceramic Thermoset Polymer Composite TMM® Thermoset microwave materials are ceramic thermoset polymer composites designed for high plate-thru-hole reliability stripline and microstrip applications. The electrical and mechanical prope..
Decomposition Temperature	425 °C	797 °F	5% weight loss; TGA; IPC-TM-650.2.4.24.6
Park Electrochemical Nelco® N4000-7 EF® Halogen-Free Epoxy The Nelco® N4000-7 EF® series of laminates and prepregs is a total environmental solution. This advanced halogen-free resin system provides superior CAF resistance for high temperature, lead-free ..
Decomposition Temperature	425 °C	797 °F	Degradation Temperature; TGA
Epoxy Technology EPO-TEK® E3001-6 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & ..
Decomposition Temperature	425 °C	797 °F	Degradation Temperature
Epoxy Technology EPO-TEK® H20E-MP Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-MP is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is al..
Decomposition Temperature	425 °C	797 °F	Degradation Temperature
Epoxy Technology EPO-TEK® U300-2 Two Component Epoxy Material Description: A two component epoxy designed for capillary underfill of semiconductor chips and SMDs. Long potlife, high Tg, and optical clarity are a few of its traits. NASA approved lo..
Decomposition Temperature	425 °C	797 °F	Degradation Temperature
Epoxy Technology EPO-TEK® H20E Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also ..