Polymer Property : Ionic Impurities - K (Potassium) = 1.0 ppm Product List

Chemical Properties

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Chemical Properties	Metric	English
Ionic Impurities - K (Potassium)	1.0 ppm	1.0 ppm
Tra-Con Tra-Bond Ablebond 933-1.5 Moisture Resistant Encapsulant TRA-BOND 933-1.5 electrically insulating epoxy encapsulant is formulated to provide a smooth crown over the device of wire bonds. This encapsulant provides protection from thermal and mechanical sho..
Ionic Impurities - K (Potassium)	>= 1.0 ppm	>= 1.0 ppm
Epoxy Technology EPO-TEK® 430 Epoxy Product Description: A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for interconnecting, grounding ..
Ionic Impurities - K (Potassium)	1.0 ppm	1.0 ppm
Epoxy Technology EPO-TEK® E2101 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E2101 is a two component, thixotropic, electrically conductive adhesive. It may be used for circuit assembly and semiconductor applications. Advantages & Application ..
Ionic Impurities - K (Potassium)	1.0 ppm	1.0 ppm
Epoxy Technology EPO-TEK® E3001-6 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & ..
Ionic Impurities - K (Potassium)	1.0 ppm	1.0 ppm
Epoxy Technology EPO-TEK® ED1021 Epoxy Preliminary Product Information SheetMaterial Description: A single component, silver-filled epoxy designed for low power semiconductor LED die attach applications. Unique features include its abil..
Ionic Impurities - K (Potassium)	1.0 ppm	1.0 ppm
Epoxy Technology EPO-TEK® EJ2189 Electrically Conductive Epoxy Product Description: EPO-TEK® EJ2189 is an electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80°C, although othe..
Ionic Impurities - K (Potassium)	1.0 ppm	1.0 ppm
Epoxy Technology EPO-TEK® OE121 Black Epoxy Adhesive Material Description: A two component, low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. ..