Processing Properties | Metric | English | Comments |
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Pot Life | 480 min | 480 min | |
Parker Chomerics CHO-SHIELD® 576 Platable Silver Epoxy Coating Description: CHO-SHIELD® 576 coating is a two component, silver filled, highly conductive epoxy paint designed to provide EMI shielding when applied to a dielectric plastic substrate. This coating .. |
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Pot Life | 480 min @Temperature 23.9 °C |
480 min @Temperature 75.0 °F |
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Parker Chomerics CHO-SHIELD® 610 A/B Conductive Epoxy Paint Highly Conductive Epoxy Paint. This is a two-component, silver plated, copper-filled, highly conductive epoxy paint. This coating was developed for application to non-conductive plastic substrates t.. |
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Pot Life | 480 min | 480 min | |
Parker Chomerics CHO-SHIELD® 610 A/B Epoxy Conductive Coating Description: CHO-SHIELD® 610 A/B is a highly conductive, two-component silver-plated-copper filled epoxy coating for application to non-conductive plastic substrates, particularly those subject to .. |
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Pot Life | 480 min | 480 min | |
Parker Chomerics CHO-SHIELD® 579 Low VOC Silver Epoxy Coating Description: CHO-SHIELD® 579 coating is a two component, silver-filled, highly conductive epoxy paint designed to provide EMI shielding when applied to a dielectric substrate. This coating was spec.. |
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Pot Life | 480 - 720 min | 480 - 720 min | |
Abatron AboCast/AboCure 8508-1/8508-1 Primerless, High-Solids Epoxy
(discontinued **) Primerless, high-solids epoxy structural paint for concrete, wood, metal and composite surfaces. 2-component system in standard and custom colors.Suggested Uses: Protective and decorative painting .. |
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Pot Life | 480 min | 480 min | |
Huntsman HY 5200 Aromatic Amine Approx. H+ equivalent weight 45. Mix Ratio with GY 6010 is 23.Comments/Applications: Liquid aromatic amine.Data provided by Ciba Specialty Chemicals.Ciba Specialty Chemicals has been acquired by H.. |
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Pot Life | 480 min | 480 min | |
Lord Adhesives Aeroglaze® 9924 Wash Primer Aeroglaze® 9924 wash primer was designed for priming metal surfaces. It is particularly useful for priming nonferrous substrates such as aluminum and galvanized steel.All information provided by .. |
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Pot Life | 480 min | 480 min | |
Lord Adhesives Aeroglaze® 9924V Wash Primer Aeroglaze® 9924V wash primer was designed for priming metal surfaces. It is particularly useful for priming non-ferrous substrates such as aluminum and galvanized steel.All information provided b.. |
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Pot Life | >= 480 min @Temperature 25.0 °C |
>= 480 min @Temperature 77.0 °F |
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Lord Adhesives Circalokâ„¢ 6031 A/B Epoxy Encapsulant Circalokâ„¢ 6031 A/B is a two-part epoxy potting compound with excellent electrical properties at elevated temperatures. Good arc-track resistance under high voltage loading and other dielectric .. |
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Pot Life | 480 min | 480 min | |
Henkel Hysol EA 9150 Composite Resin Low viscosity, toughened system formulated for resin transfer molding. 250°F / 121°C cure and service temperature.Application: Composite Binding |
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Pot Life | 480 min | 480 min | rv #7 @ 2.5 rpm; 30 grams, minimum |
Tra-Con Tra-Bond 526M01 Rigid Thixotropic Adhesive TRA-BOND 526M01 is two-component, rigid, thixotropic material developed specifically for fiber optic applications. The material is a cream color when mixed and changes to a red amber color when full.. |
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Pot Life | >= 480 min @Temperature 20.0 - 22.0 °C |
>= 480 min @Temperature 68.0 - 71.6 °F |
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Tra-Con Tra-Bond 526M05 Rapid Low Temperature Cure Adhesive TRA-BOND 526M05 is a low viscosity, fast cure at low temperature, long pot-life adhesive. Information provided by Tra-Con Inc. |
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Pot Life | 480 min @Temperature 25.0 °C |
480 min @Temperature 77.0 °F |
100 grams |
Cytec (Conap) FR-1047 / EA-117 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an.. |
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Pot Life | 480 - 600 min @Temperature 25.0 °C |
480 - 600 min @Temperature 77.0 °F |
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Cytec Conathane® CC-1155-35 (Conap) Polyurethane Two-component Dielectric Conformal Coating Dielectric Conformal Coatings for ElectronicsCytec dielectric conformal coatings are the most widely used conformal coatings in industry today for such divergent applications as aircraft avionics, i.. |
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Pot Life | 480 min | 480 min | |
Epoxy Technology EPO-TEK® 383ND High Temperature Epoxy Material Description: A slightly longer pot life version of EPO-TEK®353ND designed for high temperature, optical and structural applications inside the semiconductor, hybrid, electronic, fiber opti.. |
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Pot Life | 480 min | 480 min | |
Epoxy Technology EPO-TEK® E3001-6 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & .. |
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Pot Life | 480 min | 480 min | |
Epoxy Technology EPO-TEK® H27D Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H27D is a two component, silver-filled epoxy adhesive designed for semiconductor and hybrid-microelectronic packaging applications.Advantages & Application Notes: Rheo.. |
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Pot Life | 480 min | 480 min | |
Epoxyset Epoxibond EB-107LP-2 Unfilled Epoxy Adhesive A two-component, unfilled epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.Information provided by Epoxyset Inc. |
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Pot Life | >= 480 min | >= 480 min | |
Epoxyset Epoxiohm EO-38M-3 Electrically Conductive Epoxy Adhesive EO-38M-3 is a two components, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is used for thermal management appl.. |
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Pot Life | 480 - 720 min | 480 - 720 min | or longer |
Abatron AboCast 8502-6/AboCure 8502-6 Colorless, Low-Exotherm Epoxy Casting Compound AboCast 8502-6/AboCure 8502-6 is a flexible, colorless, low-exotherm epoxy casting compound for spherical masses up to 2000 grams. It is a 2-component structural and dielectric liquid system with lo.. |
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Pot Life | 480 - 720 min @Temperature 70.0 - 80.0 °C |
480 - 720 min @Temperature 158 - 176 °F |
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Abatron KromaKote 8601-1 Ceramic-Like Epoxy 2-component system available in glossy standard and custom colors. Provides heavy duty protection and resurfacing for water and chemical resistanceSuggested Uses: Protective and decorative painting.. |
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Pot Life | >= 480 min @Temperature 25.0 °C |
>= 480 min @Temperature 77.0 °F |
100 gm mass |
Aremco Aremco-Bond™ 2315X High Temperature Epoxide Potting Compound Improved Crack Resistance & Bond Strength. High Temperature Resistance, Thermally Conductive, Low Viscosity. |
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Pot Life | 480 - 720 min | 480 - 720 min | Mass: 100g; TM R050-17 |
Resinlab® EP1285HD-10 Highly Filled, Medium Viscosity Casting Resin Resinlab™ EP1285 (Formerly Lab Product W021901 series) is a highly filled, medium viscosity black casting resin designed for applications requiring a high degree of thermal conductivity and a low C.. |
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Pot Life | 480 min | 480 min | |
Henkel Hysol EA 9394/C-2 Paste Adhesive System Elevated cure, thixotropic adhesive with structural properties to 450°F / 232°C.Application: Structural Repair |
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Pot Life | 480 min | 480 min | |
Henkel Hysol EA 9396/C-2 Paste Adhesive System Two-part, elevated cure, unfilled, low viscosity adhesive with structural properties to 400°F / 204°C.Applications: Structural Repair Low Viscosity Wet Lay-Up Composite Bonding |
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Pot Life | 480 min | 480 min | |
Henkel Hysol EA 9820 Paste Adhesive System High-density, one-component epoxy syntactic for use on honeycomb composite parts requiring high compressive strength at temperatures up to 350°F / 177°C. Ideal for fastener or attachment potting a.. |
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Pot Life | 480 min | 480 min | |
Henkel Hysol EA 9825 Paste Adhesive System Low-density, one-component epoxy syntactic for use on honeycomb composite parts requiring high compressive strength at temperatures up to 350°F / 177°C. Ideal for fastener or attachment potting an.. |