Polymer Property : Viscosity = 5500 cP Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Viscosity	5500 cP	5500 cP
NextGen Adhesives G907-31 Epoxy Adhesive Description: NGAC G907-31 is a medium viscosity epoxy adhesive system utilized extensively in industrial and structural applications.Advantages and Applications: The NGAC G907-31 provides excellent ..
Viscosity	5500 cP @Temperature 175 °C	5500 cP @Temperature 347 °F	Shimadzu Viscosity, 1000 psi
Cookson Group Plaskon® SMT-B-1FX (146.801) Epoxy Molding Compound for PBGAs (discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.An epoxy molding compound optimized specifically for PBGA applications. It is a reduced catalyst version of SMT-B-1F and provide..
Viscosity	5500 cP @Temperature 175 °C	5500 cP @Temperature 347 °F	Automatic orifice Viscosity
Cookson Group Plaskon® ULS-12 Epoxy Encapsulant (discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A state-of-the-art, ultra low stress epoxy encapsulant designed for packaging large, stress-sensitive DIPs, PLCCs and QFPs. It i..
Viscosity	5500 cP @Temperature 175 °C	5500 cP @Temperature 347 °F	Automatic orifice Viscosity
Cookson Group Plaskon® ULS-12LA Molding Compound (discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.An ultra low stress, low alpha emission molding compound designed for packaging stress-sensitive memory devices such as TSOPs and..
Viscosity	5500 - 8500 cP @Shear Rate 230 1/s, Temperature 25.0 Â°C	5500 - 8500 cP @Shear Rate 230 1/s, Temperature 77.0 Â°F	Haake VT 550 PK1.1Â°
Gwent Electronic Materials D2060131D1 Dielectric Paste This Material is a white colored screen printable polymer dielectric, suitable for defining electrode areas and forms a protective layer over the electrode tracking during immersion of the electrode..
Viscosity	>= 5500 cP @Time 7200 sec	>= 5500 cP @Time 2.00 hour	V-7-1
Solvay JAGUARÂ® S Surfactant Description: 100% Natural thickening polymer. Approved by Ecocert.Chemical Name: Guar Gum C.T.F.A./I.N.C.I. Name: Cyamopsis Tetragonoloba (Guar) Gum CAS: 9000-30-0 Ingredient Compatibility: Anionic,..
Viscosity	5500 cP @Temperature 25.0 °C	5500 cP @Temperature 77.0 °F	After mixing
Tra-Con Tra-Bond 642-1 Epoxy Adhesive TRA-BOND 642-1 unfilled epoxy adhesive is designed to provide a long pot life and cure rapidly at elevated temperatures. Information provided by Tra-Con Inc.
Viscosity	5500 cP	5500 cP	Mixed (cp #40, 2.5 rpm)
Tra-Con Tra-Bond 546S05 Dual-Cure Acrylate TRA-BOND 546S05 is a dual cure (UV/heat) acrylate featuring excellent adhesion to glass. Ultimate Tg attained and shadowed areas cured with 15 minute exposure to 100-120°C.Information provided by T..
Viscosity	5500 cP @Temperature 25.0 °C	5500 cP @Temperature 77.0 °F
Cytec EN-7 (Conap) Casting, Potting, and Molding Compound High Technology Potting, Casting and Molding CompoundsTwo-component, polybutadiene-based liquid urethane casting and potting systems. When reacted these high technology systems produce tough, stable..
Viscosity	5500 cP @Temperature 25.0 °C	5500 cP @Temperature 77.0 °F
Cytec EN-8 (Conap) Casting, Potting, and Molding Compound High Technology Potting, Casting and Molding CompoundsTwo-component, polybutadiene-based liquid urethane casting and potting systems. When reacted these high technology systems produce tough, stable..
Viscosity	5500 - 7500 cP @Temperature 23.0 °C	5500 - 7500 cP @Temperature 73.4 °F	50 rpm
Epoxy Technology EPO-TEK® E3001-6 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & ..
Viscosity	5500 cP @Temperature 177 °C	5500 cP @Temperature 350 °F	Typical
Bostik 2103 Flexible Bond EVA Glue Stick Bostik 2103 Flexible Bond EVA Glue StickFlexible bond for non-porous substrates.
Viscosity	5500 cP	5500 cP	Part B, RVT, #3, 2.5 rpm; TM R050-12
Resinlab® EP1296 Highly Filled, Moderately Thixotropic Black Casting Resin Resinlab™ EP1296 is a highly filled, moderately thixotropic black casting resin designed for applications requiring good thermal conductivity, low shrinkage and a low CTE. It was especially formula..