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Polymer Property : Cure Time = 0.0333 hour Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 2.00 min @Temperature 120 °C |
0.0333 hour @Temperature 248 °F |
|
| NextGen Adhesives P907-01 Fiber Optic Adhesive Description: NGAC P907-01 is a rapid curing, low viscosity, heat cured epoxy adhesive system that is specifically formulated for use in the fiber optic industry.Advantages and Applications: Uses inc.. |
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| Cure Time | 2.00 min @Temperature 120 °C |
0.0333 hour @Temperature 248 °F |
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| NextGen Adhesives P907-30 Optical Assembly Adhesive Description: NGAC P907-30 is a high viscosity, controlled flow encapsulant designed for microelectronics applications requiring low shrinkage and high reliability performance.Advantages and Applicat.. |
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| Cure Time | 2.00 min @Temperature 65.0 °C |
0.0333 hour @Temperature 149 °F |
85% RH |
| Parker Chomerics CHO-FORM 5532 EMI Shielding Material One component, moisture cure, form-in-place EMI gasketing material. This electrically conductive formulation contains silver-plated copper particles dispersed in a silicone elastomer. Cho-Form® 553.. |
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| Cure Time | 2.00 - 5.00 min @Temperature 121 - 149 °C |
0.0333 - 0.0833 hour @Temperature 250 - 300 °F |
|
| Lord Adhesives Chemglaze® V021 Polyurethane Coating Chemglaze® V-Line polyurethane coatings are moisture curing aliphatic polyurethane coatings. They are used in product finishing applications on polyvinyl-chloride (PVC) and other plastics where m.. |
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| Cure Time | 2.00 - 5.00 min @Temperature 121 - 149 °C |
0.0333 - 0.0833 hour @Temperature 250 - 300 °F |
|
| Lord Adhesives Chemglaze® V175 Polyurethane Coating Chemglaze® V-Line polyurethane coatings are moisture curing aliphatic polyurethane coatings. They are used in product finishing applications on polyvinyl-chloride (PVC) and other plastics where m.. |
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| Cure Time | 2.00 min @Temperature 232 °C |
0.0333 hour @Temperature 450 °F |
|
| Lord Adhesives Flocklok® 852 Flock Adhesive LORD Flocklok® 852 adhesive is a single-coat adhesive used to adhere polyester or nylon flock fibers to a variety of elastomers including EPDM, NR, CR and SBR. Flocked substrates provide good res.. |
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| Cure Time | 2.00 min @Temperature 232 °C |
0.0333 hour @Temperature 450 °F |
|
| Lord Adhesives Flocklok® 870 Flock Adhesive LORD Flocklok® 870 adhesive is a single-coat adhesive used to adhere polyester or nylon flock if beers to a variety of elastomers including EPDM, NR, CR and SBR. Flocked substrates provide good r.. |
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| Cure Time | 2.00 min @Temperature 150 °C |
0.0333 hour @Temperature 302 °F |
|
| Gwent Electronic Materials C2050905D3 80:20 Silver Palladium Ink C2050905D3 is an ink based on a 80:20 ratio of Silver:Palladium; a screen printing internal electrode ink for flexible PZT components. This Material is compatible with PVB tape. The ink is designed .. |
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| Cure Time | 2.00 - 5.00 min @Temperature 121 - 149 °C |
0.0333 - 0.0833 hour @Temperature 250 - 300 °F |
|
| Lord Adhesives Chemglaze® V209 Polyurethane Coating Chemglaze® V-Line polyurethane coatings are moisture curing aliphatic polyurethane coatings. They are used in product finishing applications on polyvinyl-chloride (PVC) and other plastics where m.. |
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| Cure Time | 2.00 - 5.00 min @Temperature 121 - 149 °C |
0.0333 - 0.0833 hour @Temperature 250 - 300 °F |
|
| Lord Adhesives Chemglaze® V300 Polyurethane Coating Chemglaze® V-Line polyurethane coatings are moisture curing aliphatic polyurethane coatings. They are used in product finishing applications on polyvinyl-chloride (PVC) and other plastics where m.. |
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| Cure Time | 2.00 min @Temperature 232 °C |
0.0333 hour @Temperature 450 °F |
|
| Lord Adhesives Flocklok® 855 Flock Adhesive LORD Flocklok® 855 adhesive is a single-coat adhesive used to adhere polyester or nylon flock fibers to a variety of elastomers including EPDM, NR, CR and SBR. Flocked substrates provide good res.. |
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| Cure Time | 2.00 min @Temperature 150 °C |
0.0333 hour @Temperature 302 °F |
|
| Tra-Con Tra-Bond 7560D Hydrolytically Stable Adhesive TRA-BOND 7560D is an electrically insulating epoxy adhesive. This material has a 10 day work life and a medium viscosity for easy usage. There are also multiple cure options that make this product i.. |
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| Cure Time | 2.00 min @Temperature 175 °C |
0.0333 hour @Temperature 347 °F |
|
| Tra-Con Tra-Bond 77-1S One Component SMD Adhesive TRA-BOND 77-1S one component, solvent-free, insulating epoxy adhesive is designed specifically for attaching surface mounted devices (SMDs) to printed circuit boards prior to wave solder. TRA-BOND 7.. |
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| Cure Time | 2.00 min @Temperature 120 °C |
0.0333 hour @Temperature 248 °F |
|
| Tra-Con Tra-Bond F123LV Color Keyed High Temperature Epoxy Adhesive TRA-BOND F123LV is a fast cure, low viscosity, two-component epoxy formulation that signals both proper mixing and curing when bonding fiber optic bundles, potting glass fibers, and/or terminating s.. |
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| Cure Time | 2.00 min @Temperature 120 °C |
0.0333 hour @Temperature 248 °F |
|
| Tra-Con Tra-Bond F123MV Color Keyed High Temperature Epoxy Adhesive TRA-BOND F123 MV is a fast cure, medium viscosity, two-component epoxy formulation that signals both proper mixing and curing when bonding fiber optic bundles, potting glass fibers, and/or terminati.. |
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| Cure Time | 2.00 min @Temperature 150 °C |
0.0333 hour @Temperature 302 °F |
|
| Tra-Con Tra-Duct 2958 Snap Cure Conductive Silver Epoxy Adhesive TRA-DUCT 2958 is a two-part, smooth paste of specially refined and processed epoxy and silver components, recommended for electronic, microelectronic and die-attach bonding and sealing applications .. |
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| Cure Time | 2.00 min @Temperature 193 - 204 °C |
0.0333 hour @Temperature 380 - 400 °F |
|
| Master Bond Supreme 10HTFS Silver Conductive Microelectronic Epoxy Description: Master Bond Polymer System Supreme 10HTFS “snap cure” epoxy is a formulated system featuring a combination of high performance properties including high shear and peel strength, outst.. |
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| Cure Time | 2.00 min @Temperature 150 °C |
0.0333 hour @Temperature 302 °F |
|
| Tra-Con Tra-Duct 2956 Low Ion Snap Cure Silver Epoxy Adhesive TRA-DUCT 2956 is recommended for the bonding and sealing of electronic components where a combination of electrical and mechanical properties are required. This two-part, smooth, paste system of sil.. |
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| Cure Time | 2.00 min @Temperature 180 °C |
0.0333 hour @Temperature 356 °F |
|
| Trelleborg Emerson & Cuming Eccobond® A 316 Filler End Cap Epoxy Adhesive Emerson & Cuming A 316 Eccobond® Filler End Cap Epoxy AdhesiveOne component, pourable, fast heat curing, epoxy adhesive. Exhibits excellent thermal stability and resistance to chemicals. Used as en.. |
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| Cure Time | 2.00 min @Temperature 180 °C |
0.0333 hour @Temperature 356 °F |
Bond Line |
| Epoxy Technology EPO-TEK® E2001-HV Electrically Conductive, Silver-Filled Epoxy Product Description: EPO-TEK® E2001-HV Is a snap cure, two component, silver-filled die attach adhesive for semiconductor plastic IC packaging.Advantages & Application Notes:Snap cure adhesive or f.. |
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| Cure Time | 2.00 min @Temperature 150 °C |
0.0333 hour @Temperature 302 °F |
Minimum Bond Line |
| Epoxy Technology EPO-TEK® E3001-6 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & .. |
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| Cure Time | 2.00 min @Temperature 180 °C |
0.0333 hour @Temperature 356 °F |
Minimum Bond Line |
| Epoxy Technology EPO-TEK® E3001-HV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & .. |
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| Cure Time | 2.00 min @Temperature 120 °C |
0.0333 hour @Temperature 248 °F |
minimum |
| Epoxy Technology EPO-TEK® OE120 Two Component Epoxy Material Description: A two component, opaque epoxy, designed for fiber optics packaging applications. It is a black-colored version of EPO-TEK 353ND-T. It has a high Tg for resisting elevated ope.. |
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| Cure Time | 2.00 min @Temperature 150 °C |
0.0333 hour @Temperature 302 °F |
minimum |
| Epoxy Technology EPO-TEK® OE138 Two Component Epoxy Material Description: A two component epoxy with intermediate viscosity range between EPO-TEK® 353ND and EPO-TEK® 353ND-T. It is designed for semiconductor glob top applications, as well as use in.. |
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| Cure Time | 2.00 min @Temperature 100 °C |
0.0333 hour @Temperature 212 °F |
|
| Dow Corning 3-4222 DIELECTRIC FIRM GEL KIT Two-part, translucent green, firm, fast RT or heat cure, and primerless chemical adhesion.Information provided by Dow Corning |
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| Cure Time | 2.00 min @Temperature 232 °C |
0.0333 hour @Temperature 450 °F |
|
| 3M Scotchcast™ 5555 22G Electrical Insulating Epoxy Resin 3M Scotchcast Electrical Resin 5555 is a one-part, green pigmented, rapid heat curing powder coating. It is designed to provide a continuous, tough moisture and chemical resistant dielectric coating.. |
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| Cure Time | 2.00 - 5.00 min @Temperature 150 °C |
0.0333 - 0.0833 hour @Temperature 302 °F |
|
| Atom Adhesives AA-DUCT 902 Epoxy Adhesive and Coating AA-DUCT 902 is an epoxy adhesive and coating formulation based on pure silver. This versatile silver formulation offers the maximum continuity of conductivity with an electrical resistivity value of.. |
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| Cure Time | 2.00 min @Temperature 120 °C |
0.0333 hour @Temperature 248 °F |
|
| Atom Adhesives AA-DUCT 902LP Epoxy Adhesive AA-DUCT 902LP is an epoxy adhesive and coating formulation based on pure silver. This versatile silver formulation offers the maximum continuity of conductivity with an electrical resistivity value .. |
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| Cure Time | 2.00 min @Temperature 232 °C |
0.0333 hour @Temperature 450 °F |
|
| 3M Scotchcast™ 265 Electrical Epoxy Powder Resin 3M Scotchcast Electrical Resin 265 is a new solution to an old problem. Historically, manufactures of coils, stators and armatures have used liquid-based varnishes or resins to coat and impregnate t.. |
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| Cure Time | 2.00 min @Temperature 120 °C |
0.0333 hour @Temperature 248 °F |
EN 2243-1 |
| Hexcel® Redux® 810 Two-Part Epoxy Paste Adhesive Redux® 810 is a multi-purpose, high shear and peel strength, two-part, toughened epoxy paste adhesive with corrosion-inhibiting properties.Features: Available in cartridges with a static mixer and .. |
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