Polymer Property : Pot Life = 480 min Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Pot Life	480 min @Temperature 23.9 °C	480 min @Temperature 75.0 °F
Parker Chomerics CHO-SHIELD® 610 A/B Conductive Epoxy Paint Highly Conductive Epoxy Paint. This is a two-component, silver plated, copper-filled, highly conductive epoxy paint. This coating was developed for application to non-conductive plastic substrates t..
Pot Life	480 min	480 min
Parker Chomerics CHO-SHIELD® 579 Low VOC Silver Epoxy Coating Description: CHO-SHIELD® 579 coating is a two component, silver-filled, highly conductive epoxy paint designed to provide EMI shielding when applied to a dielectric substrate. This coating was spec..
Pot Life	480 - 720 min	480 - 720 min
Abatron AboCast/AboCure 8508-1/8508-1 Primerless, High-Solids Epoxy (discontinued **) Primerless, high-solids epoxy structural paint for concrete, wood, metal and composite surfaces. 2-component system in standard and custom colors.Suggested Uses: Protective and decorative painting ..
Pot Life	480 min	480 min
Lord Adhesives AeroglazeÂ® 9924 Wash Primer AeroglazeÂ® 9924 wash primer was designed for priming metal surfaces. It is particularly useful for priming nonferrous substrates such as aluminum and galvanized steel.All information provided by ..
Pot Life	480 min	480 min
Lord Adhesives AeroglazeÂ® 9924V Wash Primer AeroglazeÂ® 9924V wash primer was designed for priming metal surfaces. It is particularly useful for priming non-ferrous substrates such as aluminum and galvanized steel.All information provided b..
Pot Life	480 min	480 min
Henkel Hysol EA 9150 Composite Resin Low viscosity, toughened system formulated for resin transfer molding. 250Â°F / 121Â°C cure and service temperature.Application: Composite Binding
Pot Life	480 min	480 min	rv #7 @ 2.5 rpm; 30 grams, minimum
Tra-Con Tra-Bond 526M01 Rigid Thixotropic Adhesive TRA-BOND 526M01 is two-component, rigid, thixotropic material developed specifically for fiber optic applications. The material is a cream color when mixed and changes to a red amber color when full..
Pot Life	480 min @Temperature 25.0 °C	480 min @Temperature 77.0 °F	100 grams
Cytec (Conap) FR-1046 / EA-117 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
Pot Life	480 min @Temperature 25.0 °C	480 min @Temperature 77.0 °F	100 grams
Cytec (Conap) FR-1047 / EA-117 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
Pot Life	480 min @Temperature 25.0 °C	480 min @Temperature 77.0 °F	100 grams
Cytec (Conap) RN-1000 / EA-117 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
Pot Life	480 - 600 min @Temperature 25.0 °C	480 - 600 min @Temperature 77.0 °F
Cytec Conathane® CC-1155-35 (Conap) Polyurethane Two-component Dielectric Conformal Coating Dielectric Conformal Coatings for ElectronicsCytec dielectric conformal coatings are the most widely used conformal coatings in industry today for such divergent applications as aircraft avionics, i..
Pot Life	480 min	480 min
Epoxy Technology EPO-TEK® 383ND High Temperature Epoxy Material Description: A slightly longer pot life version of EPO-TEK®353ND designed for high temperature, optical and structural applications inside the semiconductor, hybrid, electronic, fiber opti..
Pot Life	480 min	480 min
Epoxy Technology EPO-TEK® E3001-6 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & ..
Pot Life	480 min	480 min
Epoxy Technology EPO-TEK® H27D Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H27D is a two component, silver-filled epoxy adhesive designed for semiconductor and hybrid-microelectronic packaging applications.Advantages & Application Notes: Rheo..
Pot Life	480 min	480 min
Epoxyset Epoxibond EB-107LP-2 Unfilled Epoxy Adhesive A two-component, unfilled epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.Information provided by Epoxyset Inc.
Pot Life	>= 480 min	>= 480 min
Epoxyset Epoxiohm EO-38M-3 Electrically Conductive Epoxy Adhesive EO-38M-3 is a two components, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is used for thermal management appl..
Pot Life	480 - 720 min	480 - 720 min	or longer
Abatron AboCast 8502-6/AboCure 8502-6 Colorless, Low-Exotherm Epoxy Casting Compound AboCast 8502-6/AboCure 8502-6 is a flexible, colorless, low-exotherm epoxy casting compound for spherical masses up to 2000 grams. It is a 2-component structural and dielectric liquid system with lo..
Pot Life	480 - 720 min @Temperature 70.0 - 80.0 °C	480 - 720 min @Temperature 158 - 176 °F
Abatron KromaKote 8601-1 Ceramic-Like Epoxy 2-component system available in glossy standard and custom colors. Provides heavy duty protection and resurfacing for water and chemical resistanceSuggested Uses: Protective and decorative painting..
Pot Life	>= 480 min @Temperature 25.0 °C	>= 480 min @Temperature 77.0 °F	100 gm mass
Aremco Aremco-Bond™ 2150 High Performance Epoxide Ceramic-Filled, Fast-Setting, High Vibration Resistance and Bond Strength. Ideal for bonding ceramic wear tiles.
Pot Life	>= 480 min @Temperature 25.0 °C	>= 480 min @Temperature 77.0 °F	100 gm mass
Aremco Aremco-Bond™ 2315X High Temperature Epoxide Potting Compound Improved Crack Resistance & Bond Strength. High Temperature Resistance, Thermally Conductive, Low Viscosity.
Pot Life	>= 480 min	>= 480 min
ACC QSil 550SB QSI Quantum Silicones Self-Priming Silicone Potting Material QSil 550SB is a 100% silicone solids elastomer designed for electronic potting applications. The two-component system offers a hard, thermally conductive, low modulus material that is readily repair..
Pot Life	480 min @Temperature 24.0 °C	480 min @Temperature 75.2 °F
Parker Chomerics CHO-SHIELD® 598 A/B Silver-Epoxy Coating Silver-Epoxy Coating. This coating is a two-component, silver bearing, highly conductive epoxy paint designed to provide EMI shielding when applied to a plastic, non-conductive substrate. Used as a ..
Pot Life	480 - 720 min	480 - 720 min	Mass: 100g; TM R050-17
Resinlab® EP1285HD-10 Highly Filled, Medium Viscosity Casting Resin Resinlab™ EP1285 (Formerly Lab Product W021901 series) is a highly filled, medium viscosity black casting resin designed for applications requiring a high degree of thermal conductivity and a low C..
Pot Life	480 min	480 min
Henkel Hysol EA 9394/C-2 Paste Adhesive System Elevated cure, thixotropic adhesive with structural properties to 450°F / 232°C.Application: Structural Repair
Pot Life	480 min	480 min
Henkel Hysol EA 9820 Paste Adhesive System High-density, one-component epoxy syntactic for use on honeycomb composite parts requiring high compressive strength at temperatures up to 350°F / 177°C. Ideal for fastener or attachment potting a..
Pot Life	480 min	480 min
Henkel Hysol EA 9825 Paste Adhesive System Low-density, one-component epoxy syntactic for use on honeycomb composite parts requiring high compressive strength at temperatures up to 350°F / 177°C. Ideal for fastener or attachment potting an..