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Resinlab® SEC1222 Silver Filled Epoxy Adhesive

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Resinlab®
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Resinlab® SEC1222 Silver Filled Epoxy Adhesive.pdf
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Material Notes:
Resinlab™ SEC1222 is a silver filled, two component, room temperature curing epoxy adhesive. It is designed to cure completely at room temperature. SEC1222 provides excellent electrical conductivity useful in many electronic applications. It is a soft 100% solids thixotropic paste provided in a 1:1 ratio. It is recommended to mix by weight but extrusion of equal length beads from syringes is commonly used as a method of measurement as small quantities are commonly used. SEC1222 provides exceptionally high conductivity starting immediately after mixing and improves as the curing process proceeds. It also has the additional benefit of very high thermal conductivity due to its high silver loading. It gives good environmental protection while having tenacious adhesion to various metals and other common assembly materials.Information Provided by Resinlab L.L.C., an Ellsworth Adhesives Company.
Physical Properties Metric English Comments
Specific Gravity 3.90 g/cc
3.90 g/cc
Mixed; TM R050-16
Water Absorption <= 0.10 %

@Time 86400 sec
<= 0.10 %

@Time 24.0 hour
TM R050-35
Viscosity 54250 cP
54250 cP
10.0 rpm; TM R050-12
162500 cP
162500 cP
5.0 rpm; TM R050-12
318500 cP
318500 cP
Mixed, 2.5 rpm; TM R050-12
Mechanical Properties Metric English Comments
Hardness, Shore D 80
80
TM R050-17
Tensile Strength at Break 6.55 MPa
950 psi
TM R050-36
Tensile Strength, Ultimate 6.89 MPa
1000 psi
TM R050-36
Tensile Strength, Yield 6.89 MPa
1000 psi
TM R050-36
Elongation at Break 3.0 - 5.0 %
3.0 - 5.0 %
TM R050-36
Tensile Modulus 0.345 GPa
50.0 ksi
TM R050-36
Compressive Yield Strength 10.3 MPa
1500 psi
TM R050-38
Compressive Strength 65.5 MPa
9500 psi
Break; TM R050-38
68.9 MPa
10000 psi
Ultimate; TM R050-38
Compressive Modulus 0.448 GPa
65.0 ksi
TM R050-38
Adhesive Bond Strength 5.86 MPa
850 psi
Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37
Thermal Properties Metric English Comments
CTE, linear 53.0 µm/m-°C

@Temperature <=34.0 °C
29.4 µin/in-°F

@Temperature <=93.2 °F
below Tg
110 µm/m-°C

@Temperature >=34.0 °C
61.1 µin/in-°F

@Temperature >=93.2 °F
above Tg
Thermal Conductivity 1.60 W/m-K
11.1 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 150 °C
302 °F
Minimum Service Temperature, Air -40.0 °C
-40.0 °F
Glass Transition Temp, Tg 34.0 °C
93.2 °F
TM R050-25
Electrical Properties Metric English Comments
Volume Resistivity 0.00089 ohm-cm
0.00089 ohm-cm
Cured: 1 hour at 60°C
0.0014 ohm-cm
0.0014 ohm-cm
Cured: 24 hours at 25°C
0.0030 ohm-cm
0.0030 ohm-cm
Cured: 8 hours at 25°C
Processing Properties Metric English Comments
Cure Time 60.0 min

@Temperature 60.0 °C
1.00 hour

@Temperature 140 °F
1440 - 4320 min

@Temperature 25.0 °C
24.0 - 72.0 hour

@Temperature 77.0 °F
Pot Life 45 min
45 min
Mass: 5g; TM R050-19
Descriptive Properties Value Comments
Color Silver
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