Polymer Property : Adhesive Bond Strength = 5.86 MPa Product List

Mechanical Properties

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Mechanical Properties	Metric	English	Comments
Adhesive Bond Strength	5.86 MPa	850 psi	Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37
Resinlab® EP1295 Black Medium Viscosity, Halogen Free, Flame Retardant Epoxy Casting Resin Resinlab™ EP1295 Black is a medium viscosity, halogen free, flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Laboratories Inc., (..
Adhesive Bond Strength	5.86 - 24.1 MPa	850 - 3500 psi	Average value: 12.8 MPa Grade Count:26
Overview of materials for Epoxy Cure Resin This property data is a summary of similar materials in the MatWeb database for the category "Epoxy Cure Resin". Each property range of values reported is minimum and maximum values of appropriate M..
Adhesive Bond Strength	>= 5.86 MPa	>= 850 psi	shear, Al/Al
Master Bond EP21TDCNFL Two Component Nickel Conductive Epoxy Adhesive Master Bond Polymer System EP21TDCNFL is a two component, nickel filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidl..
Adhesive Bond Strength	>= 5.86 MPa	>= 850 psi	shear, Al/Al
Master Bond EP21TDCS Two Component Silver Conductive Epoxy Adhesive Master Bond Polymer System EP21TDCS is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidl..
Adhesive Bond Strength	>= 5.86 MPa	>= 850 psi	shear, Al/Al, after 30 days water immersion
Master Bond EP21TDCS Two Component Silver Conductive Epoxy Adhesive Master Bond Polymer System EP21TDCS is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidl..
Adhesive Bond Strength	>= 5.86 MPa	>= 850 psi	shear, Al/Al
Master Bond EP21TDCSFL Flexible Two Component Silver Conductive Epoxy Master Bond Polymer System EP21TDCSFL is a two component, silver filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidl..
Adhesive Bond Strength	>= 5.86 MPa	>= 850 psi	shear, Al/Al
Master Bond EP21TDCSMed Two Component, Silver Conductive USP Class VI Epoxy Master Bond Polymer System EP21TDCS MED is a two component, silver filled, electrically conductive adhesive/sealant that meets USP Class VI specifications for medical applications. The high strength..
Adhesive Bond Strength	>= 5.86 MPa @Temperature 23.0 °C	>= 850 psi @Temperature 73.4 °F
Master Bond EP79 Two Component, Silver Coated, Nickel Filled Conductive Epoxy Master Bond Polymer System EP79 is a two component, silver coated, nickel filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or ..
Adhesive Bond Strength	>= 5.86 MPa @Temperature 23.0 °C	>= 850 psi @Temperature 73.4 °F
Master Bond EP79FL Two Component Silver Nickel Conductive Epoxy Adhesive Master Bond Polymer System EP79FL is a two component, silver-coated nickel, electrically conductive system for high performance bonding and sealing. Its most salient features are its high flexibilit..
Adhesive Bond Strength	>= 5.86 MPa	>= 850 psi	shear, Al/Al
Master Bond EP21TDCSLO Two Component Silver Conductive Epoxy Adhesive Master Bond Polymer System EP21TDCS-LO is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rap..
Adhesive Bond Strength	5.86 MPa	850 psi	Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37
Resinlab® SEC1222 Silver Filled Epoxy Adhesive Resinlab™ SEC1222 is a silver filled, two component, room temperature curing epoxy adhesive. It is designed to cure completely at room temperature. SEC1222 provides excellent electrical conductivit..