Polymer Property : Cure Time = 24.0 hour Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Cure Time	1440 min @Temperature 25.0 °C	24.0 hour @Temperature 77.0 °F
NextGen Adhesives P907-03 Fiber Optic Adhesive Description: NGAC P907-03 is a low viscosity and room temperature curing adhesive specifically formulated for fiber optic terminations.Advantages and Applications: Uses include the termination of si..
Cure Time	1440 min @Temperature 24.0 °C	24.0 hour @Temperature 75.2 °F
Parker Chomerics CHO-SHIELD® 2056 Conductive Coating CHO-SHIELD® 2054 silver-plated-copper filled commercial-grade coating proved high levels of EMI shielding effectiveness, abrasion resistance and excellent adhesion on a variety of materials used fo..
Cure Time	1440 min @Temperature 25.0 °C	24.0 hour @Temperature 77.0 °F	Complete Cure Cycle
Northstar Polymers MPP-A65A High Performance Polyether This high performance polyether system is one of a family of polymer systems developed by Northstar Polymers for specific demanding work environments. Urethane elastomers molded with this system ex..
Cure Time	1440 - 2880 min @Temperature 23.0 °C	24.0 - 48.0 hour @Temperature 73.4 °F
Master Bond Mastersil 151 Two Component Low Viscosity Silicone Compound Master Bond MasterSil 151 is a two component, low viscosity silicone compound for high performance potting and encapsulation. MasterSil 151 is an addition cured system and does not require exposure..
Cure Time	1440 min @Temperature 25.0 °C	24.0 hour @Temperature 77.0 °F
Tra-Con Tra-Bond 2123 Metal Repair Steel/Epoxy Adhesive TRA-BOND 2123 is a versatile steel metal/epoxy adhesive formulation developed for modern industrial repair, casting and bonding applications where a steel-like or cast iron finish is required. This ..
Cure Time	1440 min @Temperature 25.0 °C	24.0 hour @Temperature 77.0 °F
Tra-Con Tra-Bond CA20 Coil-Fix Epoxy Adhesive TRA-BOND CA-20 is a thixotropic epoxy adhesive system specially formulated for shorted turns, damaged end wire extensions, or other coil repair applications where a high-fill, non-sag adhesive is re..
Cure Time	1440 min @Temperature 25.0 °C	24.0 hour @Temperature 77.0 °F
Tra-Con Tra-Bond FDA22BK01 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-22BK01 is a high viscosity epoxy resin system specifically developed for bonding and coating applications in accordance. This two-part black adhesive is easily mixed, used and cured at ..
Cure Time	1440 min @Temperature 25.0 °C	24.0 hour @Temperature 77.0 °F
Tra-Con Tra-Bond FS279 Blush-Free Non-Sag Structural Epoxy Adhesive TRA-BOND FS-279 is a two-part epoxy adhesive specifically formulated to be non-sagging and have improved adhesion to smooth, non-porous substrates such as glass, ceramic, stainless steel, etc. This ..
Cure Time	1440 - 2880 min @Temperature 23.0 °C	24.0 - 48.0 hour @Temperature 73.4 °F
Master Bond EP21FL Flexibilized and Toughened Low Viscosity Epoxy Master Bond Polymer System EP21FL is a lower viscosity, two component, flexibilized epoxy resin system for high performance bonding, coating, sealing and encapsulating. It is formulated to cure at r..
Cure Time	1440 - 2880 min @Temperature 23.9 °C	24.0 - 48.0 hour @Temperature 75.0 °F
Master Bond EP30LV-1 Ultra Low Viscosity, Two Part Epoxy System Description: Master Bond Polymer System EP30LV-1 is an ultra low viscosity, two component epoxy system for high performance bonding, coating, sealing, potting and encapsulation. It readily cures at ..
Cure Time	1440 - 2880 min @Temperature 23.0 °C	24.0 - 48.0 hour @Temperature 73.4 °F
Master Bond EP35 High Temperature Resistant Two Component Epoxy System Master Bond Polymer Adhesive EP35 is a unique, room temperature curing, two component epoxy adhesive for high temperature bonding applications. Master Bond Polymer Adhesive EP35 produces high stren..
Cure Time	1440 min @Temperature 25.0 °C	24.0 hour @Temperature 77.0 °F
Tra-Con Tra-Bond FS437 Low Viscosity High Impact Epoxy Adhesive TRA-BOND FS437 is a two-part, low viscosity material formulated for optical applications which require excellent wicking, visible color and high strength. This material has been used successfully fo..
Cure Time	1440 min @Temperature 22.0 °C	24.0 hour @Temperature 71.6 °F
Dow Corning OE-6450 Two-part, solvent-less, high purity and heat cure type semiconductor protective coating of siliconeInformation provided by Dow Corning
Cure Time	1440 min @Temperature 10.0 °C	24.0 hour @Temperature 50.0 °F	Tack Free
Chesterton ARC 982 100% Novolac acid resistant coating Description: An advanced polymer composite formulated to protect equipment from extreme chemical attack and corrosion. A low viscosity composite that is applied by brush, squeegee, or a plural compo..
Cure Time	1440 min @Temperature 32.0 °C	24.0 hour @Temperature 89.6 °F	Full Chemical
Chesterton MRS SD4i Metal Rebuilding System An advanced ceramic composite for resurfacing and protection of metal surfaces in immersion service. It is normally applied in a thickness range of 250-370 microns (10 – 15 mils) per coat. Non-shri..
Cure Time	1440 min @Temperature 25.0 °C	24.0 hour @Temperature 77.0 °F
Cytec CE-1170 (Conap) Acrylic Dielectric Conformal Coating Dielectric Conformal Coatings for ElectronicsCytec dielectric conformal coatings are the most widely used conformal coatings in industry today for such divergent applications as aircraft avionics, i..
Cure Time	1440 min @Temperature 23.0 °C	24.0 hour @Temperature 73.4 °F	minimum
Epoxy Technology EPO-TEK® 731 Epoxy Adhesive Material Description: A two component, thixotropic, room temperature-curing epoxy adhesive. It is an electrically and thermally insulating epoxy designed for general applications in semiconductor p..
Cure Time	1440 min @Temperature 43.0 °C	24.0 hour @Temperature 109 °F	Full Chemical
Chesterton ARC MX2 High Wear Fine Particle Wear Compound Description: An advanced ceramic composite for the repair and protection of all metal surfaces subjected to severe erosion, corrosion and chemical attack. It is applied at a thickness of 3 mm (1/8”..
Cure Time	1440 min @Temperature 24.0 °C	24.0 hour @Temperature 75.2 °F	full cure
BCC Products BC 100 Thin Cyanoacrylate Adhesive BC100 Thin is a low viscosity material ideal for bonding larger areas. BC100 Thin has a 20 second fixture cure and able to fill gaps of .002” wide. BC100 Thin is perfectly designed for bonding plas..
Cure Time	>= 1440 min @Temperature 22.0 - 30.0 °C	>= 24.0 hour @Temperature 71.6 - 86.0 °F
Abatron 8509-4 A/B Carbon-Filled Electrically Conductive Epoxy Compound 8509-4 A/B is a solventless carbon-epoxy system used as an adhesive and silk-screening material with anti-static and other lower-conductivity requirements.
Cure Time	1440 min @Temperature 22.2 °C	24.0 hour @Temperature 72.0 °F	>0.5 Hour Air Set Required Prior to Curing
Aremco Corr-Paint™ CP2020 High Temperature Protective Coating Urethane, Aluminum Filled This epoxy and urethane based coating is used for producing corrosion and wear resistant barriers to 500 °F. Typical applications include tanks, pipelines, boilers, precipitators, scrubbers, bag ho..
Cure Time	1440 min @Temperature 25.0 °C	24.0 hour @Temperature 77.0 °F
Tra-Con Tra-Duct 2929 Room Temperature Conductive Flexible Silver Epoxy Adhesive TRA-DUCT 2929 is recommended for electronic bonding, coating and sealing applications that require high flexibility coupled with excellent electrical and mechanical properties. This two-part epoxy a..
Cure Time	1440 - 4320 min @Temperature 25.0 °C	24.0 - 72.0 hour @Temperature 77.0 °F
Resinlab® EP1200 Black Casting Resin Resinlab™ EP1200 Black is a highly filled, medium viscosity black casting resin designed for applications requiring a high degree of thermal conductivity, flexibility and a low CTE. It meets the re..
Cure Time	1440 - 4320 min @Temperature 25.0 °C	24.0 - 72.0 hour @Temperature 77.0 °F
Resinlab® SEC1222 Silver Filled Epoxy Adhesive Resinlab™ SEC1222 is a silver filled, two component, room temperature curing epoxy adhesive. It is designed to cure completely at room temperature. SEC1222 provides excellent electrical conductivit..