Polymer Property : CTE, linear = 53.0 µm/m-°C Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
CTE, linear	53.0 µm/m-°C @Temperature 200 - 300 °C	29.4 µin/in-°F @Temperature 392 - 572 °F	DIN 53 752
Ensinger TECASINT 1011 Polyimide (PI) TECASINT is a range of non-melting high temperature polyimides characterized by high strength over a wide range of temperatures, good long term thermal stability, minimal thermal expansion and excel..
CTE, linear	53.0 µm/m-°C @Temperature 26.0 °C	29.4 µin/in-°F @Temperature 78.8 °F	DIN 53752
BASF Ultrason S 2010 PSU Ultrason S 2010 is an unreinforced, medium viscosity standard injection molding PSU grade. It flows readily and offers outstanding heat resistance and dimensional stability. It conforms to FDA req..
CTE, linear	53.0 µm/m-°C @Temperature -50.0 - 30.0 °C	29.4 µin/in-°F @Temperature -58.0 - 86.0 °F
3M Scotch-Weld™ 2158 B/A Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive 2158 B/A is a gray, two-part, high strength adhesive that chemically cures at room temperature. It has good adhesion to a variety of substrates including metals, ma..
CTE, linear	53.0 µm/m-°C @Temperature <=77.0 °C	29.4 µin/in-°F @Temperature <=171 °F	below Tg
Resinlab® EP11HT Gray Filled Epoxy Adhesive Resinlab™ EP11HT Gray is a two part filled epoxy adhesive designed for bonding metals and plastics. It cures at room temperature to a tough, semi-rigid material. It has good wetting to most surfa..
CTE, linear	53.0 µm/m-°C @Temperature <=34.0 °C	29.4 µin/in-°F @Temperature <=93.2 °F	below Tg
Resinlab® SEC1222 Silver Filled Epoxy Adhesive Resinlab™ SEC1222 is a silver filled, two component, room temperature curing epoxy adhesive. It is designed to cure completely at room temperature. SEC1222 provides excellent electrical conductivit..