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Polymer Property : Cure Time = 1440 min Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 1440 min @Temperature 25.0 °C |
24.0 hour @Temperature 77.0 °F |
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| NextGen Adhesives G907-24 Structural Epoxy Adhesive Description: NGAC G907-24 is a medium viscosity and near transparent adhesive system that is specifically formulated for structural applications requiring excellent wetting, mechanical strength and .. |
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| Cure Time | 1440 min @Temperature 15.5 - 21.0 °C |
24.0 hour @Temperature 59.9 - 69.8 °F |
40-60% RH |
| Parker Chomerics CHO-SHIELD® 4998 Conductive Flexible Coating Description: CHO-SHIELD® 4998 is a smooth, highly conductive flexible silver-filled polyurethane coating designed for military/aerospace airframe applications. Both coatings provide superior adhesi.. |
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| Cure Time | 1440 min @Temperature 23.0 °C |
24.0 hour @Temperature 73.4 °F |
M10 steel, full strength |
| Permabond HM128 Anaerobic Threadlocker Permabond® HM128 Threadlocker is a high strength adhesive for permanent assembly. It is typically used for preventing vibration loosening of bolts, studs and cap screws. Full cure to a cross-linked.. |
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| Cure Time | >= 1440 min @Temperature 25.0 °C |
>= 24.0 hour @Temperature 77.0 °F |
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| Lord Adhesives HPC-5C Hydrogenated Nitrile Butadiene Rubber Coating LORD HPC-5B and HPC-5C are one-part, room temperature curing HNBR coatings which feature robust adhesion and exceptional mechanical properties. These coatings greatly enhance fluid and ozone resista.. |
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| Cure Time | 1440 min @Temperature 25.0 °C |
24.0 hour @Temperature 77.0 °F |
Through, 50% RH |
| Momentive Performance Materials N-Sil® RTV128 Silicone Modified Alkoxy Adhesive Sealants, Translucent N-Sil® adhesive sealants are one-component, ready-to-use, and cure to a tough, resilient silicone rubber on exposure to atmospheric moisture at room temperature.Key Performance Properties: Primer.. |
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| Cure Time | 1440 - 2880 min @Temperature 23.0 °C |
24.0 - 48.0 hour @Temperature 73.4 °F |
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| Master Bond EP21FRSPLV Flame Resistant Two Component Epoxy Master Bond Polymer System EP21FRSPLV is a two component, room temperature curable, flame resistant compound for potting, encapsulating and casting. EP21FRSPLV has a one to one mix ratio, by weight... |
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| Cure Time | 1440 min @Temperature 25.0 °C |
24.0 hour @Temperature 77.0 °F |
|
| Tra-Con Tra-Bond 2123 Metal Repair Steel/Epoxy Adhesive TRA-BOND 2123 is a versatile steel metal/epoxy adhesive formulation developed for modern industrial repair, casting and bonding applications where a steel-like or cast iron finish is required. This .. |
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| Cure Time | 1440 min @Temperature 25.0 °C |
24.0 hour @Temperature 77.0 °F |
|
| Tra-Con Tra-Bond FDA2YL02 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-2 YL02 is a medium viscosity epoxy resin system specifically developed for adhesive and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug.. |
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| Cure Time | 1440 min @Temperature 25.0 °C |
24.0 hour @Temperature 77.0 °F |
|
| Tra-Con Tra-Duct 916H03 Room Temperature Cure High Conductivity Silver Epoxy Adhesive TRA-DUCT 916H03 is recommended for electronic bonding and sealing applications that require the combination of high conductivity coupled with good mechanical properties. This two part smooth paste s.. |
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| Cure Time | 1440 min @Temperature 25.0 °C |
24.0 hour @Temperature 77.0 °F |
|
| Trelleborg Emerson & Cuming Eccobond® 64C Two-Component Nickel Filled Electrically Conductive Epoxy Adhesive Emerson & Cuming 64C Eccobond® Two-Component Nickel Filled Electrically Conductive Epoxy AdhesiveTwo component, nickel filled, electrically conductive epoxy adhesive. Room temperature cure. Good ba.. |
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| Cure Time | 1440 - 2160 min @Temperature 23.9 °C |
24.0 - 36.0 hour @Temperature 75.0 °F |
85% of maximum strength developed |
| Master Bond EP30LV Optically Clear, Low Viscosity Epoxy Adhesive Description: Master Bond Polymer System EP30LV is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or mo.. |
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| Cure Time | 1440 min @Temperature 25.0 °C |
24.0 hour @Temperature 77.0 °F |
|
| Tra-Con Tra-Bond 2115 Clear High Strength Epoxy Adhesive TRA-BOND 2115 is a clear, low viscosity epoxy formulation used in the fabrication of lasers. It is capable of withstanding 30 seconds of 60 watt direct laser energy. The low cure shrinkage (using a .. |
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| Cure Time | 1440 min @Temperature 25.0 °C |
24.0 hour @Temperature 77.0 °F |
|
| Tra-Con Tra-Bond 216C04 Information provided by Tra-Con Inc. |
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| Cure Time | 1440 min @Temperature 25.0 °C |
24.0 hour @Temperature 77.0 °F |
|
| Tra-Con Tra-Duct 2902 Room Temperature Conductive Silver Epoxy Adhesive TRA-DUCT 2902 is an electrically conducting silver-filled epoxy compound recommended for electronic bonding and sealing applications that require a combination of good mechanical and electrical prop.. |
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| Cure Time | 1440 min @Temperature 32.0 °C |
24.0 hour @Temperature 89.6 °F |
Overcoat End |
| Chesterton ARC S1 General purpose coating Description: An advanced polymer composite formulated to protect metal surfaces from corrosion and chmical attack. It is normally applied at a thickness of 250 microns (10 mils) per coat. Non-shrink.. |
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| Cure Time | 1440 min @Temperature 32.0 °C |
24.0 hour @Temperature 89.6 °F |
Full Chemical |
| Chesterton ARC S2 Ceramic reinforced erosion resistant coating Description: An advanced ceramic composite for the resurfacing and protection of all metal surfaces. It is normally applied at a thickness of 250 microns (10 mils) per coat. Non-shrinking, 100% soli.. |
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| Cure Time | 1440 min @Temperature 25.0 °C |
24.0 hour @Temperature 77.0 °F |
|
| Cytec CE-1171 (Conap) Acrylic Dielectric Conformal Coating Dielectric Conformal Coatings for ElectronicsCytec dielectric conformal coatings are the most widely used conformal coatings in industry today for such divergent applications as aircraft avionics, i.. |
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| Cure Time | 1440 min @Temperature 23.0 °C |
24.0 hour @Temperature 73.4 °F |
|
| Epoxy Technology EPO-TEK® 310M-T Flexible Epoxy Material Description: A two component, flexible epoxy designed for low stress applications in semiconductor, hybrid, medical, acoustical and optical industries. Replacement for EPO-TEK® 310T.Info.. |
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| Cure Time | 1440 min @Temperature 25.0 °C |
24.0 hour @Temperature 77.0 °F |
|
| Epoxyset Epoxibond EB-301 Low Expansion Epoxy Adhesive EB-301 is a highly filled, low expansion, epoxy adhesive. This low out-gassing adhesive exhibits excellent wettability without preheating metal bonding surfaces and has a good dimensional stability .. |
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| Cure Time | 1440 min @Temperature 25.0 °C |
24.0 hour @Temperature 77.0 °F |
|
| Epoxyset Epoxiohm EO-21 Electrically Conductive Epoxy Adhesive EO-21 is a two part, silver filled high electrical conductivity epoxy adhesive. It is designed to cure at room temperature or rapidly at elevated temperature and exhibits very excellent adhesion and.. |
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| Cure Time | 1440 - 2880 min @Temperature 25.0 °C |
24.0 - 48.0 hour @Temperature 77.0 °F |
|
| Epoxyset Epoxiohm EO-30M-1 Electrically Conductive Epoxy Adhesive EO-30M-1 is a two part, semi-rigid, silver filled, epoxy adhesive. EO-30M-1 exhibits superior adhesion to a wide variety of substrates including most metals, ceramics, glass and plastics.Information.. |
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| Cure Time | >= 1440 min @Temperature 22.0 - 30.0 °C |
>= 24.0 hour @Temperature 71.6 - 86.0 °F |
|
| Abatron AboCoat 8401-1 A/B Silver-Filled Electrically Conductive Epoxy Compound AboCoat 8401-1 A/B is a conventional highly-filled coating to produce conductive paths with the highest silver content possible. It requires strict controls. Resistivity may rise to 0.1 ohm/sq under.. |
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| Cure Time | 1440 min @Temperature 22.2 °C |
24.0 hour @Temperature 72.0 °F |
>0.5 Hour Air Set Required Prior to Curing |
| Aremco Corr-Paint™ CP2020 High Temperature Protective Coating Urethane, Aluminum Filled This epoxy and urethane based coating is used for producing corrosion and wear resistant barriers to 500 °F. Typical applications include tanks, pipelines, boilers, precipitators, scrubbers, bag ho.. |
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| Cure Time | 1440 min @Temperature 23.0 °C |
24.0 hour @Temperature 73.4 °F |
Zinc, working strength |
| Permabond A1042 Anaerobic Threadlocker Permabond® A1042 is a rapid curing adhesive designed to lock and seal metal parts that subsequently may need to be dismantled for maintenance. The high vibration resistance makes Permabond A1042 pa.. |
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| Cure Time | 1440 min @Temperature 25.0 °C |
24.0 hour @Temperature 77.0 °F |
|
| Resinlab® UR3001HP Clear Urethane Encapsulant Resinlab™ UR3001HP Clear is a clear, two component, room temperature curing urethane encapsulating system. It is designed to cure completely at room temperature. UR3001HP Clear provides excellent e.. |
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| Cure Time | 1440 min @Temperature 25.0 °C |
24.0 hour @Temperature 77.0 °F |
|
| Henkel Hysol EA 9394.2 Paste Adhesive System Fast cure adhesive for liquid shim and potting. Handling strength within 6 - 8 hours.Applications: Potting Structural Repair Liquid Shim |
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