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Polymer Property : Cure Time = 1.00 hour Product List

Processing Properties

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Processing Properties Metric English Comments
Cure Time 60.0 - 240 min

@Temperature 65.0 °C
1.00 - 4.00 hour

@Temperature 149 °F
NextGen Adhesives M907-19 Medical Grade Epoxy Adhesive
Description: NGAC M907-19 is a medium viscosity and thixotropic adhesive system that is specifically formulated for medical device assembly applications.Advantages and Applications: Uses include lam..
Cure Time 60.0 min

@Temperature 23.8 °C
1.00 hour

@Temperature 74.8 °F
and 1 hour at 121°C
Parker Chomerics CHO-SHIELD® 576 Platable Silver Epoxy Coating
Description: CHO-SHIELD® 576 coating is a two component, silver filled, highly conductive epoxy paint designed to provide EMI shielding when applied to a dielectric plastic substrate. This coating ..
Cure Time 60.0 min

@Temperature 121 °C
1.00 hour

@Temperature 250 °F
Parker Chomerics CHO-SHIELD® 610 A/B Epoxy Conductive Coating
Description: CHO-SHIELD® 610 A/B is a highly conductive, two-component silver-plated-copper filled epoxy coating for application to non-conductive plastic substrates, particularly those subject to ..
Cure Time 60.0 min

@Temperature 60.0 °C
1.00 hour

@Temperature 140 °F
Parker Chomerics THERM-A-FORM T647 Cure-in-Place Potting and Underfill Material
Description: THERM-A-FORM™ thermally conductive silicone elastomer products are dispensable form-in-place compounds designed for heat transfer without excessive compressive force in electronics co..
Cure Time 60.0 min

@Temperature 25.0 °C
1.00 hour

@Temperature 77.0 °F
De-mold Time
Northstar Polymers MPL-R20B Rigid Polyurethane Foam Formulation
This rigid polyurethane foam system is one of a family of polymer systems developed by Northstar Polymers for specific applications. Urethane foams molded with this system exhibit closed cell struct..
Cure Time 60.0 min

@Temperature 82.2 °C
1.00 hour

@Temperature 180 °F
Complete Cure Cycle
Northstar Polymers MPS-F04A Hand-Mixable Flexible Foam
This foam formulation is designed to make molded flexible foam parts/sheets/dies/blocks by hand-mixing or by the meter dispensing equipment. The components are stable liquid at room temperature and..
Cure Time 60.0 min

@Temperature 23.0 °C
1.00 hour

@Temperature 73.4 °F
Aluminum, handling strength
Permabond HH131 High Temperature Threadlocker
Permabond® HH131 is a very high temperature resistant, high strength anaerobic threadlocker and sealant. This material cures in the absence of air between tight fitting metal parts. It is used for ..
Cure Time 60.0 min

@Temperature 23.0 °C
1.00 hour

@Temperature 73.4 °F
Zinc, handling strength
Permabond LH150 Anaerobic Threadsealant
Permabond® LH150 Pipe Sealant with PTFE is designed for sealing and locking tapered metal pipe threads and fittings. It is ideal for stainless steel and other passive metals. Instant sealing of up ..
Cure Time 60.0 min

@Temperature 65.0 °C
1.00 hour

@Temperature 149 °F
Resin Technology Group TIGA 216-EX High Performance Adhesive
Mix ratio 2 to 1 by volume.TIGA 216-EX is a two-part epoxy adhesive offering outstanding shear tensile and peel adhesion. TIGA 216-EX offers a 60 minute pot life and good hardness development within..
Cure Time 60.0 min

@Temperature 150 °C
1.00 hour

@Temperature 302 °F
Post Cure
Shin-Etsu Silicones LIMSâ„¢ KE1950-20A/B Elastomer
KE-1950-20 is a liquid injection molding silicone. It is supplied as two components which are mixed in a 1:1 ratio to ensure easy and accurate blending. It's viscosity is low enough to allow easy ..
Cure Time 60.0 min

@Temperature 65.0 °C
1.00 hour

@Temperature 149 °F
Tra-Con Tra-Bond 216C03 Flexible Plastic Bonder
TRA-BOND 216C03 is a flexible thixotropic bonding adhesive designed for bonding all types of plastics including nylon, PVC, polyethylene, acrylic, lexan, polypropylene, kapton or almost any thermopl..
Cure Time 60.0 min

@Temperature 93.0 °C
1.00 hour

@Temperature 199 °F
Tra-Con Tra-Bond 724-14C Polyurethane Adhesive
TRA-BOND 724-14C premixed and frozen, polyurethane adhesive is designed for good adhesion, providing strong, resilient bonds to a wide variety of substrates, including aluminum, solder, nylon, mylar..
Cure Time 60.0 - 120 min

@Temperature 125 °C
1.00 - 2.00 hour

@Temperature 257 °F
Tra-Con Tra-Bond 933-2 Moisture Resistant Chip Encapsulant
TRA-BOND 933-2 one component, highly filled, electrically insulating epoxy encapsulant is designed for encapsulating microelectronic chips. This epoxy provides excellent environmental and mechanical..
Cure Time 60.0 - 240 min

@Temperature 65.0 °C
1.00 - 4.00 hour

@Temperature 149 °F
Tra-Con Tra-Bond FDA2 Food and Drug Application Epoxy Adhesive
TRA-BOND FDA-2 is a medium viscosity epoxy resin system specifically developed for medical device applications. It has been tested in accordance with USP biological reactivity tests, in vivo and rec..
Cure Time 60.0 - 240 min

@Temperature 65.0 °C
1.00 - 4.00 hour

@Temperature 149 °F
Tra-Con Tra-Cast F353 Optically Opaque Casting System
TRA-CAST F353 is an optically opaque, low viscosity, two-part epoxy system recommended for molding, potting, embedding, encapsulating, sealing and casting applications involving fiber optic, optical..
Cure Time 60.0 min

@Temperature 121 °C
1.00 hour

@Temperature 250 °F
Master Bond Supreme 10HTN Nickel Filled Electrically Conductive One Part Epoxy
Master Bond Polymer System Supreme 10HTN combines high shear and high peel strengths, relatively low resistance, and exceptionally easy processing. This one component (no mix) high purity nickel con..
Cure Time 60.0 min

@Temperature 70.0 °C
1.00 hour

@Temperature 158 °F
Dow Corning JCR 6101
One-part, translucent, medium modulus LED encapsulant with very long working time.Information provided by Dow Corning
Cure Time 60.0 min

@Temperature 16.0 °C
1.00 hour

@Temperature 60.8 °F
Full Load
Chesterton ARC 5 Paste grade Rapid Cure Abrasion Control
Description: ARC 5 is an advanced composite formulated for emergency repair and patching of metal components subject to light abrasive and corrosive conditions. It can be used to seal leaks and patc..
Cure Time 60.0 min

@Temperature 150 °C
1.00 hour

@Temperature 302 °F
minimum
Epoxy Technology EPO-TEK® MA-5 Optical Grade Epoxy
Material Description: A single component, B-stageable, optical grade epoxy for fiber optic assembly. It may be used for B-stage sealing of fiber cables into ferrules, or fiber optic feed through in..
Cure Time 60.0 - 360 min

@Temperature 80.0 - 110 °C
1.00 - 6.00 hour

@Temperature 176 - 230 °F
optional 3rd step
Abatron AboCast 8502-5/AboCure 8502-5 Colorless, Low-Exotherm Epoxy Casting Compound
AboCast 8502-5/AboCure 8502-5 is a rigid, colorless, low-exotherm epoxy casting compound for spherical masses up to 500 grams. It is a 2-component structural and dielectric liquid system with extrem..
Cure Time <= 60.0 min

@Temperature 150 °C
<= 1.00 hour

@Temperature 302 °F
ACC QLE 1050 QSI Quantum Silicones 30 Durometer Clear, Addition Cure, 1-part Elastomer for Coating
QLE 1050 is a 100% silicone solids elastomer designed for use as a conformal coating, but can also be used for cloth coating applications. Key Features: 100% solids Transparent, ideal for pigmentat..
Cure Time 60.0 - 120 min

@Temperature 93.3 °C
1.00 - 2.00 hour

@Temperature 200 °F
Master Bond EP21TP-2 Oil And Fuel Resistant Polysulfide Based Adhesive System
Master Bond Polymer Adhesive EP21TP-2 is a two component polysulfide/epoxy based adhesive/sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 1 to 1 mix r..
Cure Time 60.0 min

@Temperature 82.0 °C
1.00 hour

@Temperature 180 °F
Henkel Hysol EA 9323 Paste Adhesive System
Viscous, but pourable, liquid adhesive that yields tough, durable adhesive bonds over a wide temperature range.Application: Structural Repair
Cure Time 60.0 min

@Temperature 32.0 °C
1.00 hour

@Temperature 89.6 °F
Tack Free
Chesterton MRS 10 Metal Rebuilding System
Description: A reinforced composite for the repair and protection of metal surfaces. It is machinable with excellent compressive strength, chemical resistance It is non-sagging, non-shrinking and 10..
Cure Time 60.0 min

@Temperature 93.0 °C
1.00 hour

@Temperature 199 °F
Henkel Hysol EA 956 Paste Adhesive System
Very low viscosity, cures at room temperatureDesigned for wet lay-up repairApplications: Structural Repair Low Viscosity Wet Lay-Up
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