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Polymer Property : Cure Time = 1.00 hour Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 60.0 min @Temperature 23.8 °C |
1.00 hour @Temperature 74.8 °F |
and 6 hours at 65.5°C |
| Parker Chomerics CHO-SHIELD® 576 Platable Silver Epoxy Coating Description: CHO-SHIELD® 576 coating is a two component, silver filled, highly conductive epoxy paint designed to provide EMI shielding when applied to a dielectric plastic substrate. This coating .. |
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| Cure Time | 60.0 min @Temperature 121 °C |
1.00 hour @Temperature 250 °F |
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| Parker Chomerics CHO-SHIELD® 610 A/B Epoxy Conductive Coating Description: CHO-SHIELD® 610 A/B is a highly conductive, two-component silver-plated-copper filled epoxy coating for application to non-conductive plastic substrates, particularly those subject to .. |
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| Cure Time | 60.0 min @Temperature 82.2 °C |
1.00 hour @Temperature 180 °F |
Complete Cure Cycle |
| Northstar Polymers MPS-F08A Hand-Mixable Flexible Foam This foam formulation is designed to make molded flexible foam parts/sheets/dies/blocks by hand-mixing or machine casting by the meter dispensing equipment. The components are stable and liquid at .. |
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| Cure Time | 60.0 - 180 min @Temperature 23.0 °C |
1.00 - 3.00 hour @Temperature 73.4 °F |
M10 steel, working strength |
| Permabond HM162 Anaerobic Retainer Permabond® HM162 is a medium viscosity retaining compound that cures when confined between metal parts to form an extremely tough bond. It is best suited for cylindrical parts and where high temper.. |
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| Cure Time | 60.0 min @Temperature 23.0 °C |
1.00 hour @Temperature 73.4 °F |
Aluminum, handling strength |
| Permabond MH196 Anaerobic Gasketmaker Permabond® MH196 is an anaerobic material designed for making “formed in situ” gaskets between metal surfaces. It is capable of replacing a wide range of conventional gaskets, thereby offering po.. |
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| Cure Time | 60.0 - 180 min @Temperature 23.0 °C |
1.00 - 3.00 hour @Temperature 73.4 °F |
M10 steel, working strength |
| Permabond MH196 Anaerobic Gasketmaker Permabond® MH196 is an anaerobic material designed for making “formed in situ” gaskets between metal surfaces. It is capable of replacing a wide range of conventional gaskets, thereby offering po.. |
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| Cure Time | 60.0 - 180 min @Temperature 25.0 °C |
1.00 - 3.00 hour @Temperature 77.0 °F |
De-mold Time |
| Northstar Polymers SAI-1 Low Viscosity Variable Ratio Polyurethane Gel SAI-1 is custom formulated polyurethane gel material to yield very soft elastomer gel material from low viscosity components at room temperature. This material is variable mixing ratio so that the .. |
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| Cure Time | 60.0 min @Temperature 150 °C |
1.00 hour @Temperature 302 °F |
Post Cure |
| Shin-Etsu Silicones LIMSâ„¢ KEG2001-50A/B Elastomer KEG2001-50 is a very fast cure type liquid injection molding silicone. It is supplied as two components which are mixed in a 1:1 ratio to ensure easy and accurate blending. Its viscosity is low enou.. |
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| Cure Time | 60.0 min @Temperature 150 °C |
1.00 hour @Temperature 302 °F |
Post Cure |
| Shin-Etsu Silicones LIMSâ„¢ KE1950-20A/B Elastomer KE-1950-20 is a liquid injection molding silicone. It is supplied as two components which are mixed in a 1:1 ratio to ensure easy and accurate blending. It's viscosity is low enough to allow easy .. |
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| Cure Time | 60.0 - 90.0 min @Temperature 177 °C |
1.00 - 1.50 hour @Temperature 350 °F |
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| Master Bond EP17HT-LO One component epoxy system for bonding, sealing, coating and casting Product Description: Master Bond EP17HT-LO is a one component, heat cured epoxy system for bonding, sealing, coating and encapsulating. It features good physical properties, electrical insulation pr.. |
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| Cure Time | 60.0 min @Temperature 65.6 - 93.3 °C |
1.00 hour @Temperature 150 - 200 °F |
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| Master Bond EP51FL Toughened and Flexible Adhesive Compound Master Bond EP51FL is a two component epoxy system for high performance bonding sealing and coating. It combines superior toughness with user friendly handling properties, along with unusually fast .. |
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| Cure Time | 60.0 min @Temperature 100 °C |
1.00 hour @Temperature 212 °F |
|
| Tra-Con Supertherm 826M01 High Performance Diamond Epoxy Adhesive SUPERTHERM 826M01 is a one-part, smooth paste ULTRA HIGH THERMALLY CONDUCTIVE diamond filled epoxy adhesive recommended for semiconductor die-attach and other micro-electronic applications where the.. |
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| Cure Time | 60.0 - 240 min @Temperature 65.0 °C |
1.00 - 4.00 hour @Temperature 149 °F |
|
| Tra-Con Tra-Bond 216L01 Clear Low Viscosity Epoxy Adhesive TRA-BOND 216L01 is a clear, low viscosity epoxy adhesive system that contains no solvents, cures at room temperature, has excellent flowability and wetting characteristics, and adheres strongly to g.. |
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| Cure Time | 60.0 - 240 min @Temperature 65.0 °C |
1.00 - 4.00 hour @Temperature 149 °F |
|
| Tra-Con Tra-Cast F353 Optically Opaque Casting System TRA-CAST F353 is an optically opaque, low viscosity, two-part epoxy system recommended for molding, potting, embedding, encapsulating, sealing and casting applications involving fiber optic, optical.. |
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| Cure Time | 60.0 min @Temperature 125 °C |
1.00 hour @Temperature 257 °F |
|
| Tra-Con Tra-Duct 2979 Microelectronic Conductive Epoxy Adhesive TRA-DUCT 2979 is a fast curing one-part epoxy adhesive with superior electrical conductivity and bonding capability. It has been shown to retain these properties through hundreds of hours of rapid t.. |
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| Cure Time | 60.0 - 120 min @Temperature 93.3 °C |
1.00 - 2.00 hour @Temperature 200 °F |
|
| Master Bond EP21TDCSLO Two Component Silver Conductive Epoxy Adhesive Master Bond Polymer System EP21TDCS-LO is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rap.. |
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| Cure Time | 60.0 min @Temperature 120 °C |
1.00 hour @Temperature 248 °F |
|
| Hexcel® Redux® 840 One-part Foaming Epoxy Paste Adhesive Redux® 840 is a black one-part, foaming, epoxy paste adhesive that is thixotropic.Features: Provides a shear-carrying connection across any discontinuities in bonded sandwich panels; Maximum servic.. |
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| Cure Time | 60.0 min @Temperature 120 °C |
1.00 hour @Temperature 248 °F |
Minimum Bond Line |
| Epoxy Technology EPO-TEK® E4110-PFC Electrically Conductive Epoxy Product Description: EPO-TEK®E4110-PFC is a two-component, silver filled, electrically conductive adhesive designed for semiconductor IC packaging and general electronic assembly. It is a thixotr.. |
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| Cure Time | 60.0 min @Temperature 100 °C |
1.00 hour @Temperature 212 °F |
|
| Epoxyset Epoxibond EB-348 Low Expansion Epoxy Adhesive EB-348 is a highly filled, extremely low expansion, epoxy adhesive. This low out-gassing adhesive exhibits excellent wettability without preheating metal bonding surfaces and has a good dimensional .. |
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| Cure Time | 60.0 min @Temperature 155 °C |
1.00 hour @Temperature 311 °F |
|
| Dow BETAMATE™ 1496 V Epoxy BETAMATE™ 1496 V is a one component, epoxy based adhesive especially developed for the body shop. The product has the following properties: Good rheology performance (Wash-out resistant, excelle.. |
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| Cure Time | 60.0 - 240 min @Temperature 120 - 160 °C |
1.00 - 4.00 hour @Temperature 248 - 320 °F |
optional |
| Abatron AboCast 8103-24 High-Performance Dielectric Epoxy AboCast 8103-24 is a dielectric in/outdoor epoxy system with superior arc-track resistance, high voltage and heat resistance, low ash and ion content, and it is chlorine-free. This system has an exc.. |
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| Cure Time | 60.0 min @Temperature 125 °C |
1.00 hour @Temperature 257 °F |
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| Atom Adhesives AA-DUCT 2979 Epoxy Adhesive AA-DUCT 2979 is a fast curing one part epoxy adhesive with superior electrical conductivity and bonding capability. AA-DUCT 2979 has been shown to retain their properties through hundreds of hours o.. |
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| Cure Time | 60.0 min @Temperature 150 °C |
1.00 hour @Temperature 302 °F |
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| Atom Adhesives AA-DUCT N02 Epoxy Adhesive AA-DUCT N02 is a single component, heat curing, conductive epoxy polymer that was designed for ease in handling. This high performance conductive polymer cures quickly at elevated temperatures makin.. |
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| Cure Time | 60.0 min @Temperature 260 °C |
1.00 hour @Temperature 500 °F |
Step 2 |
| Aremco HiE-Coat™ 840-CM High Emissivity Coating, Inorganic-Ceramic Filled Ceramic-based, black-pigmented coating for dense refractories to 2500°F (1371°C) and stainless steel to 900°F (482°C) |
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| Cure Time | 60.0 - 240 min @Temperature 120 - 160 °C |
1.00 - 4.00 hour @Temperature 248 - 320 °F |
optional |
| Abatron AboCast 8103-25 High-Performance Dielectric Epoxy AboCast 8103-25 is a dielectric in/outdoor epoxy system with superior arc-track resistance, high voltage and heat resistance, low ash and ion content, and it is chlorine-free. This system combines o.. |
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| Cure Time | 60.0 - 240 min @Temperature 160 - 180 °C |
1.00 - 4.00 hour @Temperature 320 - 356 °F |
optional |
| Abatron AboCast 8501-6 One-Component Epoxy AboCast 8501-6 is a clear, high-temperature one-component epoxy system for very high-temperature uses. It offers the highest heat resistance of the clear resins. Suggested Uses: Casting; Potting; E.. |
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| Cure Time | 60.0 min @Temperature 26.0 °C |
1.00 hour @Temperature 78.8 °F |
Light Load |
| Chesterton ARC NVE VC Vinyl Ester Sealer Description: ARC NVE VC (Veil Coat) is a two-component, modified epoxy novolac vinyl ester sealer coat formulated for application by brush, roller or spray at 0.15-0.25 mm (0.07-0.010”) wet film th.. |
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| Cure Time | 60.0 min @Temperature 23.0 °C |
1.00 hour @Temperature 73.4 °F |
M10 steel, working strength |
| Permabond A113 Anaerobic Threadlocker Designed for the locking and sealing of metal parts, Permabond® A113 is ideally suited for use on components that need to be dismantled for maintenance. Giving vibration resistance it can be used .. |
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