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Polymer Property : Cure Time = 1.00 hour Product List

Processing Properties

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Processing Properties Metric English Comments
Cure Time 60.0 min

@Temperature 23.8 °C
1.00 hour

@Temperature 74.8 °F
and 6 hours at 65.5°C
Parker Chomerics CHO-SHIELD® 576 Platable Silver Epoxy Coating
Description: CHO-SHIELD® 576 coating is a two component, silver filled, highly conductive epoxy paint designed to provide EMI shielding when applied to a dielectric plastic substrate. This coating ..
Cure Time 60.0 min

@Temperature 121 °C
1.00 hour

@Temperature 250 °F
Parker Chomerics CHO-SHIELD® 610 A/B Epoxy Conductive Coating
Description: CHO-SHIELD® 610 A/B is a highly conductive, two-component silver-plated-copper filled epoxy coating for application to non-conductive plastic substrates, particularly those subject to ..
Cure Time 60.0 min

@Temperature 82.2 °C
1.00 hour

@Temperature 180 °F
Complete Cure Cycle
Northstar Polymers MPS-F08A Hand-Mixable Flexible Foam
This foam formulation is designed to make molded flexible foam parts/sheets/dies/blocks by hand-mixing or machine casting by the meter dispensing equipment. The components are stable and liquid at ..
Cure Time 60.0 - 180 min

@Temperature 23.0 °C
1.00 - 3.00 hour

@Temperature 73.4 °F
M10 steel, working strength
Permabond HM162 Anaerobic Retainer
Permabond® HM162 is a medium viscosity retaining compound that cures when confined between metal parts to form an extremely tough bond. It is best suited for cylindrical parts and where high temper..
Cure Time 60.0 min

@Temperature 23.0 °C
1.00 hour

@Temperature 73.4 °F
Aluminum, handling strength
Permabond MH196 Anaerobic Gasketmaker
Permabond® MH196 is an anaerobic material designed for making “formed in situ” gaskets between metal surfaces. It is capable of replacing a wide range of conventional gaskets, thereby offering po..
Cure Time 60.0 - 180 min

@Temperature 23.0 °C
1.00 - 3.00 hour

@Temperature 73.4 °F
M10 steel, working strength
Permabond MH196 Anaerobic Gasketmaker
Permabond® MH196 is an anaerobic material designed for making “formed in situ” gaskets between metal surfaces. It is capable of replacing a wide range of conventional gaskets, thereby offering po..
Cure Time 60.0 - 180 min

@Temperature 25.0 °C
1.00 - 3.00 hour

@Temperature 77.0 °F
De-mold Time
Northstar Polymers SAI-1 Low Viscosity Variable Ratio Polyurethane Gel
SAI-1 is custom formulated polyurethane gel material to yield very soft elastomer gel material from low viscosity components at room temperature. This material is variable mixing ratio so that the ..
Cure Time 60.0 min

@Temperature 150 °C
1.00 hour

@Temperature 302 °F
Post Cure
Shin-Etsu Silicones LIMSâ„¢ KEG2001-50A/B Elastomer
KEG2001-50 is a very fast cure type liquid injection molding silicone. It is supplied as two components which are mixed in a 1:1 ratio to ensure easy and accurate blending. Its viscosity is low enou..
Cure Time 60.0 min

@Temperature 150 °C
1.00 hour

@Temperature 302 °F
Post Cure
Shin-Etsu Silicones LIMSâ„¢ KE1950-20A/B Elastomer
KE-1950-20 is a liquid injection molding silicone. It is supplied as two components which are mixed in a 1:1 ratio to ensure easy and accurate blending. It's viscosity is low enough to allow easy ..
Cure Time 60.0 - 90.0 min

@Temperature 177 °C
1.00 - 1.50 hour

@Temperature 350 °F
Master Bond EP17HT-LO One component epoxy system for bonding, sealing, coating and casting
Product Description: Master Bond EP17HT-LO is a one component, heat cured epoxy system for bonding, sealing, coating and encapsulating. It features good physical properties, electrical insulation pr..
Cure Time 60.0 min

@Temperature 65.6 - 93.3 °C
1.00 hour

@Temperature 150 - 200 °F
Master Bond EP51FL Toughened and Flexible Adhesive Compound
Master Bond EP51FL is a two component epoxy system for high performance bonding sealing and coating. It combines superior toughness with user friendly handling properties, along with unusually fast ..
Cure Time 60.0 min

@Temperature 100 °C
1.00 hour

@Temperature 212 °F
Tra-Con Supertherm 826M01 High Performance Diamond Epoxy Adhesive
SUPERTHERM 826M01 is a one-part, smooth paste ULTRA HIGH THERMALLY CONDUCTIVE diamond filled epoxy adhesive recommended for semiconductor die-attach and other micro-electronic applications where the..
Cure Time 60.0 - 240 min

@Temperature 65.0 °C
1.00 - 4.00 hour

@Temperature 149 °F
Tra-Con Tra-Bond 216L01 Clear Low Viscosity Epoxy Adhesive
TRA-BOND 216L01 is a clear, low viscosity epoxy adhesive system that contains no solvents, cures at room temperature, has excellent flowability and wetting characteristics, and adheres strongly to g..
Cure Time 60.0 - 240 min

@Temperature 65.0 °C
1.00 - 4.00 hour

@Temperature 149 °F
Tra-Con Tra-Cast F353 Optically Opaque Casting System
TRA-CAST F353 is an optically opaque, low viscosity, two-part epoxy system recommended for molding, potting, embedding, encapsulating, sealing and casting applications involving fiber optic, optical..
Cure Time 60.0 min

@Temperature 125 °C
1.00 hour

@Temperature 257 °F
Tra-Con Tra-Duct 2979 Microelectronic Conductive Epoxy Adhesive
TRA-DUCT 2979 is a fast curing one-part epoxy adhesive with superior electrical conductivity and bonding capability. It has been shown to retain these properties through hundreds of hours of rapid t..
Cure Time 60.0 - 120 min

@Temperature 93.3 °C
1.00 - 2.00 hour

@Temperature 200 °F
Master Bond EP21TDCSLO Two Component Silver Conductive Epoxy Adhesive
Master Bond Polymer System EP21TDCS-LO is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rap..
Cure Time 60.0 min

@Temperature 120 °C
1.00 hour

@Temperature 248 °F
Hexcel® Redux® 840 One-part Foaming Epoxy Paste Adhesive
Redux® 840 is a black one-part, foaming, epoxy paste adhesive that is thixotropic.Features: Provides a shear-carrying connection across any discontinuities in bonded sandwich panels; Maximum servic..
Cure Time 60.0 min

@Temperature 120 °C
1.00 hour

@Temperature 248 °F
Minimum Bond Line
Epoxy Technology EPO-TEK® E4110-PFC Electrically Conductive Epoxy
Product Description: EPO-TEK®E4110-PFC is a two-component, silver filled, electrically conductive adhesive designed for semiconductor IC packaging and general electronic assembly. It is a thixotr..
Cure Time 60.0 min

@Temperature 100 °C
1.00 hour

@Temperature 212 °F
Epoxyset Epoxibond EB-348 Low Expansion Epoxy Adhesive
EB-348 is a highly filled, extremely low expansion, epoxy adhesive. This low out-gassing adhesive exhibits excellent wettability without preheating metal bonding surfaces and has a good dimensional ..
Cure Time 60.0 min

@Temperature 155 °C
1.00 hour

@Temperature 311 °F
Dow BETAMATE™ 1496 V Epoxy
BETAMATE™ 1496 V is a one component, epoxy based adhesive especially developed for the body shop. The product has the following properties: Good rheology performance (Wash-out resistant, excelle..
Cure Time 60.0 - 240 min

@Temperature 120 - 160 °C
1.00 - 4.00 hour

@Temperature 248 - 320 °F
optional
Abatron AboCast 8103-24 High-Performance Dielectric Epoxy
AboCast 8103-24 is a dielectric in/outdoor epoxy system with superior arc-track resistance, high voltage and heat resistance, low ash and ion content, and it is chlorine-free. This system has an exc..
Cure Time 60.0 min

@Temperature 125 °C
1.00 hour

@Temperature 257 °F
Atom Adhesives AA-DUCT 2979 Epoxy Adhesive
AA-DUCT 2979 is a fast curing one part epoxy adhesive with superior electrical conductivity and bonding capability. AA-DUCT 2979 has been shown to retain their properties through hundreds of hours o..
Cure Time 60.0 min

@Temperature 150 °C
1.00 hour

@Temperature 302 °F
Atom Adhesives AA-DUCT N02 Epoxy Adhesive
AA-DUCT N02 is a single component, heat curing, conductive epoxy polymer that was designed for ease in handling. This high performance conductive polymer cures quickly at elevated temperatures makin..
Cure Time 60.0 min

@Temperature 260 °C
1.00 hour

@Temperature 500 °F
Step 2
Aremco HiE-Coat™ 840-CM High Emissivity Coating, Inorganic-Ceramic Filled
Ceramic-based, black-pigmented coating for dense refractories to 2500°F (1371°C) and stainless steel to 900°F (482°C)
Cure Time 60.0 - 240 min

@Temperature 120 - 160 °C
1.00 - 4.00 hour

@Temperature 248 - 320 °F
optional
Abatron AboCast 8103-25 High-Performance Dielectric Epoxy
AboCast 8103-25 is a dielectric in/outdoor epoxy system with superior arc-track resistance, high voltage and heat resistance, low ash and ion content, and it is chlorine-free. This system combines o..
Cure Time 60.0 - 240 min

@Temperature 160 - 180 °C
1.00 - 4.00 hour

@Temperature 320 - 356 °F
optional
Abatron AboCast 8501-6 One-Component Epoxy
AboCast 8501-6 is a clear, high-temperature one-component epoxy system for very high-temperature uses. It offers the highest heat resistance of the clear resins. Suggested Uses: Casting; Potting; E..
Cure Time 60.0 min

@Temperature 26.0 °C
1.00 hour

@Temperature 78.8 °F
Light Load
Chesterton ARC NVE VC Vinyl Ester Sealer
Description: ARC NVE VC (Veil Coat) is a two-component, modified epoxy novolac vinyl ester sealer coat formulated for application by brush, roller or spray at 0.15-0.25 mm (0.07-0.010”) wet film th..
Cure Time 60.0 min

@Temperature 23.0 °C
1.00 hour

@Temperature 73.4 °F
M10 steel, working strength
Permabond A113 Anaerobic Threadlocker
Designed for the locking and sealing of metal parts, Permabond® A113 is ideally suited for use on components that need to be dismantled for maintenance. Giving vibration resistance it can be used ..
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