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Polymer Property : Cure Time = 1.00 hour Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 60.0 min @Temperature 60.0 °C |
1.00 hour @Temperature 140 °F |
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| Parker Chomerics THERM-A-FORM T647 Cure-in-Place Potting and Underfill Material Description: THERM-A-FORM™ thermally conductive silicone elastomer products are dispensable form-in-place compounds designed for heat transfer without excessive compressive force in electronics co.. |
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| Cure Time | 60.0 min @Temperature 24.0 °C |
1.00 hour @Temperature 75.2 °F |
and 1 hour at 65.5°C, followed by 1 hour at 121°C |
| Parker Chomerics CHO-SHIELD® 579 Low VOC Silver Epoxy Coating Description: CHO-SHIELD® 579 coating is a two component, silver-filled, highly conductive epoxy paint designed to provide EMI shielding when applied to a dielectric substrate. This coating was spec.. |
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| Cure Time | 60.0 - 180 min @Temperature 25.0 °C |
1.00 - 3.00 hour @Temperature 77.0 °F |
De-mold Time |
| Northstar Polymers SAI-1 Low Viscosity Variable Ratio Polyurethane Gel SAI-1 is custom formulated polyurethane gel material to yield very soft elastomer gel material from low viscosity components at room temperature. This material is variable mixing ratio so that the .. |
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| Cure Time | 60.0 min @Temperature 23.0 °C |
1.00 hour @Temperature 73.4 °F |
Zinc, handling strength |
| Permabond HH040 Pure NSF 61 Approved Anaerobic Retainer Permabond® HH040 PURE is a single component liquid that cures only when in contact with metal parts and oxygen is excluded. The liquid adhesive fills the “air space” between parts and upon cure u.. |
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| Cure Time | 60.0 min @Temperature 150 °C |
1.00 hour @Temperature 302 °F |
Post Cure |
| Shin-Etsu Silicones LIMSâ„¢ KEG2002-50A/B Elastomer Information Provided by Shin-Etsu Silicones of America, Inc. |
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| Cure Time | 60.0 min @Temperature 150 °C |
1.00 hour @Temperature 302 °F |
Post Cure |
| Shin-Etsu Silicones LIMSâ„¢ KE1950-70A/B Elastomer KE-1950-70 is a liquid injection molding silicone. It is supplied as two components which are mixed in a 1:1 ratio to ensure easy and accurate blending. It's viscosity is low enough to allow easy .. |
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| Cure Time | 60.0 - 120 min @Temperature 93.3 °C |
1.00 - 2.00 hour @Temperature 200 °F |
|
| Master Bond EP21TDCF-3 Two Component, Higher Viscosity Epoxy System Product Description: Master Bond EP21TDCF-3 is a two component epoxy for high performance bonding and sealing. It is formulated to cure rapidly at room temperature or faster at elevated temperatures.. |
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| Cure Time | 60.0 - 120 min @Temperature 65.0 °C |
1.00 - 2.00 hour @Temperature 149 °F |
|
| Tra-Con Tra-Bond 2119 Low Viscosity Glass Laminating Adhesive TRA-BOND 2119 is a crystal clear adhesive specifically designed for bonding glass to glass and glass to plastics. It also yields a high lap shear strength to metals and ceramics. This system cures t.. |
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| Cure Time | 60.0 min @Temperature 65.0 °C |
1.00 hour @Temperature 149 °F |
|
| Tra-Con Tra-Bond 526H02 Information provided by Tra-Con Inc. |
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| Cure Time | 60.0 - 240 min @Temperature 65.0 °C |
1.00 - 4.00 hour @Temperature 149 °F |
|
| Tra-Con Tra-Bond FDA15 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-15 is a low viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Adminis.. |
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| Cure Time | 60.0 - 240 min @Temperature 65.0 °C |
1.00 - 4.00 hour @Temperature 149 °F |
|
| Tra-Con Tra-Bond FDA22BK01 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-22BK01 is a high viscosity epoxy resin system specifically developed for bonding and coating applications in accordance. This two-part black adhesive is easily mixed, used and cured at .. |
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| Cure Time | 60.0 - 120 min @Temperature 65.0 °C |
1.00 - 2.00 hour @Temperature 149 °F |
|
| Trelleborg Emerson & Cuming Eccobond® 43 Heat Cure Catalyst Emerson & Cuming 43 Eccobond® Heat Cure CatalystRoom temperature gelling version of 28. Excellent for low stress potting and bonding. Will post cure in actual use. Combines the benefits of both 9 a.. |
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| Cure Time | 60.0 min @Temperature 65.0 °C |
1.00 hour @Temperature 149 °F |
|
| Trelleborg Emerson & Cuming Eccobond® 83C Two-Component Silver Filled Electrically Conductive Epoxy Adhesive Emerson & Cuming 83C Eccobond® Two-Component Silver Filled Electrically Conductive Epoxy AdhesiveTwo component, silver filled, electrically conductive, epoxy adhesive. Smooth, creamy consistency. G.. |
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| Cure Time | 60.0 - 120 min @Temperature 93.3 °C |
1.00 - 2.00 hour @Temperature 200 °F |
|
| Master Bond EP35 High Temperature Resistant Two Component Epoxy System Master Bond Polymer Adhesive EP35 is a unique, room temperature curing, two component epoxy adhesive for high temperature bonding applications. Master Bond Polymer Adhesive EP35 produces high stren.. |
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| Cure Time | 60.0 min @Temperature 75.0 °C |
1.00 hour @Temperature 167 °F |
|
| Tra-Con Tra-Bond Ablebond 868-7U Thixotropic Epoxy Adhesive Ablebond 868-7UNF is the unfilled version of 868-7, a nonsagging, flexible epoxy adhesive. Information provided by Tra-Con Inc. |
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| Cure Time | 60.0 min @Temperature 120 °C |
1.00 hour @Temperature 248 °F |
|
| Hexcel® Redux® 840 One-part Foaming Epoxy Paste Adhesive Redux® 840 is a black one-part, foaming, epoxy paste adhesive that is thixotropic.Features: Provides a shear-carrying connection across any discontinuities in bonded sandwich panels; Maximum servic.. |
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| Cure Time | 60.0 min @Temperature 32.0 °C |
1.00 hour @Temperature 89.6 °F |
Tack Free |
| Chesterton ARC 10 Paste grade machinable composite Description: A reinforced composite for the repair and protection of metal surfaces. It is machinable with excellent compressive strength, chemical resistance and corrosion resistance. It is non-sag.. |
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| Cure Time | 60.0 min @Temperature 26.0 °C |
1.00 hour @Temperature 78.8 °F |
Light Load |
| Chesterton ARC NVE SYSTEM Vinyl Ester Lining Description: ARC NVE is a high performance, quartz reinforced, three-component, modified novolac vinyl ester lining capable of being applied to horizontal and vertical surfaces. The NVE system kit i.. |
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| Cure Time | 60.0 min @Temperature 32.0 °C |
1.00 hour @Temperature 89.6 °F |
Tack Free |
| Chesterton MRS SD4i Metal Rebuilding System An advanced ceramic composite for resurfacing and protection of metal surfaces in immersion service. It is normally applied in a thickness range of 250-370 microns (10 – 15 mils) per coat. Non-shri.. |
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| Cure Time | 60.0 min @Temperature 70.0 °C |
1.00 hour @Temperature 158 °F |
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| Epoxy Technology EPO-TEK® 320NC-2 Optically Opaque Epoxy Material Description: A two component, black colored and optically opaque epoxy designed for optical, medical, and opto-electronic packaging of semiconductor devices and components. It is a modific.. |
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| Cure Time | 60.0 min @Temperature 60.0 °C |
1.00 hour @Temperature 140 °F |
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| Epoxy Technology EPO-TEK® 431 Copper Filled Epoxy A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for interconnecting, grounding and EMI RF shielding... |
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| Cure Time | 60.0 min @Temperature 125 °C |
1.00 hour @Temperature 257 °F |
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| Atom Adhesives AA-DUCT 2924 Epoxy Adhesive AA-DUCT 2924 is a two part electrically conductive composition developed for low shrinkage; low resistivity bonding applications where good electrical and physical properties over a wide temperature.. |
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| Cure Time | 60.0 - 240 min @Temperature 160 - 180 °C |
1.00 - 4.00 hour @Temperature 320 - 356 °F |
optional |
| Abatron AboCast 8504-1 One-Component Epoxy AboCast 8504-1 is a clear, all-purpose one-component epoxy system, with an optimum balance of properties for most casting, adhesive, impregnation, and coating applications. |
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| Cure Time | 60.0 min @Temperature 25.0 °C |
1.00 hour @Temperature 77.0 °F |
|
| Atom Adhesives AA-BOND 2156 Epoxy Adhesive AA-BOND 2156 is a thixotropic (smooth paste) thermally conductive epoxy system. It is used for staking heat sinks, transistors, diodes, resistor, integrated circuits and other heat-sensitive compone.. |
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| Cure Time | 60.0 min @Temperature 204 °C |
1.00 hour @Temperature 400 °F |
|
| Aremco Pyro-Putty™ 950 High Temperature Ceramic-Metallic Putty, Ceramic Fiber Filled Ceramic Fiber-Filled, Organic Caulk.For Sealing High Temperature Joints to 950°F.Cures Into a Tough, Pliable, Inert Material. |
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| Cure Time | 60.0 - 240 min @Temperature 65.0 °C |
1.00 - 4.00 hour @Temperature 149 °F |
|
| Tra-Con Tra-Bond 516H01 Low Viscosity Room Temperature Cure Adhesive TRA-BOND 516H01 is a room temperature curing, low viscosity adhesive formulated for terminating ALL TYPES of fiber optic connectors, including Pre-Mixed and Frozen applications. It has also been use.. |
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| Cure Time | 60.0 min @Temperature 125 °C |
1.00 hour @Temperature 257 °F |
|
| Epoxyset Epoxibond EB-177 Unfilled Epoxy Adhesive A two-component, unfilled, high temperature epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.Information provided by Epoxyset Inc... |
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| Cure Time | 60.0 - 180 min @Temperature 80.0 - 110 °C |
1.00 - 3.00 hour @Temperature 176 - 230 °F |
|
| Abatron AboCast/AboCure 7606-1 Epoxy AboCast 7606-1 is a transparent, light amber resin with a weight of 9.5 lbs/gallon and a viscosity of 2100 cps approx. @ 25°C. AboCure 7606-1 is a transparent, light amber converter with a weight o.. |
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| Cure Time | 60.0 min @Temperature 23.0 °C |
1.00 hour @Temperature 73.4 °F |
Zinc, handling strength |
| Permabond A130 Anaerobic Threadlocker Designed for the locking and sealing of metal parts, Permabond® A130 is ideally suited for use on components that need to be dismantled for maintenance. Giving vibration resistance it can be used t.. |
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| Cure Time | 60.0 min @Temperature 66.0 °C |
1.00 hour @Temperature 151 °F |
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| Henkel Hysol EA 9396 Paste Adhesive System Two-part, low viscosity, unfilled version of Hysol EA 9394. Qualified to BMS 8-301.Applications: Structural Repair Low Viscosity Wet Lay-Up Composite Bonding |
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