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Polymer Property : Cure Time = 1.00 hour Product List

Processing Properties

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Processing Properties Metric English Comments
Cure Time 60.0 min

@Temperature 60.0 °C
1.00 hour

@Temperature 140 °F
Parker Chomerics THERM-A-FORM T647 Cure-in-Place Potting and Underfill Material
Description: THERM-A-FORM™ thermally conductive silicone elastomer products are dispensable form-in-place compounds designed for heat transfer without excessive compressive force in electronics co..
Cure Time 60.0 min

@Temperature 24.0 °C
1.00 hour

@Temperature 75.2 °F
and 1 hour at 65.5°C, followed by 1 hour at 121°C
Parker Chomerics CHO-SHIELD® 579 Low VOC Silver Epoxy Coating
Description: CHO-SHIELD® 579 coating is a two component, silver-filled, highly conductive epoxy paint designed to provide EMI shielding when applied to a dielectric substrate. This coating was spec..
Cure Time 60.0 - 180 min

@Temperature 25.0 °C
1.00 - 3.00 hour

@Temperature 77.0 °F
De-mold Time
Northstar Polymers SAI-1 Low Viscosity Variable Ratio Polyurethane Gel
SAI-1 is custom formulated polyurethane gel material to yield very soft elastomer gel material from low viscosity components at room temperature. This material is variable mixing ratio so that the ..
Cure Time 60.0 min

@Temperature 23.0 °C
1.00 hour

@Temperature 73.4 °F
Zinc, handling strength
Permabond HH040 Pure NSF 61 Approved Anaerobic Retainer
Permabond® HH040 PURE is a single component liquid that cures only when in contact with metal parts and oxygen is excluded. The liquid adhesive fills the “air space” between parts and upon cure u..
Cure Time 60.0 min

@Temperature 150 °C
1.00 hour

@Temperature 302 °F
Post Cure
Shin-Etsu Silicones LIMSâ„¢ KEG2002-50A/B Elastomer
Information Provided by Shin-Etsu Silicones of America, Inc.
Cure Time 60.0 min

@Temperature 150 °C
1.00 hour

@Temperature 302 °F
Post Cure
Shin-Etsu Silicones LIMSâ„¢ KE1950-70A/B Elastomer
KE-1950-70 is a liquid injection molding silicone. It is supplied as two components which are mixed in a 1:1 ratio to ensure easy and accurate blending. It's viscosity is low enough to allow easy ..
Cure Time 60.0 - 120 min

@Temperature 93.3 °C
1.00 - 2.00 hour

@Temperature 200 °F
Master Bond EP21TDCF-3 Two Component, Higher Viscosity Epoxy System
Product Description: Master Bond EP21TDCF-3 is a two component epoxy for high performance bonding and sealing. It is formulated to cure rapidly at room temperature or faster at elevated temperatures..
Cure Time 60.0 - 120 min

@Temperature 65.0 °C
1.00 - 2.00 hour

@Temperature 149 °F
Tra-Con Tra-Bond 2119 Low Viscosity Glass Laminating Adhesive
TRA-BOND 2119 is a crystal clear adhesive specifically designed for bonding glass to glass and glass to plastics. It also yields a high lap shear strength to metals and ceramics. This system cures t..
Cure Time 60.0 min

@Temperature 65.0 °C
1.00 hour

@Temperature 149 °F
Tra-Con Tra-Bond 526H02
Information provided by Tra-Con Inc.
Cure Time 60.0 - 240 min

@Temperature 65.0 °C
1.00 - 4.00 hour

@Temperature 149 °F
Tra-Con Tra-Bond FDA15 Food and Drug Application Epoxy Adhesive
TRA-BOND FDA-15 is a low viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Adminis..
Cure Time 60.0 - 240 min

@Temperature 65.0 °C
1.00 - 4.00 hour

@Temperature 149 °F
Tra-Con Tra-Bond FDA22BK01 Food and Drug Application Epoxy Adhesive
TRA-BOND FDA-22BK01 is a high viscosity epoxy resin system specifically developed for bonding and coating applications in accordance. This two-part black adhesive is easily mixed, used and cured at ..
Cure Time 60.0 - 120 min

@Temperature 65.0 °C
1.00 - 2.00 hour

@Temperature 149 °F
Trelleborg Emerson & Cuming Eccobond® 43 Heat Cure Catalyst
Emerson & Cuming 43 Eccobond® Heat Cure CatalystRoom temperature gelling version of 28. Excellent for low stress potting and bonding. Will post cure in actual use. Combines the benefits of both 9 a..
Cure Time 60.0 min

@Temperature 65.0 °C
1.00 hour

@Temperature 149 °F
Trelleborg Emerson & Cuming Eccobond® 83C Two-Component Silver Filled Electrically Conductive Epoxy Adhesive
Emerson & Cuming 83C Eccobond® Two-Component Silver Filled Electrically Conductive Epoxy AdhesiveTwo component, silver filled, electrically conductive, epoxy adhesive. Smooth, creamy consistency. G..
Cure Time 60.0 - 120 min

@Temperature 93.3 °C
1.00 - 2.00 hour

@Temperature 200 °F
Master Bond EP35 High Temperature Resistant Two Component Epoxy System
Master Bond Polymer Adhesive EP35 is a unique, room temperature curing, two component epoxy adhesive for high temperature bonding applications. Master Bond Polymer Adhesive EP35 produces high stren..
Cure Time 60.0 min

@Temperature 75.0 °C
1.00 hour

@Temperature 167 °F
Tra-Con Tra-Bond Ablebond 868-7U Thixotropic Epoxy Adhesive
Ablebond 868-7UNF is the unfilled version of 868-7, a nonsagging, flexible epoxy adhesive. Information provided by Tra-Con Inc.
Cure Time 60.0 min

@Temperature 120 °C
1.00 hour

@Temperature 248 °F
Hexcel® Redux® 840 One-part Foaming Epoxy Paste Adhesive
Redux® 840 is a black one-part, foaming, epoxy paste adhesive that is thixotropic.Features: Provides a shear-carrying connection across any discontinuities in bonded sandwich panels; Maximum servic..
Cure Time 60.0 min

@Temperature 32.0 °C
1.00 hour

@Temperature 89.6 °F
Tack Free
Chesterton ARC 10 Paste grade machinable composite
Description: A reinforced composite for the repair and protection of metal surfaces. It is machinable with excellent compressive strength, chemical resistance and corrosion resistance. It is non-sag..
Cure Time 60.0 min

@Temperature 26.0 °C
1.00 hour

@Temperature 78.8 °F
Light Load
Chesterton ARC NVE SYSTEM Vinyl Ester Lining
Description: ARC NVE is a high performance, quartz reinforced, three-component, modified novolac vinyl ester lining capable of being applied to horizontal and vertical surfaces. The NVE system kit i..
Cure Time 60.0 min

@Temperature 32.0 °C
1.00 hour

@Temperature 89.6 °F
Tack Free
Chesterton MRS SD4i Metal Rebuilding System
An advanced ceramic composite for resurfacing and protection of metal surfaces in immersion service. It is normally applied in a thickness range of 250-370 microns (10 – 15 mils) per coat. Non-shri..
Cure Time 60.0 min

@Temperature 70.0 °C
1.00 hour

@Temperature 158 °F
Epoxy Technology EPO-TEK® 320NC-2 Optically Opaque Epoxy
Material Description: A two component, black colored and optically opaque epoxy designed for optical, medical, and opto-electronic packaging of semiconductor devices and components. It is a modific..
Cure Time 60.0 min

@Temperature 60.0 °C
1.00 hour

@Temperature 140 °F
Epoxy Technology EPO-TEK® 431 Copper Filled Epoxy
A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for interconnecting, grounding and EMI RF shielding...
Cure Time 60.0 min

@Temperature 125 °C
1.00 hour

@Temperature 257 °F
Atom Adhesives AA-DUCT 2924 Epoxy Adhesive
AA-DUCT 2924 is a two part electrically conductive composition developed for low shrinkage; low resistivity bonding applications where good electrical and physical properties over a wide temperature..
Cure Time 60.0 - 240 min

@Temperature 160 - 180 °C
1.00 - 4.00 hour

@Temperature 320 - 356 °F
optional
Abatron AboCast 8504-1 One-Component Epoxy
AboCast 8504-1 is a clear, all-purpose one-component epoxy system, with an optimum balance of properties for most casting, adhesive, impregnation, and coating applications.
Cure Time 60.0 min

@Temperature 25.0 °C
1.00 hour

@Temperature 77.0 °F
Atom Adhesives AA-BOND 2156 Epoxy Adhesive
AA-BOND 2156 is a thixotropic (smooth paste) thermally conductive epoxy system. It is used for staking heat sinks, transistors, diodes, resistor, integrated circuits and other heat-sensitive compone..
Cure Time 60.0 min

@Temperature 204 °C
1.00 hour

@Temperature 400 °F
Aremco Pyro-Putty™ 950 High Temperature Ceramic-Metallic Putty, Ceramic Fiber Filled
Ceramic Fiber-Filled, Organic Caulk.For Sealing High Temperature Joints to 950°F.Cures Into a Tough, Pliable, Inert Material.
Cure Time 60.0 - 240 min

@Temperature 65.0 °C
1.00 - 4.00 hour

@Temperature 149 °F
Tra-Con Tra-Bond 516H01 Low Viscosity Room Temperature Cure Adhesive
TRA-BOND 516H01 is a room temperature curing, low viscosity adhesive formulated for terminating ALL TYPES of fiber optic connectors, including Pre-Mixed and Frozen applications. It has also been use..
Cure Time 60.0 min

@Temperature 125 °C
1.00 hour

@Temperature 257 °F
Epoxyset Epoxibond EB-177 Unfilled Epoxy Adhesive
A two-component, unfilled, high temperature epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.Information provided by Epoxyset Inc...
Cure Time 60.0 - 180 min

@Temperature 80.0 - 110 °C
1.00 - 3.00 hour

@Temperature 176 - 230 °F
Abatron AboCast/AboCure 7606-1 Epoxy
AboCast 7606-1 is a transparent, light amber resin with a weight of 9.5 lbs/gallon and a viscosity of 2100 cps approx. @ 25°C. AboCure 7606-1 is a transparent, light amber converter with a weight o..
Cure Time 60.0 min

@Temperature 23.0 °C
1.00 hour

@Temperature 73.4 °F
Zinc, handling strength
Permabond A130 Anaerobic Threadlocker
Designed for the locking and sealing of metal parts, Permabond® A130 is ideally suited for use on components that need to be dismantled for maintenance. Giving vibration resistance it can be used t..
Cure Time 60.0 min

@Temperature 66.0 °C
1.00 hour

@Temperature 151 °F
Henkel Hysol EA 9396 Paste Adhesive System
Two-part, low viscosity, unfilled version of Hysol EA 9394. Qualified to BMS 8-301.Applications: Structural Repair Low Viscosity Wet Lay-Up Composite Bonding
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