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Polymer Property : Thermal Conductivity = 1.60 W/m-K Product List

Thermal Properties

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Thermal Properties Metric English Comments
Thermal Conductivity 1.60 W/m-K
11.1 BTU-in/hr-ft²-°F
Hot Disk
Premix Thermoplastics PRETHERM TPE 1050 Thermoplastic Elastomer, Boron Nitride / SEBS compound
PRETHERM TPE 1050 is a thermoplastic elastomer based highly thermally conductive compound intended primarily for heat dissipation. It is used as gap filler between processor and heat sink or co-mold..
Thermal Conductivity 1.60 W/m-K
11.1 BTU-in/hr-ft²-°F
Longitudinal
LATI Laticonther 75 CPG/650 PBT, Glass Fiber Reinforced
High thermal conductivity product based on Polybutylene Terephthalate (PBT). Special filler. Glass fibers. Availability: Africa & Middle East; Asia Pacific; Europe; Latin America; North AmericaInfor..
Thermal Conductivity 1.60 W/m-K

@Temperature 100 °C
11.1 BTU-in/hr-ft²-°F

@Temperature 212 °F
Schott Dark ROBAX® Glass Ceramic
Dark ROBAX® is an infra-red transparent glass-ceramic having virtually zero thermal expansion and sufficient mechanical resistance required for all standard applications. It is produced in rolle..
Thermal Conductivity 1.60 W/m-K

@Temperature 90.0 °C
11.1 BTU-in/hr-ft²-°F

@Temperature 194 °F
DIN 51936, ASTM E 1461-01
Schott Nextrema® 724-3 Glass Ceramic
The NEXTREMA® family of glass-ceramics combines the glossy appearance of glass with exceptional thermal, chemical, optical and mechanical properties such as:Very low coefficient of linear thermal..
Thermal Conductivity 1.60 W/m-K

@Temperature 90.0 °C
11.1 BTU-in/hr-ft²-°F

@Temperature 194 °F
DIN 51936, ASTM E 1461-01
Schott Nextrema® 724-5 Glass Ceramic
The NEXTREMA® family of glass-ceramics combines the glossy appearance of glass with exceptional thermal, chemical, optical and mechanical properties such as:Very low coefficient of linear thermal..
Thermal Conductivity 1.60 W/m-K

@Temperature 90.0 °C
11.1 BTU-in/hr-ft²-°F

@Temperature 194 °F
Schott ROBAX® Glass Ceramic
ROBAX® is a highly transparent glass-ceramic having virtually zero thermal expansion and sufficient mechanical resistance required for all standard applications. It is produced in flat, rolled s..
Thermal Conductivity 1.60 W/m-K
11.1 BTU-in/hr-ft²-°F
Shin-Etsu Silicones KE-3493 Silicone, RTV
Information Provided by Shin-Etsu Silicones of America, Inc.
Thermal Conductivity 1.60 W/m-K
11.1 BTU-in/hr-ft²-°F
transverse to ribbon
Ultracor® UCF-51-3/8-2.0 Honeycomb Core Material
Construction: ±45° XN50. Fiber: Carbon XN50. Ultracor® is a very low density honeycomb core material designed for use in highly weight-sensitive structures.  It is expected that it will be use..
Thermal Conductivity 1.60 W/m-K
11.1 BTU-in/hr-ft²-°F
Tra-Con Tra-Duct 2919 Room Temperature Conductive, Flexible Silver Epoxy Adhesive
TRA-DUCT 2919 is a non-bleeding, electrically conductive, silver-filled epoxy formulation recommended for electronic bonding, coating, and sealing applications that require high flexibility coupled ..
Thermal Conductivity 1.60 W/m-K
11.1 BTU-in/hr-ft²-°F
Epoxyset Epoxiohm EO-21M-5 Electrically Conductive Epoxy Adhesive
EO-21M-5 is an electrically conductive & thermally conductive, silver filled epoxy adhesive. This two component system is designed to be cured at room temperature or the cure can be accelerated by e..
Thermal Conductivity 1.60 W/m-K
11.1 BTU-in/hr-ft²-°F
China-Yixing Longly Refractories ASM-120 Cordierite-Mullite
Featured mullite, cordierite as the main raw material, the use of advanced production technology, professionally manufacturing the kiln furniture of ceramic and powder metallurgy with load bearing b..
Thermal Conductivity 1.60 W/m-K

@Temperature 100 °C
11.1 BTU-in/hr-ft²-°F

@Temperature 212 °F
CMT Materials PROTOBLOCK Air Permeable Prototype Tooling Material
PROTOBLOCK is a new composite material made of inorganic granules and epoxy resin engineered to form a micro-porous structure for use as prototype vacuum form or thermoform tooling. The material is..
Thermal Conductivity 1.60 W/m-K
11.1 BTU-in/hr-ft²-°F
Atom Adhesives AA-DUCT 2919 Epoxy Adhesive
AA-DUCT 2919 is a non-bleeding, electrically conductive, silver-filled epoxy formulation recommended for electronic bonding, coating, and sealing applications that require good flexibility coupled w..
Thermal Conductivity 1.60 W/m-K
11.1 BTU-in/hr-ft²-°F
Resinlab® SEC1222 Silver Filled Epoxy Adhesive
Resinlab™ SEC1222 is a silver filled, two component, room temperature curing epoxy adhesive. It is designed to cure completely at room temperature. SEC1222 provides excellent electrical conductivit..
Thermal Conductivity 1.60 W/m-K
11.1 BTU-in/hr-ft²-°F
Resinlab® SEC1233 Silver Filled Epoxy Adhesive
Resinlab™ SEC1233 is a silver filled, two component, room temperature curing epoxy adhesive. It is designed to cure completely at room temperature. SEC1233 provides excellent electrical conductivit..
Thermal Conductivity 1.60 W/m-K
11.1 BTU-in/hr-ft²-°F
CeramTec 547 Cordierite (2MgO-2Al2O3-5SiO2)
Te value is 670°C. Hasselman Thermal Shock value is 800 K.Data provided by CeramTec North America.
Thermal Conductivity 1.60 W/m-K
11.1 BTU-in/hr-ft²-°F
DIN EN 821-2 / ASTM-C408
CeramTec GRADE A LAVA Machinable Ceramic
GRADE A LAVA is a machineable ceramic that exhibits good electrical and heat resistance. It is excellent in applications where close tolerances must be held. This material is available in a variety ..
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