Processing Properties | Metric | English | Comments |
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Pot Life | 45 min | 45 min | |
NextGen Adhesives M907-11 Medical Grade Epoxy Adhesive Description: NGAC M907-11 is a medium viscosity adhesive system that is specifically formulated for medical device assembly applications.Advantages and Applications: Uses include laminating, bonding.. |
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Pot Life | 45 min | 45 min | |
NextGen Adhesives M907-19 Medical Grade Epoxy Adhesive Description: NGAC M907-19 is a medium viscosity and thixotropic adhesive system that is specifically formulated for medical device assembly applications.Advantages and Applications: Uses include lam.. |
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Pot Life | 45 min @Temperature 25.0 °C |
45 min @Temperature 77.0 °F |
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Parker Chomerics Tecknit® 72-00008 Silver-Filled Epoxy System Description: This commercial grade, conductive epoxy is designed for use in bonding applications where good conductivity is required. When mixed in a ratio of 1:1.4 by volume or weight, the two comp.. |
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Pot Life | 45 min @Temperature 25.0 °C |
45 min @Temperature 77.0 °F |
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Parker Chomerics Tecknit® 72-08116 Silver-Filled Epoxy System Description: This is a silver filled epoxy system designed for maximum performance and lowest volume resistivity. It is easily mixed 1:1 by volume or weight, from the two one-ounce jars. Its consist.. |
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Pot Life | 45 min | 45 min | Ambient |
Reltek BONDiT™ B-536 Adhesive System Key Properties: Very high strength bonding of dissimilar materials.High moisture and solvent resistance.Fast ambient cure with good pot life.Ease of use.Applications: Outstanding adhesive for very h.. |
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Pot Life | >= 45 min | >= 45 min | |
Abatron 2217 A/B Filled Potting Compound
(discontinued **) Gray versatile potting casting adhesive resurfacing compound. 2/1 variable ratio.Information provided by Abatron. |
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Pot Life | >= 45 min | >= 45 min | |
Abatron 85071 A/B Filled Potting Compound
(discontinued **) High grade self leveling buff coating resufacer casting and adhesive resin. 100/20 ratio.Information provided by Abatron. |
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Pot Life | 45 - 60 min | 45 - 60 min | |
Aremco Aremco-Bond™ 597 Conductive Epoxy Adhesive
(discontinued **) Electrically and thermally conductive, silver-filled, one-part paste. Inorganic system for adhesive (597A) & coating (597C) applications to 1200 ºF (650 °C). |
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Pot Life | 45 min | 45 min | |
Huntsman HY 2963 Cycloaliphatic Amine Approx. H+ equivalent weight 85. Mix Ratio with GY 6010 is 45.Comments/Applications: Phenol-free version of HY 2964. Mortar and floor repair, sewage treatment plants, commercial and industrial fl.. |
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Pot Life | 45 - 75 min | 45 - 75 min | 100 gram batch |
Master Bond EP42HT-2Med Epoxy Meets USP Class VI Requirements Description: Master Bond Polymer System EP42HT-2Med is a room temperature curable two component epoxy, adhesive, sealant, coating and casting material featuring high temperature resistance along wit.. |
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Pot Life | 45 - 60 min | 45 - 60 min | 100 gram batch |
Master Bond EP77M-1 Fast Setting, Silver Conductive Epoxy Description: Master Bond Polymer System EP77M-1 is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or.. |
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Pot Life | 45 min | 45 min | 25 grams |
Tra-Con Tra-Bond 526H02 Information provided by Tra-Con Inc. |
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Pot Life | 45 min | 45 min | |
Tra-Con Tra-Bond FDA2 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-2 is a medium viscosity epoxy resin system specifically developed for medical device applications. It has been tested in accordance with USP biological reactivity tests, in vivo and rec.. |
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Pot Life | 45 min | 45 min | |
Tra-Con Tra-Bond FDA8 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-8 EPOXY ADHESIVE is a low viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food an.. |
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Pot Life | 45 min | 45 min | |
Tra-Con Tra-Bond FS482 Long Pot Life High Tg Fiber Optic Epoxy Adhesive TRA-BOND FS-482 is a dark blue, low viscosity epoxy adhesive developed for fiber-optic bonding and small volume potting of plastic or glass optical fibers, lenses and prisms, LED displays, and other.. |
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Pot Life | 45 - 60 min | 45 - 60 min | 200 gram batch |
Master Bond EP30LV Optically Clear, Low Viscosity Epoxy Adhesive Description: Master Bond Polymer System EP30LV is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or mo.. |
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Pot Life | 45 - 75 min | 45 - 75 min | 100 gram mass |
Master Bond EP30M4 Chemically Resistant Two Component Epoxy System Master Bond Polymer System EP30M4 is a two component epoxy system for high performance bonding, sealing and encapsulation. This system features a forgiving 100 to 60 mix ratio by weight. EP30M4 resi.. |
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Pot Life | 45 min | 45 min | |
Tra-Con Tra-Bond 2125 Rigid Syntactic Repair Adhesive TRA-BOND 2125 is a medium viscosity, low density syntactic foam epoxy formulation developed for industrial, electronic and aerospace honeycomb, fillet, edge-fill, contour repair, bonding and casting.. |
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Pot Life | 45 min | 45 min | |
Abatron AboCoat 8709-8/AboCure 50-12 Nickel-Filled Electrically Conductive Epoxy Compound AboCoat 8709-8/AboCure 50-12 is a versatile nickel-epoxy conductive coating. |
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Pot Life | <= 45 min | <= 45 min | |
Abatron AboTar 8607-1 Solventless Tar-Epoxy Compound AboTar 8607-1 is a 2-part tar-epoxy lower cost system for filling and leveling pot holes and grossly uneven flooring. It can be used neat or with sand or aggregates. Uses: Resurfacing concrete and .. |
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Pot Life | 45 min @Temperature 25.0 °C |
45 min @Temperature 77.0 °F |
500 g |
Abatron AboCast 8503-3/AboCure 8503-3 Colorless Epoxy AboCast 8503-3/AboCure 8503-3 is a general purpose, medium speed, colorless epoxy casting compound with low viscosity. It has a good balance of properties with a fairly fast hardening. Suggested Use.. |
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Pot Life | 45 - 60 min | 45 - 60 min | Mass: 100g; TM R050-19 |
Resinlab® EP1300 Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP1300 Black (Formerly Lab Product W092602) is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It has a pot life of about one hour and .. |
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Pot Life | 45 - 60 min | 45 - 60 min | Mass: 50g; TM R050-19 |
Resinlab® EP965SC-7 Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965SC-7 Black is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wett.. |
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Pot Life | 45 - 60 min | 45 - 60 min | Mass: 50g; TM R050-19 |
Resinlab® EP965SC-7 Clear Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965SC-7 Clear is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wett.. |
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Pot Life | 45 min | 45 min | Mass: 200g; TM R050-19 |
Resinlab® EP1190 Flame Retardant Epoxy Casting Resin Resinlab™ EP1190 is a medium viscosity, flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Laboratories Inc., (File# E186034, Proje.. |