Polymer Property : Cure Time = 72.0 hour Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Cure Time	1440 - 4320 min @Temperature 25.0 °C	24.0 - 72.0 hour @Temperature 77.0 °F
Resinlab® EP1121-4 Adhesive / Casting Resin Resinlab™ EP1121-4 is a highly filled, high viscosity black adhesive / casting resin designed for applications requiring a high degree of thermal conductivity, flexibility, and a low CTE. It gives ..
Cure Time	1440 - 4320 min @Temperature 25.0 °C	24.0 - 72.0 hour @Temperature 77.0 °F
NextGen Adhesives G907-27 Structural Adhesive Description: NGAC G907-27 is a medium viscosity polyamide adhesive system utilized extensively in industrial and structural applications.Advantages and Applications: The NGAC G907-27 provides excell..
Cure Time	2880 - 4320 min @Temperature 25.0 °C	48.0 - 72.0 hour @Temperature 77.0 °F	Complete Cure Cycle
Northstar Polymers MPP-D65A Polyether Base Polyurethane Resin MPP-D65A is a polyether base 2-component polyurethane resin casting system for molding and potting applications. It has a long pot-life and gradual curing pattern to provide easier handling for mol..
Cure Time	2880 - 4320 min @Temperature 25.0 °C	48.0 - 72.0 hour @Temperature 77.0 °F	Complete Cure Cycle
Northstar Polymers MPP-D80B Rigid Polyurethane MPP-D80B has a high load-bearing property at hardness 80 D Durometer. This material has a relatively slow curing pattern. Whereas many polyurethane formulations of this hardness cure very fast thus..
Cure Time	1440 - 4320 min @Temperature 25.0 °C	24.0 - 72.0 hour @Temperature 77.0 °F
Resinlab® EP750 Clear Unfilled Epoxy Structural Adhesive Resinlab™ EP750 Clear is a two part unfilled epoxy structural adhesive which ingredients are listed in the Code of Federal Regulations Title 21 175.105 (Adhesives) and 175.300 (Resinous and polymer..
Cure Time	2880 - 4320 min @Temperature 23.9 °C	48.0 - 72.0 hour @Temperature 75.0 °F
Master Bond EP21AOLV-1 Two Part, Room Temperature Curing Epoxy System Product Description: Master Bond Polymer Adhesive EP21AOLV-1 is a two component, thermally conductive, electrically isolating epoxy adhesive, sealant and coating. This versatile system will adhere t..
Cure Time	2880 - 4320 min @Temperature 23.9 °C	48.0 - 72.0 hour @Temperature 75.0 °F
Master Bond EP21NDFG Two component epoxy compound for high performance applications Product Description: Master Bond EP21NDFG is a two component, room temperature curing epoxy adhesive featuring outstanding physical properties, easy processing and a non-drip, paste-like consistency..
Cure Time	2880 - 4320 min @Temperature 23.9 °C	48.0 - 72.0 hour @Temperature 75.0 °F
Master Bond EP21NDLO Low Outgassing, Room Temperature Curing Two Component Epoxy Master Bond EP21ND-LO is a two component, room temperature curing epoxy system for bonding, sealing and coating featuring outstanding physical properties. EP21ND-LO has a convenient one to one mix r..
Cure Time	2880 - 4320 min @Temperature 23.9 °C	48.0 - 72.0 hour @Temperature 75.0 °F
Master Bond EP21SC-1 Two Component Epoxy Resin System Product Description: Master Bond Polymer System EP21SC-1 is a two component epoxy system featuring abrasion resistance. This high performance compound utilizes silicon carbide as a filler material a..
Cure Time	2880 - 4320 min @Temperature 23.9 °C	48.0 - 72.0 hour @Temperature 75.0 °F
Master Bond EP21TDC-2ND Two component, highly flexibilized, non-drip epoxy resin compound Product Description: Master Bond EP21TDC-2ND is a two component highly flexible epoxy resin system for high performance bonding, sealing and coating with a non-drip consistency. It has a forgiving o..
Cure Time	2880 - 4320 min @Temperature 23.9 °C	48.0 - 72.0 hour @Temperature 75.0 °F
Master Bond EP21TDCHT-LO Room Temperature Curing, Toughened Two Component Epoxy Master Bond Polymer Adhesive EP21TDCHT-LO is a two component epoxy adhesive formulated to cure at room temperature or more rapidly at elevated temperatures, with a very forgiving and convenient one ..
Cure Time	2880 - 4320 min @Temperature 23.9 °C	48.0 - 72.0 hour @Temperature 75.0 °F
Master Bond EP21TDCHTND Versatile, toughened two component epoxy for bonding, sealing and coating Product Description: Master Bond EP21TDCHTND is a two component epoxy adhesive, sealant and coating featuring high performance, versatility and exceptional user friendliness. It has a very forgiving..
Cure Time	2880 - 4320 min @Temperature 23.9 °C	48.0 - 72.0 hour @Temperature 75.0 °F
Master Bond EP33CLV Epoxy Resists Chemicals and High Temperatures Description: Master Bond EP33CLV is a two part, room temperature curing epoxy system used for bonding, sealing and coating featuring high temperature resistance, good dimensional stability and excel..
Cure Time	2880 - 4320 min @Temperature 23.9 °C	48.0 - 72.0 hour @Temperature 75.0 °F
Master Bond EP42HT-2Med Epoxy Meets USP Class VI Requirements Description: Master Bond Polymer System EP42HT-2Med is a room temperature curable two component epoxy, adhesive, sealant, coating and casting material featuring high temperature resistance along wit..
Cure Time	2880 - 4320 min @Temperature 23.9 °C	48.0 - 72.0 hour @Temperature 75.0 °F
Master Bond EP42HT-2ND-2Med Heat Resistant, Medical Grade Non-Drip Epoxy Master Bond Polymer System EP42HT-2ND2MED (Black) is a room temperature curable two component epoxy adhesive and sealant featuring high temperature resistance along with outstanding chemical resista..
Cure Time	2880 - 4320 min @Temperature 23.9 °C	48.0 - 72.0 hour @Temperature 75.0 °F
Master Bond MasterSil 153Med Silicone Paste for Medical Applications Description: Master Bond MasterSil 153Med is a two component silicone compound with a paste consistency for high performance bonding and sealing. It can be used for medical device applications as it..
Cure Time	2880 - 4320 min @Temperature 23.9 °C	48.0 - 72.0 hour @Temperature 75.0 °F
Master Bond EP21TPFL-1AO Two Part, Flexible, Lower Viscosity Epoxy Polysulfide System Product Description: Master Bond EP21TPFL-1AO is a two component, low viscosity epoxy polysulfide for high performance bonding, sealing, coating and casting offering thermal conductivity, electrical..
Cure Time	2880 - 4320 min @Temperature 23.9 °C	48.0 - 72.0 hour @Temperature 75.0 °F
Master Bond EP33ND Epoxy Paste Resists Harsh Chemicals Description: Master Bond EP33ND is a two part, room temperature curing epoxy system used for bonding, sealing and coating featuring high temperature resistance, good dimensional stability and very g..
Cure Time	1440 - 4320 min @Temperature 23.9 °C	24.0 - 72.0 hour @Temperature 75.0 °F
Master Bond EP34AO Epoxy Compound Withstands High Temperatures Description: Master Bond Polymer System EP34AO is a room temperature curing, two component epoxy compound for high temperature bonding and sealing applications especially where thermal conductivity ..
Cure Time	2880 - 4320 min @Temperature 23.9 °C	48.0 - 72.0 hour @Temperature 75.0 °F
Master Bond EP42-2LV Epoxy Resists Heat and Chemicals Description: Master Bond Polymer System EP42-2LV is a low viscosity room temperature curable two component epoxy, adhesive, sealant, coating and casting material featuring outstanding chemical resis..
Cure Time	2880 - 4320 min @Temperature 23.9 °C	48.0 - 72.0 hour @Temperature 75.0 °F
Master Bond EP42HT-2 Epoxy Adhesive Resists Sterilization Description: Master Bond Polymer System EP42HT-2 is a room temperature curable, two component epoxy adhesive, sealant, coating and casting material featuring high temperature resistance along with o..
Cure Time	2880 - 4320 min @Temperature 23.9 °C	48.0 - 72.0 hour @Temperature 75.0 °F
Master Bond Supreme 33CLV Two Component, Room Temperature Curing Toughened Epoxy Master Bond Polymer System Supreme 33CLV is a special, room temperature curing, toughened epoxy adhesive/sealant, featuring exceptionally high temperature resistance. This innovative system has outs..
Cure Time	1440 - 4320 min @Temperature 25.0 °C	24.0 - 72.0 hour @Temperature 77.0 °F
Tra-Con Tra-Bond 2143D Medium Viscosity Polyamide Epoxy Adhesive TRA-BOND 2143D is a medium viscosity adhesive recommended for industrial bonding and sealing applications where toughness, impact resistance, and superior mechanical properties are required. This tw..
Cure Time	1440 - 4320 min @Temperature 25.0 °C	24.0 - 72.0 hour @Temperature 77.0 °F
Resinlab® EP1200 Black Casting Resin Resinlab™ EP1200 Black is a highly filled, medium viscosity black casting resin designed for applications requiring a high degree of thermal conductivity, flexibility and a low CTE. It meets the re..
Cure Time	1440 - 4320 min @Temperature 25.0 °C	24.0 - 72.0 hour @Temperature 77.0 °F
Resinlab® EP1200LV Casting Resin Resinlab™ EP1200LV a low viscosity version of EP1200, a highly filled, medium viscosity black casting resin designed for applications requiring a high degree of thermal conductivity, flexibility an..
Cure Time	2880 - 4320 min @Temperature 23.9 °C	48.0 - 72.0 hour @Temperature 75.0 °F
Master Bond EP21TDC-2LO Two component, highly flexibilized epoxy resin compound Product Description: Master Bond Polymer System EP21TDC-2LO is a two component, highly flexible epoxy resin compound for high performance bonding, sealing, coating, and encapsulation. It is formulat..