Polymer Property : Volume Resistivity = 0.0030 ohm-cm Product List

Electrical Properties

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Electrical Properties	Metric	English	Comments
Volume Resistivity	0.0030 ohm-cm	0.0030 ohm-cm
Premix Thermoplastics PRESEAL 6070 Ag-Coated Glass Metal replacement is one of the fastest growing areas for conductive plastics. Plastics, with their lighter weight, good processability and optimal combination of mechanical properties have challeng..
Volume Resistivity	0.0030 ohm-cm	0.0030 ohm-cm
Premix Thermoplastics PRESEAL 6070 Ag-Coated Glass Highly conductive PRESEAL® thermoplastic elastomer compounds are injection-mouldable and extrudable plastics for EMI-gasket and -housing applications, among other uses. The material is an ideal cho..
Volume Resistivity	<= 0.0030 ohm-cm	<= 0.0030 ohm-cm	ISO Mil-G-835388
Premix Thermoplastics PRESEAL® TPE 6070 PRESEAL TPE 6070 is a thermoplastic elastomer based highly conductive compound intended primarily for EMI gasketing and grounding applications. Conductivity is achieved with a silver coated glass sp..
Volume Resistivity	<= 0.0030 ohm-cm	<= 0.0030 ohm-cm	ISO Mil-G-835388
Premix Thermoplastics PRESEAL® TPE 6071 PRESEAL TPE 6071 is a thermoplastic elastomer based highly conductive compound intended primarily for EMI gasketing and grounding applications. Conductivity is achieved with a silver coated glass sp..
Volume Resistivity	0.0030 ohm-cm	0.0030 ohm-cm	Chomerics MAT-1002
Parker Chomerics CHO-FORM 5526 EMI Shielding Material Description: A range of conductive particle technologies combined with thermoset and RTV silicone systems provide a material selection for most opportunities. Multiple filler grades balance material..
Volume Resistivity	0.0030 ohm-cm	0.0030 ohm-cm	Cured property; ASTM D257
Aptek 2313-PMF Hybrid Epoxy Adhesive Snap-cure, silver-filled; long pot-life/stable viscosity-excellent for robotics. Thermal shock resistant.Production-oriented, snap-cure technology for surface mount applications-allows cure during s..
Volume Resistivity	0.0030 ohm-cm	0.0030 ohm-cm	Initial; Chomerics MAT-1002
Parker Chomerics CHO-FORM 5531 EMI Shielding Material One component, moisture cure, form-in-place EMI gasketing material. This electrically conductive formulation contains silver-plated copper particles dispersed in a silicone elastomer. It is designed..
Volume Resistivity	0.0030 ohm-cm	0.0030 ohm-cm	Cured: 8 hours at 25°C
Resinlab® SEC1222 Silver Filled Epoxy Adhesive Resinlab™ SEC1222 is a silver filled, two component, room temperature curing epoxy adhesive. It is designed to cure completely at room temperature. SEC1222 provides excellent electrical conductivit..